| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
|---|
| 09/29/2009 | CA2388300C Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 09/24/2009 | WO2009114935A1 Uv cured high alpha linolenic acid linseed oil epoxy |
| 09/24/2009 | US20090239069 Laminate film |
| 09/23/2009 | CN101538453A Radiation settability composition for adhesive, polarizing film and manufacturing method thereof |
| 09/17/2009 | WO2009113537A1 Adhesive composition for optical member, adhesive layer for optical member, adhesive optical member, transparent conductive laminate, touch panel, and image display device |
| 09/17/2009 | WO2009112442A1 Microcapsules having a radiation-induced or thermal release |
| 09/17/2009 | US20090230568 Adhesive Film for Semiconductor and Semiconductor Device Therewith |
| 09/17/2009 | US20090229744 Method of attaching printhead integrated circuits to an ink manifold using adhesive film |
| 09/16/2009 | CN101531882A Acid resistant and high-temperature resistant binding agent and preparation method thereof |
| 09/16/2009 | CN101531874A Fast-drying, low-temperature type environmental-protection epoxy resin bicomponent dry coating and preparation method thereof |
| 09/16/2009 | CN100540301C Multilayered assembly containing curable adhesive |
| 09/11/2009 | WO2009109442A2 Silica and also epoxy resins |
| 09/10/2009 | DE102008000499A1 Kieselsäure sowie Epoxidharze Silica and epoxy resins |
| 09/09/2009 | CN101528007A Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof |
| 09/09/2009 | CN101525467A Epoxy/organosilicon hybrid material, and preparation method and application thereof |
| 09/09/2009 | CN101525466A Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof |
| 09/09/2009 | CN101525439A Modified epoxide resin for structural adhesive of wind generating blades and preparation method thereof |
| 09/08/2009 | US7584774 Pneumatic radial tire with polyethylene terephthalate cord belt reinforcing layer |
| 09/03/2009 | US20090220783 Adhesive Sheet for Dicing and Die Bonding |
| 09/02/2009 | EP2096671A1 Adhesive tape and semiconductor device using the same |
| 09/02/2009 | EP2094804A1 Thermally b-stageable composition for rapid electronic device assembly |
| 09/02/2009 | CN101519570A High-temperature resistant conducting glue for pantograph whole carbon sliding plate of electric high speed locomotive |
| 09/02/2009 | CN101519569A Method of minimizing residue adhesion for thermo-reversible dry adhesives |
| 08/27/2009 | WO2009104312A1 Microencapsulated silane coupling agent |
| 08/27/2009 | US20090215964 Curable adhesive compositions containing reactive multi-functional acrylate |
| 08/26/2009 | EP2092018A1 Low odor, fast cure, toughened epoxy adhesive |
| 08/26/2009 | CN101517029A Curable epoxy resin-based adhesive compositions |
| 08/26/2009 | CN101516941A Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 08/26/2009 | CN100532489C Adhesion agent for moist dimension stone |
| 08/25/2009 | US7578891 Optics; radiation transparent |
| 08/20/2009 | US20090209919 Adhesive For Injection Needle, A Method For Bonding Injection Needle, A Syringe Front-Assembly And A Syringe |
| 08/19/2009 | EP2090633A1 Dicing Die-Bonding Film |
| 08/19/2009 | CN101508878A Bonder and method of preparing the same |
| 08/19/2009 | CN101508877A Interface adhesive and method of preparing the same |
| 08/19/2009 | CN100529005C Epoxy resin adhesive used for repairing pipe |
| 08/19/2009 | CN100529004C Single-component silver filled conductive glue capable of being stored and transported at normal temperature |
| 08/18/2009 | US7575653 Melt-flowable materials and method of sealing surfaces |
| 08/12/2009 | CN101503608A Phenolic epoxy resin system conductive adhesive and preparation thereof |
| 08/12/2009 | CN101503607A High strength glass fibre reinforced plastic adhesive and preparation |
| 08/12/2009 | CN101503606A Adhesive for imperial crown cap polyolefin pad for beer or beverage and preparation thereof |
| 08/06/2009 | WO2009095484A1 Wash-out resistant heat-curing epoxy resin adhesives |
| 08/06/2009 | DE102008007749A1 Thermisch aktivier- und härtbare Klebefolie insbesondere für die Verklebung von elektronischen Bauteilen und flexiblen gedruckten Leiterbahnen Thermally activatable and hardenable adhesive film particularly for bonding electronic components and flexible printed conductor tracks |
| 08/05/2009 | EP2085426A1 Wash-resistant thermo hardening epoxy resin adhesives |
| 08/05/2009 | EP2084241A2 Toughened binder compositions for use in advance processes |
| 08/05/2009 | EP2084204A1 Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer |
| 08/05/2009 | EP2084203A1 Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
| 08/05/2009 | EP2084199A1 Blocked polyurethane prepolymers and heat-curable epoxy resin compositions |
| 08/05/2009 | CN101501154A Adhesive tape, joint structure, and semiconductor package |
| 08/05/2009 | CN101497778A Preparation of epoxy resin modified soy protein adhesive |
| 08/05/2009 | CN101497774A Semiconductor chip liquid encapsulation material |
| 08/05/2009 | CN100523081C Phosphorous epoxy resin composition |
| 08/05/2009 | CN100522957C Sulfonium salt photinitiators and use thereof |
| 08/02/2009 | CA2653013A1 Sulfur dioxide-cured epoxy acrylate foundry binder system |
| 07/30/2009 | WO2009094295A1 Structural epoxy resin adhesives containing epoxide-functional, polyphenol-extended elastomeric tougheners |
| 07/30/2009 | US20090192265 Curable composition |
| 07/30/2009 | US20090189466 Motor system for a vehicle fuel pump |
| 07/29/2009 | EP1920005A4 Epoxy compositions having improved impact resistance |
| 07/29/2009 | EP1442090B1 High temperature epoxy adhesive films |
| 07/29/2009 | CN100521869C Nanoparticle filled underfill |
| 07/28/2009 | US7566501 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 07/28/2009 | CA2333035C Adhesive and coating formulations for flexible packaging |
| 07/23/2009 | WO2009090997A1 Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article |
| 07/23/2009 | WO2009090922A1 Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| 07/23/2009 | WO2009090817A1 Dicing/die bonding film |
| 07/23/2009 | WO2009072742A3 Dicing die bonding film and dicing method |
| 07/23/2009 | WO2009058295A3 Epoxy paste adhesives resistant to wash-off |
| 07/23/2009 | US20090186955 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 07/22/2009 | CN101488480A Interlayer dielectric and pre-applied die attach adhesive materials |
| 07/22/2009 | CN101486888A High tenacity adhesive |
| 07/16/2009 | DE102008004112A1 Textiles Halbzeug mit wenigstens einer mit einem Kleber versehenen Oberfläche Semi-finished textile with at least one provided with an adhesive surface |
| 07/15/2009 | EP2079108A1 Semiconductor electronic component and semiconductor device using the same |
| 07/15/2009 | EP2078734A1 Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 07/15/2009 | CN100513507C Adhesive for circuit connection |
| 07/15/2009 | CN100513506C Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| 07/14/2009 | US7560157 Adhesive composition and glass plate with thermoplastic elastomer molding |
| 07/14/2009 | CA2217834C Curable resin compositions |
| 07/09/2009 | WO2009084804A1 Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same |
| 07/09/2009 | WO2009084511A1 Composition for forming contact-bonding coating film of actinic-energy-ray curable type and strippable adhesive-coated paper employing the same |
| 07/09/2009 | WO2009083564A1 Method for preparing a hard film or coating from a cationically crosslinkable/polymerizable composition comprising an iodonium borate and giving off an acceptable odour |
| 07/09/2009 | US20090176931 Water based curing agent formed by combining an active amine-hydrogen containing amine-functional dispersion with an active amine-hydrogen containing amine-functional curing agent in solution or emulsion form; primer, sealer, paint, filler, coating, covering, trowelling or self leveling composition |
| 07/08/2009 | EP2077065A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 07/08/2009 | EP2076578A1 Pumpable epoxy paste adhesives resistant to wash-off |
| 07/08/2009 | CN101475788A High strength polyurethane modified epoxy construction structure glue and manufacturing method thereof |
| 07/08/2009 | CN101475787A Isotropic high performance heat conducting adhesive and preparation thereof |
| 07/08/2009 | CN100509984C Film-shaped adhesive for circuit connection |
| 07/08/2009 | CN100509983C Adhesive for circuit connection |
| 07/08/2009 | CN100509982C Adhisive for circuit connection |
| 07/08/2009 | CN100509981C Adhesive for circuit connection |
| 07/02/2009 | WO2009081987A1 Adhesive resin composition and adhesive material using same |
| 07/02/2009 | WO2009081821A1 Hot melt adhesive composition |
| 07/01/2009 | CN100506938C Thermostable epoxy resin adhesive and its preparation method |
| 07/01/2009 | CN100506929C Aqueous self-bonding coating for electrical steel |
| 06/30/2009 | US7553890 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 06/30/2009 | CA2448341C Vinyl ester adhesive compositions |
| 06/24/2009 | EP1603986B1 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| 06/24/2009 | CN101463239A Single-component surface pasting adhesive capable of being rapidly cured |
| 06/23/2009 | US7550825 Interlayer dielectric and pre-applied die attach adhesive materials |
| 06/18/2009 | WO2009075252A1 Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 06/18/2009 | WO2009059007A3 Additives for improved adhesion to oily substrates |
| 06/18/2009 | US20090155596 Nozzle sealing composition and method |