| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 12/23/2009 | CN100572416C Thermosetting resin composition and use thereof |
| 12/17/2009 | WO2009150818A1 Flame-retardant adhesive composition and laminated film |
| 12/17/2009 | WO2009150059A1 Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 12/17/2009 | WO2009117729A3 Anti-bleed compounds, compositions and methods for use thereof |
| 12/17/2009 | US20090311827 Adhesive for electronic components, method and for manufacturing semiconductor chip laminate, and semiconductor device |
| 12/16/2009 | EP2133398A1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 12/16/2009 | EP1628363B1 Circuit member connecting structure and method of producing the same |
| 12/16/2009 | CN101606229A Dicing tape and semiconductor device manufacturing method |
| 12/16/2009 | CN101605860A Conductive adhesive composition, conductive adhesive sheet and conductive adhesive tape |
| 12/16/2009 | CN101602929A Percolation efficiency of the conductivity of electrically conductive adhesives |
| 12/16/2009 | CN101602926A Room temperature curing epoxy adhesive and preparation method thereof |
| 12/16/2009 | CN101602925A Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof |
| 12/16/2009 | CN100569886C Binder for electric insulating ceramic jacket and binding method of ceramic jacket |
| 12/16/2009 | CN100569885C Moisture-heat-proof epoxy adhesive |
| 12/16/2009 | CN100569884C Adhesive agent and preparation method and usage |
| 12/16/2009 | CN100569465C Manufacturing method of thin saw board (China fir) laminated board |
| 12/10/2009 | WO2009147997A1 Coverlay film |
| 12/10/2009 | US20090304956 Use of Polysulphide- Containing Two- Component Adhesives for the Production of Windows |
| 12/09/2009 | CN101600295A Anisotropic conducting film and circuit board using same |
| 12/09/2009 | CN101600294A Anisotropic conducting film and circuit board using same |
| 12/09/2009 | CN101598261A Abrasion resistant material featuring ceramic embedded in metal and preparation method thereof |
| 12/09/2009 | CN101597420A Highly heat-conductive epoxy resin composition |
| 12/09/2009 | CN100568410C Temperature pressure binding permanent magnet material and its preparing method |
| 12/08/2009 | CA2411895C Epoxy based reinforcing patches with improved adhesion to oily metal surfaces |
| 12/03/2009 | WO2009144135A1 Thermally conductive composite material comprising aluminum powder, process for producing the composite material and use of the composite material |
| 12/03/2009 | US20090294057 Curable epoxy resin-based adhesive compositions |
| 12/03/2009 | DE102008026266A1 Molded body from granules of olive stones and crosslinked adhesive comprising reactive adhesive made of two-component epoxy adhesive, two- or one-component-polyurethane-adhesive, useful as floor covering and soundproofing molded body |
| 12/02/2009 | EP2129207A1 Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition |
| 12/02/2009 | EP2128213A1 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them |
| 12/02/2009 | EP2128182A1 Heat hardened epoxy resin compound containing a catalyst with heteroatoms |
| 12/02/2009 | CN101594754A Method of making printed wiring board and electrically-conductive binder |
| 12/02/2009 | CN101591518A High temperature resistant epoxy adhesive modified by silsesquioxane for flexible copper clad laminate |
| 12/02/2009 | CN101591515A Pressure sensitive adhesive and manufacture method thereof |
| 12/02/2009 | CN101591466A Adhesive compound containing epoxy resin |
| 12/02/2009 | CN101591312A Glycidol ether containing cyclohexyl binary ether alcohol and preparation method thereof |
| 12/01/2009 | US7625977 low temperature performance for aerospace use; retains its good adhesive and impact strength values even with high amounts of filler; storage stability; epoxy resin, toughening rubber, blocked isocyanate-endcapped polytetramethylene glycol, and epoxy curing agent; galvaneal adhesion |
| 11/26/2009 | US20090288769 Surface-Promoted Cure of Cationically Curable Compositions Comprising Vinyl Ethers |
| 11/26/2009 | US20090288766 Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer |
| 11/25/2009 | EP2121861A1 Low temperature curing of toughened epoxy adhesives |
| 11/25/2009 | CN101589127A Toughened binder compositions for use in advance processes |
| 11/24/2009 | US7622524 For acrylic polymer beads that involves preparing core/shell acrylic polymer emulsion having uniform particle size with narrow particle diameter distribution in range of 0.2-0.5 mu m by emulsion polymerization based on seed polymerization and spray-drying to form beads; automobile coating |
| 11/24/2009 | CA2462454C High temperature epoxy adhesive films |
| 11/24/2009 | CA2399084C Epoxy resin composition |
| 11/24/2009 | CA2324353C Polymer composite comprising a hydroxy-functionalized polyether or polyester and an inorganic filler and method for preparing the same |
| 11/19/2009 | US20090286124 Membrane electrode assembly for fuel cell, method for making the same, and fuel cell system including the same |
| 11/19/2009 | DE102008023276A1 Verbinden von Rohren mit thermisch härtbaren Klebstoffen Connecting pipes with heat-curable adhesives |
| 11/18/2009 | CN101580686A Epoxide resin pouring sealant with low density and high impact resistance and preparation method thereof |
| 11/18/2009 | CN101580685A High-reliability fast curing underfill adhesive and preparation method thereof |
| 11/18/2009 | CN101580684A Low-temperature fast curing underfill adhesive and preparation method thereof |
| 11/18/2009 | CN101579827A Method for tooling large-diameter rubber-plastic sealing semi-finished product on vertical lathe |
| 11/11/2009 | EP2116583A1 Conductive adhesive composition, conductive adhesive sheet and conductive adhesive tape |
| 11/11/2009 | CN201343007Y Composite rear fender of freight truck |
| 11/11/2009 | CN101578346A High strength epoxy adhesive and use thereof |
| 11/11/2009 | CN101578345A Adhesive for electronic components |
| 11/11/2009 | CN101578344A Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them |
| 11/11/2009 | CN101578015A Connection structure for metal piece and plastic piece and preparation method and electronic device shell |
| 11/11/2009 | CN101578010A Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate |
| 11/11/2009 | CN101575489A White adhesive for flexible printed circuit and preparation method thereof |
| 11/11/2009 | CN101575488A Surface mount adhesive, mounting structure including the same, and method for producing mounting structure |
| 11/10/2009 | US7615595 blends comprising epoxy resin modified with an acrylonitrile-butadiene rubber, an endcapped polyester; impact peel strength, corrosion resistance; high viscosity at low shear strains, the epoxy adhesive composition has a high wash-off resistance without being prehardened; for bonding parts of a vehicle |
| 11/10/2009 | US7615584 Method of preparation of a water based epoxy curing agent |
| 10/29/2009 | WO2009131405A2 Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device |
| 10/29/2009 | WO2009131101A1 Conductive resin composition |
| 10/29/2009 | DE102008020441A1 Klebstoff Adhesive |
| 10/28/2009 | CN101568612A Thermally B-stageable composition for rapid electronic device assembly |
| 10/28/2009 | CN101564929A Method for preparing low-shrinkage-factor copper clad laminate by applying nano-stuffing |
| 10/28/2009 | CN100554359C Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 10/28/2009 | CN100553909C Producing method of spruce laminated layer materials |
| 10/27/2009 | US7608323 Protective articles |
| 10/22/2009 | WO2009127699A1 Polyurethane polymer based on an amphiphilic block copolymer and its use as impact modifier |
| 10/22/2009 | WO2009127343A1 Adhesive formulation and process for the treatment of reinforcing inserts |
| 10/22/2009 | US20090261298 High-speed curable two-part liquid epoxy resin adhesivescomprising a microcapsulated hardener for comprising an amineadduct of a epoxy resin and a covering or shell of an epoxyresin having infrared-sensitve binding groups; storage stability; sovent resistance; high adhesiveness; dispersibility |
| 10/22/2009 | US20090260761 Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks |
| 10/22/2009 | US20090260758 Method for bonding a first component to a second component |
| 10/22/2009 | DE102008019196A1 Zweikomponentenstrukturklebstoff für die Klebung von Seltenerddauermagneten Two-component structural adhesive for bonding Seltenerddauermagneten |
| 10/22/2009 | CA2721245A1 Adhesive formulation and also method for the treatment of reinforcing inserts |
| 10/21/2009 | EP2110421A1 Method for production of adhesive layer |
| 10/21/2009 | EP2110402A1 Adhesive formula and method for treating reinforcement inlays |
| 10/21/2009 | EP2110397A1 Polyurethane polymer based on amphiphilic block copolymers and its use as impact resistance modifier |
| 10/21/2009 | CN101563776A Lead frame fixing material, lead frame and semiconductor device |
| 10/21/2009 | CN101559667A Polyvinyl chloride plastic/rubber inking roller and preparation method thereof |
| 10/15/2009 | WO2009126862A1 One-part epoxy-based structural adhesive |
| 10/15/2009 | WO2009124709A1 Improvements in or relating to structural adhesives |
| 10/15/2009 | DE10228484B4 Elektrisch leitfähige Paste, und Verwendung der Paste zur Herstellung eines Halbleiterprodukts An electrically conductive paste, and use of the paste for the manufacture of a semiconductor product, |
| 10/14/2009 | EP2108688A1 Adhesive for electronic components |
| 10/14/2009 | CN101555393A High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof |
| 10/14/2009 | CN101555310A Curing agent for low temperature cure applications |
| 10/14/2009 | CN100549118C Adhesive composition containing light-sensitive polymer and bonding tablet using the composition |
| 10/08/2009 | WO2009122671A1 Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device |
| 10/07/2009 | EP1448694B1 Curable organic resin composition |
| 10/07/2009 | CN101553545A Bonding method and adhesive resin composition |
| 10/07/2009 | CN101551058A Colorized conductive glass-fiber reinforced plastic grille and manufacturing method thereof |
| 10/07/2009 | CN101550325A Wind-power class bi-component epoxy adhesive and preparation method thereof |
| 10/07/2009 | CN101550324A Reversible dry adhesives |
| 10/07/2009 | CN101549517A Method for preparing corn stalk composite artificial plate |
| 09/30/2009 | EP2105485A1 Dual component compound with mixture control agents |
| 09/30/2009 | EP2104721A1 High strength epoxy adhesive and use thereof |
| 09/30/2009 | CN101547990A Pumpable epoxy paste adhesives resistant to wash-off |
| 09/30/2009 | CN101544879A Preparation method for high strength solventless epoxy adhesive |
| 09/30/2009 | CN101544064A Intelligent structure self-healing method and health monitoring system based on light repairing technology |