Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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01/26/2011 | CN101955630A Delay cured resin composition |
01/26/2011 | CN101250386B Adhesive for electrode connection and connecting method using it |
01/25/2011 | US7875344 improved adhesiveness and handleability in a wide temperature range around room temperature; acrylonitrile-butadiene rubber |
01/25/2011 | US7875210 Epoxy adhesive resin from bisphenol A unit, a bisphenol F unit, a diglycidyl ether unit and/or a novolac unit and an electrically-conductive organoaniline filler |
01/20/2011 | US20110014354 Adhesive compositions and methods for use in failure analysis |
01/20/2011 | US20110011533 Oxygen barrier compositions and related methods |
01/19/2011 | CN101952364A Microencapsulated silane coupling agent |
01/19/2011 | CN101948668A Halogen-free inflaming retarding adhesive for preparing flexible copper clad laminate (CCL) material and preparation method thereof |
01/19/2011 | CN101948667A Adhesive for compounding marble veneer with base material and preparation method thereof |
01/19/2011 | CN101948609A Black rubber and preparation method thereof |
01/19/2011 | CN101439537B Method for manufacturing degradable carrier for cultivating plants |
01/13/2011 | WO2011005925A1 Core/shell rubbers for use in electrical laminate compositions |
01/13/2011 | WO2011004706A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
01/13/2011 | WO2011004659A1 Film for semiconductor and semiconductor device manufacturing method |
01/13/2011 | US20110005797 Device housing and method for making device housing |
01/12/2011 | EP2038104B1 Assembly of prepregs for producing structures, for example ones which deploy through inflation |
01/12/2011 | CN101942287A Low-temperature electricity conducting glue and preparation method thereof |
01/12/2011 | CN101942285A Environment-friendly aqueous adhesive for electrochemical aluminum and preparation method thereof |
01/12/2011 | CN101942073A Curable resin composition for encapsulating optical semiconductor and cured product thereof |
01/12/2011 | CN101942072A Synthetic method of epoxy acrylate |
01/12/2011 | CN101654903B Pavement structure of cement concrete bridge deck |
01/12/2011 | CN101193975B Hardenable resin composition |
01/11/2011 | US7868435 semiconductor chip comprising a chip portion bonded to a reinforcing plate by a cured epoxy resin adhesive and hardening agent |
01/11/2011 | CA2539937C Adhesive compositions |
01/06/2011 | WO2011002137A1 Hydrocarbon adhesive composition and method for treating substrate surface using same |
01/06/2011 | WO2011001942A1 Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
01/06/2011 | WO2011001912A1 Energy ray-curable epoxy resin composition having excellent curing properties in deep portions |
01/06/2011 | WO2011001911A1 Energy ray-curable epoxy resin composition having excellent fast curing properties |
01/06/2011 | US20110001251 Adhesive composition, bonding member using the adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
01/05/2011 | EP2270112A2 Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device |
01/05/2011 | EP2268759A1 One-part epoxy-based structural adhesive |
01/05/2011 | EP2268752A1 Improvements in or relating to structural adhesives |
01/05/2011 | EP2268694A1 Polyurethane polymer based on an amphiphilic block copolymer and its use as impact modifier |
01/05/2011 | EP2268575A2 Silica and also epoxy resins |
01/05/2011 | DE102009027329A1 2-Komponenten Kaschierklebstoff 2-component adhesive backing |
01/05/2011 | CN201700114U Colloid heat transfer structure |
01/05/2011 | CN1618911B 粘合带 Adhesive tape |
01/05/2011 | CN101940080A Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article |
01/05/2011 | CN101939396A Adhesive composition for electronic components and adhesive sheet for electronic components using the same |
01/05/2011 | CN101937112A Polarization plate and laminated optical component using the same |
01/05/2011 | CN101935510A Epoxy resin conductive silver colloid with high adhesive strength |
01/05/2011 | CN101935502A Bonding structure and bonding method and disc driving device and manufacturing method thereof |
01/05/2011 | CN101935483A Low-temperature conductive ink and preparation method thereof |
01/05/2011 | CN101591312B Glycidol ether containing cyclohexyl binary ether alcohol and preparation method thereof |
12/29/2010 | WO2010150326A1 Holding pad |
12/29/2010 | CN101932668A Epoxy paste adhesives resistant to wash-off |
12/29/2010 | CN101932614A Method for preparing a hard film or coating from a cationically crosslinkable/polymerizable composition comprising an iodonium borate and giving off an acceptable odour |
12/29/2010 | CN101930991A Active driving organic electroluminescence device and preparation method thereof |
12/29/2010 | CN101928541A UV curable adhesive |
12/29/2010 | CN101928540A Epoxy conductive adhesive and preparation method thereof |
12/29/2010 | CN101928539A High-temperature resistant single-component epoxy structure glue, preparation method and using method thereof |
12/29/2010 | CN101928538A Polysulfone oligomer-containing thermosetting epoxy resin adhesive and preparation method thereof |
12/29/2010 | CN101928381A Photocurable resin composition and optical component using the same |
12/29/2010 | CN101519570B High-temperature resistant conducting glue for pantograph whole carbon sliding plate of electric high speed locomotive |
12/29/2010 | CN101465408B Substrate for flexible organic optoelectronic device and preparation method thereof |
12/23/2010 | WO2010147130A1 Aqueous adhesive agent composition |
12/23/2010 | CA2765452A1 Aqueous adhesive agent composition |
12/22/2010 | CN101925652A Wash-out resistant heat-curing epoxy resin adhesives |
12/22/2010 | CN101923243A Polymeric dispersed liquid crystal light shutter device |
12/22/2010 | CN101921571A High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
12/22/2010 | CN101921566A Structural adhesive for steel bonding |
12/22/2010 | CN101921557A Halogen-free flame-retardant adhesive composition and flexible copper-clad plate using same |
12/22/2010 | CN101921549A Self-adhesive thermosetting expanded adhesive tape and preparation method thereof |
12/16/2010 | WO2010143507A1 Insulating resin film, bonded body using insulating resin film, and method for manufacturing bonded body |
12/16/2010 | US20100317545 Latent hardener for epoxy compositions |
12/15/2010 | EP2261293A1 Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device |
12/15/2010 | EP2259868A1 Microcapsules having a radiation-induced or thermal release |
12/15/2010 | CN1995257B Weatherable water-permeable binder |
12/15/2010 | CN101914362A Two-component adhesive capable of being cured at room temperature and synthesis method thereof |
12/15/2010 | CN101914360A Low-temperature hot-seal adhesive and preparation method thereof |
12/15/2010 | CN101914359A Bar glue |
12/15/2010 | CN101914358A Epoxy viscose for manufacturing pipeline-crossing wear-resistant protective layer and preparation method thereof |
12/15/2010 | CN101914357A Epoxy-organic silicon polyimide adhesive and preparation method thereof |
12/15/2010 | CN101914348A Sealing adhesive and preparation method thereof |
12/15/2010 | CN101914265A Non-halogen phosphorus-containing flame retardant high-frequency epoxy resin composition and application thereof to bonding sheet and copper-clad plate |
12/09/2010 | WO2010140442A1 Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
12/08/2010 | CN1911984B Novel sulfurized phenolic resin and process for producing the same |
12/08/2010 | CN1853847B Method for repairing and reinforcing weld seam defects |
12/08/2010 | CN101911259A Dicing/die bonding film |
12/08/2010 | CN101910350A Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
12/08/2010 | CN101906284A UV-cured adhesive for plastic and preparation method thereof |
12/08/2010 | CN101906282A Epoxy resin structural adhesive and preparation method thereof |
12/08/2010 | CN101906281A High-temperature resistant structural adhesive and preparation method thereof |
12/08/2010 | CN101906280A Halogen-free epoxy adhesive for polyethylene terephthalate (PET) protective film or insulation layer and preparation method thereof |
12/08/2010 | CN101232128B Circuit connecting material, circuit member connecting structure, and method of producing the same |
12/08/2010 | CN101089110B Main component of adhesive for insulating film |
12/07/2010 | US7846547 acrylic acid-styrene copolymers; surface treated with trimethylolpropane-tri- beta -aziridinylpropionate; solvent-resistance, conduction reliability; for use in anisotropic conductive adhesive |
12/02/2010 | WO2010137445A1 Adhesive composition, adhesive sheet for connection of circuit member, and process for manufacture of semiconductor device |
12/02/2010 | WO2010137443A1 Adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device |
12/01/2010 | EP2257141A2 Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member |
12/01/2010 | EP1826000B1 Laminate film |
12/01/2010 | CN1685025B Hybrid plastisol/hot melt compositions |
12/01/2010 | CN101901652A Method for separating organic bonding porcelain bushing without damage |
12/01/2010 | CN101899194A Single-component epoxy resin composition |
12/01/2010 | CN101128502B Latent hardener for epoxy resin and epoxy resin composition |
12/01/2010 | CN101117552B Binding composition for cover film |
11/24/2010 | CN101896530A Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
11/24/2010 | CN101892027A Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same |
11/24/2010 | CN101892026A Isotropous conductive adhesive and preparation method thereof |
11/24/2010 | CN101892025A Brush-making structural adhesive and preparation method thereof |