C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
11/2011
11/16/2011	CN102241949A Rubber film and preparation method thereof
11/16/2011	CN101418204B Halogen-free flameproof adhesive and application thereof in bonding sheet and copper clad laminate
11/16/2011	CN101314706B Preparation of solidification type steel adhesion structure glue in low-temperature and humidity surroundings
11/16/2011	CN101130679B Adhesion agent and method of manufacturing the same
11/15/2011	US8058345 Curable adhesive compositions containing reactive multi-functional acrylate
11/10/2011	WO2011138254A1 1c epoxy resin composition with reduced toxicity
11/10/2011	DE102010028586A1 1K-Epoxidharzzusammensetzung mit verringerter Toxizität 1K epoxy resin with reduced toxicity
11/09/2011	CN202029463U Metal base copper-clad plate with low thermal resistance and high insulation property
11/09/2011	CN102234497A Structural pressure-sensitive adhesive, structural pressure-sensitive adhesive tape and preparation method of structural pressure-sensitive adhesive and structural pressure-sensitive adhesive tape
11/09/2011	CN101901652B Method for separating organic bonding porcelain bushing without damage
11/09/2011	CN101490195B Adhesive composition for PDP front filter and use
11/02/2011	EP2104721B1 High strength epoxy adhesive and use thereof
11/02/2011	CN102231311A Production method of single-side reinforced small-glue mica tap by using polyester non-woven fabric
11/02/2011	CN101605860B Conductive adhesive composition, conductive adhesive sheet and conductive adhesive tape
10/2011
10/27/2011	WO2011133317A2 One part epoxy resin including a low profile additive
10/27/2011	WO2011132637A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
10/27/2011	US20110263754 Metallic compounds in non-brominated flame retardant epoxy resins
10/27/2011	US20110263132 Method for forming an adhesive layer and adhesive composition
10/26/2011	EP2381304A1 Sealing agent for liquid crystal dropping method, which contains photocurable resin and thermosetting resin
10/26/2011	CN102226846A Manufacturing method for optical plate
10/25/2011	US8044117 Latent hardener, process for producing the same, and adhesive containing latent hardener
10/25/2011	US8043709 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
10/20/2011	WO2011129372A1 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film
10/20/2011	WO2011129323A1 Resin composition for adhesive agent, adhesive agent and adhesive sheet each comprising same, and printed wiring board involving the same as adhesive agent layer
10/20/2011	WO2011129278A1 Resin composition for adhesive agent, adhesive agent comprising the resin composition, adhesive sheet, and printed wiring board involving the adhesive sheet as adhesive layer
10/20/2011	WO2011129272A1 Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device
10/20/2011	US20110256342 Film adhesive and anisotropic conductive adhesive
10/20/2011	US20110253943 One part epoxy resin including a low profile additive
10/19/2011	EP2377903A1 Film adhesive and anisotropic conductive adhesive
10/19/2011	CN102220103A Low viscosity heat-conducting adhesive for LED chips
10/19/2011	CN102220102A High-temperature resisting adhesive and preparation method thereof
10/19/2011	CN102220101A Double-component epoxy adhesive for bonding ceramics, preparation method and using method thereof
10/19/2011	CN102220091A Adhesive tape for wafer processing
10/18/2011	CA2439361C Adhesive prepreg face sheets for sandwich panels
10/13/2011	WO2011126018A1 Adhesive composition and endoscope
10/13/2011	WO2011125778A1 Adhesive composition, bonding sheet, and semiconductor device
10/13/2011	WO2011125712A1 Adhesive composition, adhesive sheet, and method for producing semiconductor device
10/13/2011	WO2011015575A3 Method for attaching a magnet on or in a rotor or stator
10/13/2011	US20110250459 Epoxy resin composition, prepreg, laminate board, and multi-layer board
10/13/2011	US20110247870 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
10/13/2011	US20110247757 Circuit connection material, film-form circuit connecting material using the same, circuit member connecting structure, and method of manufacturing the same
10/12/2011	CN102216070A Colored laminate metal sheet for containers
10/12/2011	CN102212330A Epoxy resin adhesive for hollow fiber membrane end sealing as well as preparation and application methods thereof
10/12/2011	CN102212327A Preparation process of ultraviolet light solidified adhesive
10/12/2011	CN102212323A Ultraviolet light solidified adhesive
10/12/2011	CN102212322A Carbon nano tube reinforcing epoxy structural adhesive and method for preparing same
10/12/2011	CN102212247A Aqueous epoxy resin composition and preparation method thereof
10/06/2011	WO2011123356A2 Epoxy adhesive compositions comprising an adhesion promoter
10/06/2011	WO2011123173A1 Curable compositions
10/06/2011	WO2011122749A1 Epoxy adhesive for repairing water supply and sewage pipes
10/06/2011	US20110244245 Epoxy adhesive compositions comprising an adhesion promoter
10/06/2011	US20110241536 Aligned carbon nanotube-polymer materials, systems and methods
10/06/2011	CA2794939A1 Curable compositions
10/06/2011	CA2794528A1 Epoxy adhesive compositions comprising an adhesion promoter
10/05/2011	CN102209754A Resin composition for printed wiring board
10/05/2011	CN102208571A Substrate for flexible luminescent device and preparation method thereof
10/05/2011	CN102208568A Substrate used by flexible light-emitting device and preparation method thereof
10/05/2011	CN102208566A Substrate used in luminescent device and preparation method thereof
10/05/2011	CN102208563A Substrate for flexible luminescent device and preparation method thereof
10/05/2011	CN102208562A Substrate for flexible luminescent device and preparation method thereof
10/05/2011	CN102208560A Substrate for flexible luminescent device and preparation method thereof
10/05/2011	CN102208558A Substrate for flexible luminescent device and preparation method thereof
10/05/2011	CN102208557A Substrate for flexible luminescent device and preparation method thereof
10/05/2011	CN102208556A Flexible substrate used in luminescent device and preparation method thereof
10/05/2011	CN102208555A Substrate used in luminescent device and preparation method thereof
10/05/2011	CN102208554A Substrate for flexible luminous device and preparation method thereof
10/05/2011	CN102208550A Substrate for flexible photoelectronic device and preparation method thereof
10/05/2011	CN102208548A Flexible optoelectronic device substrate and preparation method thereof
10/05/2011	CN102208542A Substrate for flexible photoelectronic device and preparation method thereof
10/05/2011	CN102208538A Substrate for flexible photoelectronic device and preparation method thereof
10/05/2011	CN102206324A Full-biobased epoxy resin composition and condensate
10/05/2011	CN102206322A Epoxy-modified organic silicone resin for manufacturing composite glue, and processing technology thereof
10/05/2011	CN101851397B Synthetic resin and ultraviolet photo-curing adhesive prepared by using the same
10/05/2011	CN101018834B Fire retardant composition
09/2011
09/29/2011	WO2011118697A1 Curing agent composition for epoxy resin based adhesive, and adhesive for porous materials
09/29/2011	WO2011117405A1 Reinforcing element for reinforcement in cavities of structural components
09/29/2011	WO2011117402A1 Shape memory material based on a structural adhesive
09/29/2011	WO2011117398A1 Shape memory material based on a structural adhesive
09/29/2011	CA2788739A1 Epoxy resin composition with reduced toxicity
09/28/2011	EP2368957A1 Reinforcement element for reinforcing cavities in structural parts
09/28/2011	EP2368956A1 Shape memory material on the basis of a structural adhesive
09/28/2011	EP2368955A1 Shape memory material on the basis of a structural adhesive
09/28/2011	EP1771487B1 Epoxy resin additive
09/28/2011	CN102200604A Polarizing plate and manufacturing method thereof
09/28/2011	CN102199413A Modified epoxy resin adhesive used for polyimide flexible copper-clad plate
09/28/2011	CN102199407A High-dispersing nanometer silver and high-performance conductive adhesive
09/28/2011	CN102199402A Ultraviolet curing adhesive for transfer printing film
09/28/2011	CN102199276A Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
09/28/2011	CN101808466B Manufacturing method of copper-clad plate and glue solution for copper-clad plate
09/28/2011	CN101445709B Adhesive compostion for die-bonding in semiconductor assembly and adhesive film prepared therefrom
09/27/2011	US8026321 Adhesive of epoxy compound, epoxy-reactive monomer and tri- and tetra-functional acrylate accelerators
09/22/2011	WO2011115159A1 Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer
09/22/2011	WO2011115020A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
09/22/2011	WO2011114665A1 Heat-resistant adhesive
09/22/2011	US20110227678 Magnetic-dielectric assemblies and methods of fabrication
09/21/2011	EP2366738A1 Adhesive compositions
09/21/2011	CN102197101A Adhesive composition and optical member
09/21/2011	CN102191005A Adhesive composition and sheet for forming semiconductor wafer-protective film
09/21/2011	CN102191004A Thermosetting adhesive for flexible basic material and preparation method thereof
09/21/2011	CN102191003A Silver-plated carbon nanotube heat-conducting adhesive and preparation method thereof

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