Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
11/2010
11/24/2010CN101222188B Rotor or stator with gradient coating friction material and preparation thereof
11/24/2010CN101198671B Adhesive and adhesive sheet
11/24/2010CN101189124B Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure
11/23/2010US7838114 Thermosetting resin composition and use thereof
11/18/2010WO2010131575A1 Adhesive composition, adhesive sheet for connecting circuit member, and method for manufacturing semiconductor device
11/18/2010DE102009002996A1 Klebstoffe mit akustischer Dämpfungswirkung Adhesives with acoustic damping effect
11/17/2010CN1938356B Hardenable composition
11/17/2010CN101885955A Adhesive for bonding full-ceramic bearing and metal shaft and application method thereof
11/17/2010CN101885900A Resin composition, bonding sheet and copper-clad plate made using same, manufacturing method thereof
11/17/2010CN101157835B Modified epoxide resin adhesive and uses thereof
11/16/2010US7834091 Bonding surfaces with two-component adhesive of epoxy resins and amine compound
11/11/2010WO2010128611A1 Film-like adhesive agent for sealing semiconductor, semiconductor device, and process for manufacturing the semiconductor device
11/10/2010EP1944346B1 Anisotropic conductive adhesive
11/10/2010CN101880515A High-reliability and low-viscosity underfill
11/10/2010CN101880514A Single-component under-filler with favorable repairing property and preparation method thereof
11/10/2010CN101880513A Manufacturing method of organic ceramic body binder and organic ceramic body binding method
11/10/2010CN101880441A Epoxy resin composition as well as bonding sheet and copper-clad plate made from same
11/10/2010CN101880374A Silicon framework hyperbranched epoxy resin and preparation method thereof
11/10/2010CN101880372A Active prepolymer, preparation method thereof and polyurea adhesive and epoxy resin adhesive containing the same
11/04/2010WO2010125965A1 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
11/04/2010WO2010125880A1 Adhesive resin composition, laminate using same, and flexible printed wiring board
11/04/2010WO2010125879A1 Adhesive resin composition, laminate using same, and flexible printed wiring board
11/04/2010DE102009027826A1 Katalyse von Epoxidharzformulierungen Catalysis of epoxy resin formulations
11/03/2010CN1832222B Organic electroluminescent device and manufacturing method for the same
11/03/2010CN101877258A Plate-shaped suspension type bi-insulation composite insulator and medium electric adhesive thereof
11/03/2010CN101875833A Liquid crystal sealant and liquid crystal display unit using the same
11/03/2010CN101875832A Liquid crystal sealant and liquid crystal display unit using the same
11/03/2010CN101875831A Novel nano-copper conductive adhesive and preparation method thereof
11/03/2010CN101875830A Phenolic resin/phosphate hybrid adhesive and preparation method thereof
11/03/2010CN101875825A Halogen-free flame retardant adhesive composition and flexible copper-clad plate using same
11/03/2010CN101296561B Flexible printing patchboard and sliding lid type mobile phone terminal using the same
11/02/2010US7824754 and Isopropyltris(dioctylpyrophosphate)titanate coupler; acrylated bisphenol-glycerol epoxy resin; nonunsaturated is a bisphenol-epichlorohydrin resin; insulating adhesive; anisotropically electroconductive adhesive film; curable at low temperature; circuit boards
10/2010
10/28/2010WO2010122995A1 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent
10/28/2010DE102007063698B4 Optisches Bauelement mit Oberflächenbeschichtung An optical device with surface coating
10/26/2010US7820760 Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
10/21/2010WO2010119685A1 Adhesive composition, bonding method, laminate and tire
10/20/2010CN101864262A Flexible conductive adhesive
10/20/2010CN101864261A Amphiphilic block copolymer-modified epoxy resin and adhesives made therefrom
10/20/2010CN101864254A Reversible dry adhesives for wet and dry conditions
10/20/2010CN101864251A Organic adhesive for electrode paste of silicon solar cell and preparation method thereof
10/20/2010CN101864250A Surface mount adhesive for use in lead-free packaging process and preparation method
10/20/2010CN101235269B Double-component epoxy resin embedding adhesive and its preparation method and can sealing technique
10/14/2010WO2010116891A1 Heat-conductive massive adhesive agent, heat-conductive adhesive sheet and method for producing same
10/13/2010CN101857789A Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof
10/13/2010CN101857788A Ambient-curable anisotropic conductive adhesive
10/13/2010CN101857735A Silicon dioxide eutectic filling material and preparation method of laminate
10/13/2010CN101497778B Preparation of epoxy resin modified soy protein adhesive
10/13/2010CN101244645B Production method for oxazolidinone epoxy glass cloth laminated board
10/07/2010WO2010113759A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
10/07/2010US20100255314 Aromatic aldimines and polyurethane compositions which contain aldimine
10/07/2010US20100255313 One-pack type epoxy resin composition and use thereof
10/06/2010CN101855310A Composition for forming contact-bonding coating film of actinic-energy-ray curable type and strippable adhesive-coated paper employing the same
10/06/2010CN101851481A Epoxy resin adhesive for manufacturing blades of wind driven generator and preparation method thereof
10/06/2010CN101851480A Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
10/06/2010CN101851479A Application of graphite conductive adhesive to prepare electrode-detection binder
10/06/2010CN101851478A Rapid-curing conductive adhesive composition and method for preparing same
10/06/2010CN101851397A Synthetic resin and ultraviolet photo-curing adhesive prepared by using the same
10/06/2010CN101851395A Epoxy resin and production method thereof
10/06/2010CN101851330A Alpha, omega-amino terminated polyether compound with phenolic hydroxyl group, preparation method thereof and epoxy resin adhesive containing the same
10/06/2010CN101148571B Fire resistant epoxy conducting adhesive and preparation method thereof
09/2010
09/30/2010WO2010110069A1 Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device
09/30/2010US20100249276 Curatives for epoxy compositions
09/29/2010CN1880399B Thermally conductive glue and method of manufacturing same
09/29/2010CN1798820B Activatable material for sealing,baffling or reinforcing and method of forming same
09/29/2010CN101848974A Dicing die bonding film having excellent burr property and reliability and semiconductor device using the same
09/29/2010CN101847396A Substitute boa skin of folk music instrument and manufacturing method thereof
09/29/2010CN101845287A Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof
09/29/2010CN101845286A Photocurable adhesive composition, polarizing plate and a process for producing the same, optical member and liquid crystal display device
09/23/2010DE202009006323U1 Klebe-Dichtband Adhesive sealing tape
09/22/2010EP2137226B1 Epoxy group-terminated polymers, their compositions and their utilisation as impact resistance modifiers
09/22/2010EP1508261B1 Electronic assembly and method of making an electronic assembly
09/22/2010CN101842454A Additives for improved adhesion to oily substrates
09/15/2010CN1974546B Diphenol derivative containing aromatic schiff base and ether band structure and its preparation and application
09/15/2010CN101836334A Anisotropic electroconductive film, and process for producing connection structure using the same
09/15/2010CN101835865A Dicing die bonding film and dicing method
09/15/2010CN101833215A Transfer structure of flexible electronic device and manufacturing method thereof
09/15/2010CN101831264A Isotropic high-performance thermal conductive adhesive for filling carbon nano tube
09/10/2010WO2010074518A3 Dual-layer adhesive film for semiconductor and die bonding film including the same
09/09/2010US20100227101 Peeling Sheet With Adhesive of Epoxy Acrylate, Non-Unsaturated Resin and Bis(methacryloyloxyethyl) Hydrogen Phosphate
09/08/2010EP2226347A1 Epoxy resin curing agent, method for producing the same, and epoxy resin composition
09/08/2010EP2225285A1 Method for preparing a hard film or coating from a cationically crosslinkable/polymerizable composition comprising an iodonium borate and giving off an acceptable odour
09/08/2010EP1546211B1 Preparation of acrylic polymer sol for coating
09/08/2010CN101827909A Halogen-free flame retardant adhesive compositions and article containing same
09/08/2010CN101827908A Nonconductive adhesive composition and film and methods of making
09/08/2010CN101824297A High-heat-conductivity glue and preparation method thereof
09/08/2010CN101824296A Cation-polymerizable adhesive and polarizing plate using the same
09/08/2010CN101824152A Preparation method and application of resin having double curing groups
09/08/2010CN101824138A Epoxide-based composition
09/08/2010CN101245227B Epoxy conductive silver glue for LED and method for manufacturing same
09/02/2010WO2010099281A1 Epoxy adhesive compositions with high mechanical strength over a wide temperature range
09/02/2010WO2010098950A1 One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol
09/02/2010WO2010098155A1 Adhesive resin compositions, and laminates and flexible printed wiring boards using same
09/02/2010WO2010098154A1 Adhesive resin compositions, and laminates and flexible printed wiring boards using same
09/02/2010WO2010097051A1 Room-temperature curable epoxy structural adhesive composition and preparation method thereof
09/02/2010CA2753569A1 Epoxy adhesive compositions with high mechanical strength over a wide temperature range
09/01/2010EP2223966A1 Epoxy adhesive compositions with high mechanical strength over a wide temperature range
09/01/2010EP2222805A1 Process of coating electrical steel
09/01/2010CN101821333A Curable epoxy resin-based adhesive compositions
09/01/2010CN101821312A Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition
09/01/2010CN101819939A Chip attach adhesive to facilitate embedded chip build up and related systems and methods
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