| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
|---|
| 11/27/2008 | CA2687286A1 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 11/26/2008 | CN101313045A Anisotropic conductive adhesive compositions |
| 11/25/2008 | US7456230 Cationically photocurable epoxy resin compositions |
| 11/19/2008 | EP1992671A1 Thermosetting encapsulation adhesive sheet |
| 11/19/2008 | CN101309992A Mercaptan-hardened epoxy polymer compositions and processes for making and using same |
| 11/19/2008 | CN101307838A Induction type ceramic tap |
| 11/19/2008 | CN101307221A Thermosetting encapsulation adhesive sheet |
| 11/19/2008 | CN101307216A Epoxy resin adhesive adhesive for adhering fluororubber with metal and method for preparing same |
| 11/19/2008 | CN100434490C Process for preparing adhesive of damping steel plate |
| 11/18/2008 | CA2375512C Oil soluble metal-containing compounds, compositions and methods |
| 11/13/2008 | WO2008135540A1 Epoxy-resin adhesive and method for bonding using such an epoxy resin adhesive |
| 11/12/2008 | EP1990394A1 Epoxy-resin adhesive and method for bonding using such an epoxy resin adhesive |
| 11/12/2008 | EP1990390A1 Protective sheet for coating film |
| 11/12/2008 | CN101305049A Flame retardant prepregs and laminates for printed circuit boards |
| 11/12/2008 | CN101302414A Adhesive and preparation of sheet tile containing same |
| 11/12/2008 | CN101302413A High temperature resistant epoxide resin conductive adhesive |
| 11/12/2008 | CN101301806A Film sticking apparatus and manufacturing method of polaroid sheet |
| 11/12/2008 | CN100432143C Thermoset resin compsns. and its mfg. method |
| 11/06/2008 | WO2008133472A1 Adhesive resin composition and dicing die bonding film using the same |
| 11/06/2008 | WO2008133296A1 Stainless steel complex and its manufacturing method |
| 11/06/2008 | WO2008133293A1 Adhesive sheet |
| 11/06/2008 | WO2008133096A1 Magnesium alloy compound material, and its manufacturing method |
| 11/06/2008 | WO2008133030A1 Titanium alloy compound material, and its jointing method |
| 11/05/2008 | EP1532220B1 Curable adhesive articles having topographical features therein |
| 11/05/2008 | CN101298548A Epoxy modified polyurethane cryogenic adhesive |
| 11/05/2008 | CN101298545A Heat resisting anti-aging adhesive for construction |
| 11/05/2008 | CN100430451C Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 11/04/2008 | US7446137 Thermosetting resin and thiocyanato-containing organohydrocarbonoxysilane |
| 10/30/2008 | WO2008131222A1 Climbing devices based on thermo-reversible dry adhesives |
| 10/30/2008 | WO2008131204A1 Method for robotic handling using thermo-reversible dry adhesives |
| 10/30/2008 | WO2008129590A1 Adhesive film for semiconductor and semiconductor device made with the same |
| 10/30/2008 | WO2008077140A3 Hydrolytically resistant thermoset monomers |
| 10/30/2008 | DE102006046518B4 Verfahren zum Beschichten eines Substrates A method for coating a substrate |
| 10/29/2008 | EP1840166B1 Curable composition |
| 10/29/2008 | CN201141827Y Corrosion monitoring sensor in gas pipe line |
| 10/29/2008 | CN101297011A Concurrently curable hybrid adhesive composition |
| 10/29/2008 | CN101296561A Flexible printing patchboard and sliding lid type mobile phone terminal using the same |
| 10/29/2008 | CN101293960A Polyamine composition |
| 10/23/2008 | WO2008128209A1 Polyfunctional epoxy oligomers |
| 10/23/2008 | WO2008127925A2 Structural epoxy resins containing core-shell rubbers |
| 10/23/2008 | WO2008127923A2 Heat-resistant structural epoxy resins |
| 10/23/2008 | WO2008126812A1 Copper alloy composite and process for producing the same |
| 10/23/2008 | US20080260982 Sheet to Form a Protective Shield for Chips |
| 10/23/2008 | US20080257493 Acrylate resins with the dimethanocyclopenta naphthalene in the backbone; reducing cure-induced shrinkage; semiconductor packages and microelectronic devices |
| 10/23/2008 | DE102007018414A1 Parkettfugenkittsystem und Verfahren zur Herstellung eines Parkettfugenkitts Parquet joint cement and method for producing a parquet joint cement |
| 10/23/2008 | DE102005052025B4 Haftmittelformulierung, Verfahren zur Herstellung sowie dessen Verwendung Adhesive formulation, process for the preparation and use thereof |
| 10/22/2008 | EP1983037A1 Thermosetting resin and sealing system for reinforced concrete surfaces with a thermosetting resin |
| 10/22/2008 | EP1983014A2 Parquet joint kit system and method for manufacturing a parquet joint kit system |
| 10/22/2008 | CN101290950A Back film of solar cell and preparing technique thereof |
| 10/22/2008 | CN101289600A High molecule multifunction emulsion powder |
| 10/22/2008 | CN101288930A Manufacturing method of 3C frame |
| 10/22/2008 | CN100427560C Flexible circuit base material adhesive, preparing method and produced base material |
| 10/16/2008 | WO2008123474A1 Novel thermoplastic polyhydroxy polyether resin and resin composition containing the same |
| 10/16/2008 | WO2008123110A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 10/16/2008 | US20080251757 Latent Hardener For Epoxy Resin and Epoxy Resin Composition |
| 10/16/2008 | US20080251203 Structural Epoxy Resins Containing Core-Shell Rubbers |
| 10/16/2008 | US20080251201 Adhesive Tape For Structural Bonding |
| 10/15/2008 | EP1980565A1 Oil soluble radiation curable metal-containing compounds and compositions |
| 10/15/2008 | CN101284979A Water-proofing material for adhesive joint between solid objects |
| 10/14/2008 | CA2408922C Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 10/09/2008 | WO2008091386A3 Biomimetic modular adhesive complex: material, methods and applications therefore |
| 10/09/2008 | DE102007016950A1 Thermisch vernetzende Polyacrylate und Verfahren zu deren Herstellung Thermally crosslinking polyacrylates and processes for their preparation |
| 10/09/2008 | DE102005018671B4 Schlagzähe Epoxidharz-Zusammensetzungen Impact-resistant epoxy resin compositions |
| 10/08/2008 | EP1976901A2 Use of polysulfide-containing two-component adhesives for the production of windows |
| 10/08/2008 | EP1270636B1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding |
| 10/08/2008 | CN101283017A High-stability microencapsulated hardener for epoxy resin and epoxy resin composition |
| 10/02/2008 | WO2008117489A1 Adhesive film for producing semiconductor device |
| 10/02/2008 | US20080241995 Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet |
| 10/02/2008 | US20080241529 Flameproofed adhesive and sealing materials |
| 10/02/2008 | US20080237617 Adhesive Sheet for Light-Emitting Diode Device and Light-Emitting Diode Device |
| 10/02/2008 | DE102007015261A1 Reactive mass for substrate application, preferably for the generation of a glop-top, comprises a thermally initiable matrix forming material and an energy absorbing initiator, where the initiator is soluble in the reactive mass |
| 10/02/2008 | DE102007015083A1 Flammgeschützte Klebe- und Dichtmassen Flame-retardant adhesive and sealing materials |
| 10/01/2008 | CN101278027A Anisotropic conductive adhesive |
| 10/01/2008 | CN101275062A Adhesive composition, adhesive sheet and production process for semiconductor device |
| 10/01/2008 | CN100422281C Epoxy resin adhesive for use in water |
| 10/01/2008 | CN100422235C Electric insulated resin pulp used for chip carrying and packaging |
| 09/30/2008 | US7429419 Heat activatable adhesive tape for bonding electronic components and conductor tracks |
| 09/25/2008 | WO2008114764A1 Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition |
| 09/25/2008 | WO2008114696A1 Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them |
| 09/25/2008 | WO2008113845A1 Epoxy group-terminated polymers, the compositions thereof and the use thereof as impact resistance modifiers |
| 09/24/2008 | EP1972646A1 Time-phased epoxy group polymers, their compositions and their utilisation as impact resistance modifiers |
| 09/18/2008 | WO2008111584A1 Photocurable adhesive agent, polarizing plate using the photocurable adhesive agent, method for production of the polarizing plate, optical member, and liquid crystal display device |
| 09/18/2008 | WO2008111489A1 Fire-retardant adhesive resin composition, and adhesive film using the same |
| 09/17/2008 | CN101268163A Bonding agent composition, bonding agent tablet using same and its uses |
| 09/17/2008 | CN101265400A Room temperature controllable curing building adhesive and preparation method thereof |
| 09/17/2008 | CN101265399A Epoxy adhesive used under low temperature |
| 09/17/2008 | CN100419036C Water-resistant adhesive composition for wood |
| 09/16/2008 | US7425598 Adhesive of epoxy resin and curing agent with xylylene diamine structure |
| 09/12/2008 | WO2008108119A1 Dicing/die bonding film |
| 09/11/2008 | DE102007010540A1 Adhering components from same or different metals useful in the automotive-, aircraft- and engineering- and related industries, comprises coating adhesive surfaces of the components to be joined with an adhesive for actual adhesion process |
| 09/10/2008 | CN101260285A Hot curing isotropy conducting adhesive and preparation method thereof |
| 09/10/2008 | CN101260223A Thermosetting die bonding film |
| 09/10/2008 | CN101259627A Manufacturing method of thin saw board (China fir) laminated board |
| 09/04/2008 | WO2008105563A1 Flame-retardant adhesive resin composition and flexible printed board material using the same |
| 09/04/2008 | WO2008105200A1 Flame retardant adhesive composition, flexible copper-clad laminates and cover lay films |
| 09/03/2008 | EP1963455A1 Composite material, especially multilayer material, and adhesive or bonding material |
| 09/03/2008 | EP1769041B1 Method for treating and sticking work pieces made of metal or a metal alloy comprising a hydrated oxide and/or hydroxide layer |
| 09/03/2008 | CN101255326A Single-component reaction type hot melt adhesives and steel plate composite material using the same |
| 09/03/2008 | CN101255325A Synthesis technique of dual-component wet and heat ageing resistant epoxy building structure strengthening adhesive |
| 08/28/2008 | WO2008102550A1 Curable resin composition for sealing liquid crystal, and method for production of liquid crystal display panel using the same |