| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 08/03/2011 | CN102140323A High adhesive force dipping-adhesive manufacturing process |
| 08/03/2011 | CN102140316A Conductive adhesive film and preparation method thereof |
| 08/03/2011 | CN101305049B Flame retardant prepregs and laminates for printed circuit boards |
| 08/03/2011 | CN101077964B Method for preparing polyether polylol |
| 07/28/2011 | WO2011090038A1 Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device |
| 07/28/2011 | WO2011059883A3 One-pack type liquid epoxy resin composition and adhesion method using same |
| 07/28/2011 | WO2011048022A3 Impact resistant two-component epoxy-based substance curing at room temperature |
| 07/27/2011 | EP2348081A1 Adhesive composition and optical member |
| 07/27/2011 | CN102137723A Method for gluing components in forming a temperature resistant adhesive layer |
| 07/27/2011 | CN102134469A hBN (Hexagonal Boron Nitride)containing insulating thermal grease |
| 07/27/2011 | CN102134459A Processing process of weft polyester shrunk adhesive band |
| 07/27/2011 | CN102134453A Heat resistant adhesive sheet used in the fabrication of substrateless semiconductor package |
| 07/27/2011 | CN102134452A Heat-resistant adhesive sheet for semiconductor device fabrication and adhesive used for the sheet |
| 07/27/2011 | CN101011829B Manufacturing method of fireproof bamboo material |
| 07/21/2011 | WO2011086680A1 Anisotropic electrically-conductive adhesive agent |
| 07/21/2011 | US20110177330 Flame-retardant adhesive composition and laminated film |
| 07/20/2011 | CN102131883A Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 07/20/2011 | CN102131882A Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 07/20/2011 | CN102127386A Photocuring and thermocuring conductive adhesive and preparation method |
| 07/20/2011 | CN102127385A Special adhesive for adhering sample for measuring adhesive force of paint film coating and preparation method thereof |
| 07/20/2011 | CN102127384A Impact and light decay-resistant die attach insulation paste and preparation method thereof |
| 07/20/2011 | CN102127383A High-temperature-resistance adhesive capable of curing at room temperature |
| 07/20/2011 | CN102127382A High-heat-conductivity epoxy resin electronic binding glue |
| 07/20/2011 | CN102127290A Epoxy resin composition and flexible copper-clad plate prepared from same |
| 07/20/2011 | CN102127289A Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same |
| 07/20/2011 | CN102127288A Flexible epoxy plastic package material |
| 07/20/2011 | CN101709208B Building structure adhesive with high impact and peeling strength |
| 07/20/2011 | CN101606229B Dicing tape and semiconductor device manufacturing method |
| 07/20/2011 | CN101437372B Article made of biodegradable resin and method of making the same |
| 07/20/2011 | CN101215450B Conductive adhesive added with short rod type nano silver powder and preparation method thereof |
| 07/20/2011 | CN101072678B Laminate film |
| 07/14/2011 | WO2011083835A1 Adhesive sheet and bonding method using same |
| 07/13/2011 | EP2342301A2 Reinforcement patches with unidirectionally-aligned fibers |
| 07/13/2011 | CN102124066A Insulating sheet and laminated structure |
| 07/13/2011 | CN102120927A Adhesive composition for semiconductor device and die attach film |
| 07/13/2011 | CN102120925A Modified epoxy resin of monocrystalline silicon rod cutting glue and preparation method thereof |
| 07/13/2011 | CN102120865A Epoxy-phenolic aldehyde amine composition and preparation method and application thereof |
| 07/07/2011 | WO2011081163A1 Polyester adhesive composition |
| 07/06/2011 | CN102119427A Conductive adhesive and LED substrate using the same |
| 07/06/2011 | CN102119201A One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 07/06/2011 | CN102115655A Single component flexible epoxy sealant |
| 07/06/2011 | CN102115654A Automobile hemming adhesive and preparation method thereof |
| 07/06/2011 | CN102115653A Binding agent composition, preparation method and application thereof |
| 07/06/2011 | CN101559667B Polyvinyl chloride plastic/rubber inking roller and preparation method thereof |
| 07/05/2011 | US7973403 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 06/30/2011 | US20110159307 Method for Gluing Two Plastic Surfaces Together |
| 06/30/2011 | US20110159284 Adhesive composition for semiconductor device and die attach film |
| 06/30/2011 | US20110155320 Silane/urea compound as a heat-activatable curing agent for epoxide resin compositions |
| 06/29/2011 | CN102112568A Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 06/29/2011 | CN102108277A Entropy alloy powder conductive adhesive and manufacturing method thereof |
| 06/29/2011 | CN102108276A Adhesive composition for a semiconductor device, and adhesive film prepared from the composition |
| 06/29/2011 | CN102108268A Environment-friendly halogen-free inflaming retarding adhesive tape and production process thereof |
| 06/29/2011 | CN102108264A Single-component epoxy structure adhesive tape and preparation method thereof |
| 06/29/2011 | CN101040025B Epoxy adhesive composition |
| 06/28/2011 | US7968196 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 06/28/2011 | US7967943 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 06/28/2011 | US7967796 Adhesive for injection needle, a method for bonding injection needle, a syringe front-assembly and a syringe |
| 06/23/2011 | WO2011073422A2 Crimping fold bond |
| 06/23/2011 | US20110152394 Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film |
| 06/22/2011 | EP2336262A1 Flange seam bonding |
| 06/22/2011 | EP2334747A2 Fast curing oil-uptaking epoxy-based structural adhesives |
| 06/22/2011 | CN102102002A Adhesive suitable for copper-clad laminate with high tracking index |
| 06/22/2011 | CN102102001A High thermal conductivity graphene-based epoxy resin adhesive and preparation method thereof |
| 06/22/2011 | CN102102000A Adhesive of medium glass transition temperature epoxy glass cloth-based copper-clad laminate suitable for lead-free process |
| 06/22/2011 | CN102101999A LED external sealant and preparation method thereof |
| 06/22/2011 | CN101490829B Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 06/16/2011 | WO2011071107A1 Photosensitive adhesive composition having adhesiveness even after photocuring reaction and after pattern formation |
| 06/16/2011 | WO2011070864A1 Resin composition for aqueous adhesive, aqueous adhesive, adhesive sheet, and method for producing composition for aqueous adhesive |
| 06/15/2011 | EP2331599A1 Photocurable composition |
| 06/15/2011 | CN102099417A Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 06/15/2011 | CN102093833A Method for preparing silver conductive adhesive by in situ synthesis |
| 06/15/2011 | CN102093832A High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| 06/15/2011 | CN102093806A Coating or encapsulating material mixed with radiating graphite powder |
| 06/15/2011 | CN102093737A Composition for copper foil-clad laminated sheet and copper foil-clad laminated sheet prepared from composition |
| 06/15/2011 | CN102093671A Epoxy resin composite and pouring method thereof |
| 06/15/2011 | CN102093667A Epoxy resin composite and covering film prepared from same |
| 06/15/2011 | CN101283017B High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 06/09/2011 | WO2011068747A1 Composition, tape, and use thereof |
| 06/09/2011 | WO2011068157A1 Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board, and multilayer flexible printed circuit board |
| 06/08/2011 | CN1950419B Cationically photopolymerizable composition |
| 06/08/2011 | CN1626578B Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate |
| 06/08/2011 | CN102089398A Anisotropic conductive adhesive |
| 06/08/2011 | CN102089377A Adhesive with a high resistance |
| 06/08/2011 | CN102086372A Radiation curing adhesive and preparation method thereof |
| 06/08/2011 | CN102086365A Adhesive, preparation method and application in integrated circuit board embedment thereof |
| 06/08/2011 | CN102086364A Conductive silver paste for microelectronic packaging and preparation method thereof |
| 06/08/2011 | CN102086363A Epoxy resin adhesive using modified multielement sulfur alcohol as solidifying agent and preparation method thereof |
| 06/08/2011 | CN102086362A Epoxy adhesive with high strength and high elasticity |
| 06/08/2011 | CN102086352A Reinforced rubber sheet suitable for construction on steel plate with oil surface at low temperature, and preparation method thereof |
| 06/08/2011 | CN101790278B Full photophobic copper-clad laminate and preparation method thereof |
| 06/08/2011 | CN101235263B Epoxy-polyurea adhesive and preparing method thereof |
| 06/03/2011 | WO2011065174A1 Single-component epoxy resin composition and use thereof |
| 06/02/2011 | US20110130518 Reactive liquid modifiers |
| 06/02/2011 | US20110130479 Adhesion promoter compounds for oiled steel |
| 06/02/2011 | US20110127667 Adhesive for connection of circuit member and semiconductor device using the same |
| 06/02/2011 | US20110126981 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 06/02/2011 | US20110126980 Two-part epoxy-based structural adhesives |
| 06/01/2011 | EP2327752A1 Tackifier composition |
| 06/01/2011 | CN102079958A Diamond-filled isotropical high-performance heat-conductive adhesive and preparation method thereof |
| 06/01/2011 | CN102079957A Low-temperature rapidly-curable surface mounting adhesive |