| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/19/2009 | WO2008112883A3 Die attachment method with a covex surface underfill |
| 03/18/2009 | EP1189994B1 Oil soluble radiation curable metal-containing compounds and compositions |
| 03/18/2009 | CN101389726A Protective sheet for coating film |
| 03/18/2009 | CN100469851C Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 03/17/2009 | US7504471 Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive |
| 03/12/2009 | WO2009031658A1 Adhesive composition |
| 03/12/2009 | US20090065143 Two-component epoxy adhesive composition |
| 03/12/2009 | DE102007041988A1 Flammhemmende Additive A flame-retardant additives |
| 03/10/2009 | US7501468 Adhesive composition |
| 03/05/2009 | WO2009028484A1 Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet |
| 03/05/2009 | WO2009028477A1 Saturated polyester resin composition and hot melt adhesive composition |
| 03/05/2009 | WO2009028241A1 Anisotropic electroconductive film, and process for producing connection structure using the same |
| 03/05/2009 | WO2009028170A1 Thermosetting resin composition and cured product thereof |
| 03/05/2009 | US20090056865 Adhesive and process for attaching and detaching articles |
| 03/04/2009 | EP2031426A1 Polarizing plate and method for producing the same |
| 03/03/2009 | US7498389 Curable; for fixing fibres, scrims, fabrics or composites, for reinforcing buildings, for example walls or ceilings or floors; or for fixing building components, such as panels or blocks made of stone, glass or plastics; after curing, large tolerance range for temperatures; high bond stress value |
| 02/26/2009 | WO2009025991A1 Two part crash durable epoxy adhesives |
| 02/25/2009 | CN101372608A Epoxy resin encapsulation adhesive and use thereof |
| 02/24/2009 | CA2313326C Curable resin compositions |
| 02/19/2009 | WO2009022574A1 Adhesive and bonded body |
| 02/19/2009 | US20090048370 Two part crash durable epoxy adhesives |
| 02/18/2009 | EP2024195A2 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 02/18/2009 | CN101370887A Adhesive tape |
| 02/18/2009 | CN101368078A Adhesive for bonding and mending cork wood and formulation method thereof |
| 02/18/2009 | CN101368077A Epoxy resin adhesive liquid |
| 02/18/2009 | CN101368075A Electrical insulation compound adhesive for high voltage electrical apparatus |
| 02/18/2009 | CN100463115C Adhesive bonding sheet, semiconductor device using same, and method for manufacturing the semiconductor device |
| 02/17/2009 | US7491789 Molding materials, adhesives, adhesive films or anisotropic conductive films; high adhesion in liquid crystal displays, in semiconductor mounting materials, and to gold surfaces; improved crack and peel resistances; bis-(substituted-hydroxyphenylalkylthioalkyl)disulfides |
| 02/17/2009 | US7491290 Comprising first curing agent, formed by silane coupling agent and electrically conductive particles mixed with epoxy resin to produce first adhesive material, second curing agent, formed of metal chelate or metal alcoholate and electrically conductive particles mixed with second epoxy resin |
| 02/12/2009 | US20090042013 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 02/12/2009 | US20090039208 Method for manufacturing a reinforced shell for forming component parts for aircraft and shell for component parts for aircraft |
| 02/11/2009 | EP1671813B1 Pneumatic radial tire |
| 02/11/2009 | CN101362926A Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method |
| 02/10/2009 | US7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 02/05/2009 | WO2009017253A1 Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device |
| 02/05/2009 | WO2009017200A1 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material |
| 02/04/2009 | CN101358121A Preparation method of high temperature resistant epoxy adhesive capable of room temperature curing |
| 02/04/2009 | CN101358052A Polymer binder for water-scraped without set-off intaglio ink composition |
| 02/03/2009 | CA2344718C High strength epoxy adhesive and uses thereof |
| 01/28/2009 | CN101353565A Non-drying stuffing sealant |
| 01/28/2009 | CN100455668C Enzyme-catalyzed polyamides and compositions and processes of preparing and using same |
| 01/27/2009 | US7482201 Nanoparticle filled underfill |
| 01/22/2009 | WO2009011421A1 Detachable adhesive containing reaction product of oxidizing agent and amine compound |
| 01/22/2009 | WO2009011383A1 Adhesive for electronic component |
| 01/21/2009 | CN101348701A Optical light color low stress modified epoxy adhesive and preparation of |
| 01/21/2009 | CN101348700A Adhesion agent, printing film containing the adhesion agent and use of the adhesion agent in direct transfer printing on glass, ceramic and metallic product surface |
| 01/21/2009 | CN101348696A Adhesion composition, making method of adhesion composition, display device and making method of display device |
| 01/15/2009 | WO2008144703A3 Pressure sensitive adhesives made from renewable resources and related methods |
| 01/14/2009 | EP2014737A1 Two part epoxide adhesive with improved strength |
| 01/14/2009 | EP2014735A2 Polymer anisotropic electroconductive gluing material and a gluing method |
| 01/14/2009 | CN101343524A Bi-component bisphenol A type epoxy resin structured fluid sealant and preparation thereof |
| 01/14/2009 | CN101343523A Adhesive, reflecting film, pad pasting glass or slice brick containing the adhesive |
| 01/14/2009 | CN101343514A Adhesive gum special for sheet metal and preparation thereof |
| 01/14/2009 | CN100451085C Epoxy binder in monocomponent in use for insulation of electrical motor |
| 01/08/2009 | WO2009005130A1 Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these |
| 01/08/2009 | US20090010021 Recreational apparatus and method of making the same |
| 01/07/2009 | EP2011844A1 Adhesive tape, semiconductor package, and electronic device |
| 01/07/2009 | EP1483304B1 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 01/07/2009 | CN101341225A Composite material, especially multilayer material, and adhesive or bonding material |
| 01/07/2009 | CN101338173A Single-component anaerobic structure glue and method for preparing same |
| 01/07/2009 | CN100449776C Interlayer dielectric and pre-applied die attach adhesive materials |
| 01/06/2009 | US7473472 Sulfur-crosslinkable, non-aqueous; does not require any activation treatment, such as intermediate drying, at the time of use; to provide bonding which is both mechanically effective; polyvinylpyridine-styrene-butadiene elastomer, polyester or vinyl ester resin |
| 12/31/2008 | WO2009001773A1 Bonded structure or sealed structure, and bonding method or sealing method and electronic part utilizing the structure |
| 12/31/2008 | WO2009001492A1 Adhesive film and semiconductor device obtained with the same |
| 12/31/2008 | CN100447217C Bi-component acrylic ester structure adhesive and preparation method thereof |
| 12/25/2008 | US20080314516 Method for manufacturing lightweight composite fairing bar |
| 12/24/2008 | WO2008157129A1 Toughened adhesive material |
| 12/24/2008 | CN201169737Y Water seepage runway |
| 12/24/2008 | CN101328274A Sticking method of crystalloid resin forming body |
| 12/24/2008 | CN100446359C Laser module |
| 12/23/2008 | US7467742 Electrically conducting adhesives for via fill applications |
| 12/18/2008 | WO2008153208A1 Resin composition for interlayer insulation of multilayer printed wiring board |
| 12/18/2008 | WO2008153076A1 Optical adhesive for substrate bonding and optical adhesive cured body for substrate bonding |
| 12/18/2008 | WO2008152956A1 Photocurable pressure-sensitive adhesive composition |
| 12/18/2008 | WO2008152834A1 Curable composition and optical device made with the same |
| 12/18/2008 | WO2008152833A1 Curable composition and optical device |
| 12/18/2008 | DE20023994U1 UV-härtbare Zusammensetzungen UV-curable compositions |
| 12/17/2008 | CN101323773A High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof |
| 12/17/2008 | CN101323772A Ultra-thin stone and aluminum honeycomb composite modified epoxy adhesive and preparation thereof |
| 12/17/2008 | CN101323769A Resin paste for die bonding |
| 12/17/2008 | CN101323766A Solid adhesive |
| 12/16/2008 | CA2391005C Creping adhesives |
| 12/11/2008 | WO2008149837A1 Flame-retardant adhesive resin composition and adhesive film formed from the same |
| 12/11/2008 | WO2008149727A1 Flame-retardant adhesive resin composition, and adhesive film utilizing the same |
| 12/11/2008 | WO2008149625A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
| 12/11/2008 | US20080302478 Adhesive agent and inkjet head and manufacturing method thereof |
| 12/10/2008 | CN100441607C Method for preparing latent hardener |
| 12/04/2008 | WO2008146936A1 Photosensitive adhesive resin composition, adhesive film and light-receiving device |
| 12/04/2008 | WO2008146833A1 Steel product composite and process for producing the steel product composite |
| 12/03/2008 | CN101314706A Preparation of solidification type dead burning structure glue in low-temperature and humidity surroundings |
| 12/03/2008 | CN101314705A Fire retardant adhesive composition and covering layer film using the same |
| 12/03/2008 | CN101314704A Two-component epoxy resin adhesive for stone skin patching and preparation thereof |
| 12/03/2008 | CN100439465C Non-conducting adhesion material composition |
| 12/03/2008 | CN100439464C Butt-nail glue |
| 11/27/2008 | WO2008144703A2 Pressure sensitive adhesives made from renewable resources and related methods |
| 11/27/2008 | WO2008143253A1 Adhesive composition and adhesive film using the same |
| 11/27/2008 | WO2008143247A1 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 11/27/2008 | US20080291027 Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric Circuit |
| 11/27/2008 | US20080289755 Bonded Fuel Cell Assembly and Methods and Systems for Producing the Same |
| 11/27/2008 | DE102008019358A1 Object i.e. gecko feet pad, moving product for use by layer thermo-reversible dry adhesive, has thermo-reversible dry adhesive including shape memory polymer layer and dry adhesive layer underlying shape memory polymer layer |