| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 06/01/2011 | CN102079956A 白色覆盖膜及其制作方法 White cover film and its production method |
| 06/01/2011 | CN102079875A High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same |
| 06/01/2011 | CN102079847A Photosensitive silver slurry conductive adhesive and preparation method thereof |
| 06/01/2011 | CN102079810A Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive |
| 06/01/2011 | CN101215453B Adhesive for middle-temperature solidifying epoxy pre-dipping material and preparation method thereof |
| 05/31/2011 | US7951456 Two-component epoxy adhesive composition |
| 05/26/2011 | WO2011062149A1 Circuit connection material, connection structure using same, and temporary pressure-bonding method |
| 05/26/2011 | WO2011062127A1 Adhesive composition for polarizing plate and polarizing plate using the same |
| 05/26/2011 | US20110121447 Adhesive for connection of circuit member and semiconductor device using the same |
| 05/26/2011 | US20110120646 Two-part epoxy-based structural adhesives |
| 05/25/2011 | EP2137277B1 Heat-resistant structural epoxy resins |
| 05/25/2011 | CN102076805A Epoxy resin composition |
| 05/25/2011 | CN102076801A Silver coated flaky material filled conductive curable composition and application in die attach |
| 05/25/2011 | CN102076733A Epoxy resin composition |
| 05/25/2011 | CN102074646A Light-emitting diode (LED) and manufacturing method thereof |
| 05/25/2011 | CN102074494A Thermosetting die-bonding film |
| 05/25/2011 | CN102070994A Semisolid-state reaction-type epoxy adhesive |
| 05/25/2011 | CN102070991A Lamelliform adhesive and adhesive tape for wafer processing |
| 05/25/2011 | CN102070067A High-ductility hand strap |
| 05/25/2011 | CN102069186A Methods for performing surface treatment on micron silver sheet and preparing high-conductivity conducting adhesive |
| 05/25/2011 | CN101255326B Single-component reaction type hot melt adhesives and steel plate composite material using the same |
| 05/25/2011 | CN101148572B Epoxy group anti-skid glue and preparation method thereof |
| 05/24/2011 | US7947779 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer |
| 05/24/2011 | CA2470631C Method for connecting two bodies |
| 05/19/2011 | WO2011059084A1 Circuit connecting material and connection structure for circuit member using same |
| 05/18/2011 | EP2321370A1 Two-part epoxy-based structural adhesives |
| 05/18/2011 | EP1250491B1 Creping adhesives |
| 05/18/2011 | CN1930206B Epoxy adhesive composition |
| 05/18/2011 | CN102066514A Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device |
| 05/18/2011 | CN102066449A Hybrid-functional polymers |
| 05/18/2011 | CN102064271A Light emitting diode and production method |
| 05/18/2011 | CN102061065A Photosensitive cured super resin composition for sealing liquid crystal display (LCD) and preparation method thereof |
| 05/18/2011 | CN102060103A Wood propeller and manufacturing method thereof |
| 05/12/2011 | WO2011056357A1 Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes |
| 05/12/2011 | WO2011055784A1 Thermopolymerization initiator system and adhesive composition |
| 05/12/2011 | WO2011055588A1 Adhesive composition |
| 05/12/2011 | US20110111240 Acrylic based pressure sensitive adhesive formulation |
| 05/12/2011 | US20110111234 Adhesives With Thermal Conductivity Enhanced By Mixed Silver Fillers |
| 05/11/2011 | EP2319893A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 05/11/2011 | EP2319892A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 05/11/2011 | CN102057012A Flame-retardant adhesive composition and laminated film |
| 05/11/2011 | CN102057010A One-part epoxy-based structural adhesive |
| 05/11/2011 | CN102051151A Liquid adhesive composition of semiconductor device and semiconductor device using the same |
| 05/11/2011 | CN102051150A Adhesive for bonding metal heat-conducting piece |
| 05/11/2011 | CN102051148A Single-component environmentally-friendly electronic glue and application thereof |
| 05/11/2011 | CN102051144A Metal adhesive for metal connection |
| 05/11/2011 | CN102051143A Adhesive for connection of circuit member and semiconductor device using the same |
| 05/11/2011 | CN102051142A Adhesive for connection of circuit member and semiconductor device using the same |
| 05/11/2011 | CN102051141A Adhesive for connection of circuit member and semiconductor device using the same |
| 05/11/2011 | CN102050939A Thermosetting resin composition with acid anhydride curing |
| 05/11/2011 | CN102050930A Photocurable resin composition containing anthraquinone derivative |
| 05/05/2011 | DE102007025668B4 Verfahren zum Verbinden zweier Fügepartner A method for connecting two mating parts |
| 05/04/2011 | EP2316897A1 Insulating sheet and laminated structure |
| 05/04/2011 | EP2315741A2 Reactive liquid modifiers |
| 05/04/2011 | CN1865382B Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 05/04/2011 | CN102046713A Thermally conductive composite material comprising aluminum powder, process for producing the composite material and use of the composite material |
| 05/04/2011 | CN102040941A Sealant composition for liquid crystal display device |
| 05/04/2011 | CN102040939A Die bond agent composition for optical semiconductor element and optical semiconductor device using the composition |
| 05/04/2011 | CN102040936A Sealant composition for liquid crystal display device |
| 05/04/2011 | CN102040935A Weak-exothermic room temperature curing epoxy adhesive |
| 05/04/2011 | CN102040934A Silver conductive adhesive and preparation method thereof |
| 05/04/2011 | CN102040933A Wear-resistant epoxy glue and preparation method thereof |
| 05/04/2011 | CN102040932A Preparation method of epoxy adhesive |
| 05/04/2011 | CN101240104B Alkylated polyalkyleneamines and uses thereof |
| 05/04/2011 | CN101168653B Method for preparing liquefied straw epoxy resin adhesive |
| 05/03/2011 | US7935204 Method of fabricating printhead assembly |
| 04/28/2011 | WO2011049011A1 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
| 04/28/2011 | WO2011048972A1 Composite member |
| 04/28/2011 | WO2011048022A2 Impact resistant two-component epoxy-based substance curing at room temperature |
| 04/28/2011 | US20110098382 Structural adhesives |
| 04/28/2011 | US20110098381 Adhesive formulation and also method for the treatment of reinforcing inserts |
| 04/28/2011 | US20110097212 Toughened curable compositions |
| 04/28/2011 | DE102009045903A1 Schlagzähe, bei Raumtemperatur härtende zweikomponentige Masse auf Epoxidbasis Impact-resistant, room temperature curing two-component epoxy mass |
| 04/27/2011 | EP2315215A1 Conductive adhesive and led substrate using the same |
| 04/27/2011 | EP2313470A2 One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 04/27/2011 | EP2313464A2 Reaction products based on amphiphilic block copolymers and their use as impact modifier |
| 04/27/2011 | CN102037076A One-liquid type cyanate epoxy composite resin composition |
| 04/27/2011 | CN102037050A Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 04/27/2011 | CN102031082A Benzimidazole diamine curing type epoxy adhesive and preparation method thereof |
| 04/27/2011 | CN102031081A Liquid epoxy encapsulating material and preparation method thereof |
| 04/27/2011 | CN102031080A Conductive paste and method of manufacturing printed circuit board using the same |
| 04/27/2011 | CN102031070A Thin sheet adhesive agent and adhesive tape for processing wafer |
| 04/27/2011 | CN101205451B Ultraviolet-anaerobic dual curing adhesive |
| 04/21/2011 | WO2011046064A1 Protective sheet for coating film |
| 04/21/2011 | US20110088935 Conductive particle, anisotropic conductive film, joined structure, and joining method |
| 04/20/2011 | EP2311921A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device |
| 04/20/2011 | EP2310436A2 Two-part epoxy-based structural adhesives |
| 04/20/2011 | CN102027084A Improvements in or relating to structural adhesives |
| 04/20/2011 | CN102020963A High-temperature-resistant and high thermal conductive adhesive and preparation method thereof |
| 04/20/2011 | CN102020962A Catalysis curing epoxy binding agent |
| 04/20/2011 | CN102020961A High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate |
| 04/20/2011 | CN102020960A Method for preparing high-heat conductivity and low-dissipation coefficient layer-adding bonded adhesive |
| 04/20/2011 | CN102020959A High heat conductivity and low dissipation factor increased layer bonding varnish |
| 04/20/2011 | CN102020828A Phosphorus-nitrogen compound intumescence active flame retardant modified epoxy resin and preparation method and application thereof |
| 04/20/2011 | CN102020758A Low temperature curable epoxy compositions containing phenolic-blocked urea curatives |
| 04/20/2011 | CN101528007B Adhesion assisting agent-bearing metal foil, printed wiring board using the same and manufacturing method thereof |
| 04/14/2011 | WO2011043119A1 Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board |
| 04/14/2011 | WO2011042554A1 Increase in the toughness of a material achieved by means of a curable composition including at least one vinyl ester monomer |
| 04/13/2011 | EP2308936A1 Insulating tape |
| 04/13/2011 | CN1764692B Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |