| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 05/28/2008 | CN101186796A Method for preparing epoxy resin adhesive |
| 05/28/2008 | CN101185908A Eccentric cover section in cone crusher |
| 05/21/2008 | CN100389162C Adhesive agent and method for production thereof |
| 05/15/2008 | WO2008057414A1 Flowable, non-sagging adhesive compositions |
| 05/15/2008 | WO2008056773A1 Adhesive film, and connection structure and connecting method for circuit member |
| 05/15/2008 | US20080110665 Method for Connecting Printed Circuit Board |
| 05/14/2008 | EP1920005A1 Epoxy compositions having improved impact resistance |
| 05/14/2008 | CN100387669C Antiwear ceramic-metal adhesive |
| 05/14/2008 | CN100387668C Epoxy compositions having improved shelf life and articles containing the same |
| 05/08/2008 | WO2008054012A1 Adhesive tape and semiconductor device using the same |
| 05/08/2008 | WO2008054011A1 Semiconductor electronic component and semiconductor device using the same |
| 05/08/2008 | WO2008053590A1 Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, method for manufacturing semiconductor element, and method for manufacturing semiconductor package |
| 05/08/2008 | US20080108180 Nanoparticle filled underfill |
| 05/08/2008 | CA2667853A1 Adhesive tape and semiconductor device using the same |
| 05/08/2008 | CA2667852A1 Semiconductor electronic component and semiconductor device using the same |
| 05/07/2008 | EP1918341A1 Adhesive film and semiconductor device using same |
| 05/07/2008 | EP1597332B1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 05/07/2008 | EP1280868B1 Rigid substrate lamination adhesive |
| 05/07/2008 | CN100386356C Improved epoxy acrylic ester and its preparation method |
| 05/06/2008 | US7369586 Laser module |
| 05/06/2008 | US7368170 First part including a resin, filler having a U.S. Sieve size of 16 to 45, and second filler having U.S. Sieve size of 60 to 100; second part including a curing agent (amine) and accelerator (tertiary amine); parts directly joined along an interface; excellent adhesion between anchor pins and boreholes |
| 05/02/2008 | WO2008049859A1 Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
| 05/02/2008 | WO2008049858A1 Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer |
| 05/02/2008 | WO2008049857A1 Blocked polyurethane prepolymers and heat-curable epoxy resin compositions |
| 05/01/2008 | US20080099140 Illuminated wood veneer and method of making same |
| 04/30/2008 | EP1916272A1 Heat curable epoxide compositions containing a blocked and an epoxyterminated polyurethane prepolymer. |
| 04/30/2008 | EP1916270A1 Heat curable epoxy compositions with blocked polyurethane prepolymers |
| 04/30/2008 | EP1916269A1 Blocked polyurethane prepolymers and heat curing epoxy resin compositions |
| 04/30/2008 | DE102007050875A1 Adhesive part production for use in sealing, sound proofing, reinforcement or structural adhesion, involves utilizing adhesive material, which contains curing agent |
| 04/30/2008 | CN101168653A Method for preparing liquefied straw epoxy resin adhesive |
| 04/30/2008 | CN101168652A Positioning bonding element for suspender |
| 04/29/2008 | US7364797 Adhesive composition and adhesive film |
| 04/24/2008 | WO2008047700A1 Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor |
| 04/24/2008 | US20080093021 Two-Component Adhesive for Fabrication of Semifinished Products and Sandwich Composites |
| 04/24/2008 | DE102007040638A1 Composites with good mechanical and tribological properties, useful e.g. for injection molding, comprise fine titanium dioxide particles in (thermo)plastic and/or epoxy resin matrix |
| 04/23/2008 | EP1914285A1 Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive |
| 04/23/2008 | EP1554355B1 Heat-curable adhesive composition |
| 04/23/2008 | CN101166789A Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer |
| 04/23/2008 | CN101165133A Bi-component acrylic ester structure adhesive and preparation method thereof |
| 04/23/2008 | CN100383211C Thermoset binding material |
| 04/17/2008 | WO2008045270A1 Pumpable epoxy paste adhesives resistant to wash-off |
| 04/17/2008 | WO2008044330A1 Adhesive tape |
| 04/17/2008 | WO2008014053A3 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 04/17/2008 | DE102006048464A1 Haftvermittlerschicht für die Verbindung eines holographischen Datenträgers mit einem Substrat Adhesion-promoting layer for the connection of a holographic data carrier having a substrate |
| 04/17/2008 | DE102006047739A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks |
| 04/17/2008 | CA2665551A1 Pumpable epoxy paste adhesives resistant to wash-off |
| 04/16/2008 | CN101163770A Functional adhesive, construction material using the same, and method for preparing the adhesive |
| 04/16/2008 | CN101163769A Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board |
| 04/10/2008 | WO2008041426A1 Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board |
| 04/10/2008 | WO2008041409A1 Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent |
| 04/10/2008 | DE102006047738A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks |
| 04/10/2008 | DE102006047735A1 Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape particularly for bonding electronic components and conductor tracks |
| 04/10/2008 | DE102006046518A1 Coating a substrate comprises depositing an uncured resin film on a release film, depositing a protective layer on the resin film, removing the release film, applying the resin film onto the substrate, and curing the resin film |
| 04/09/2008 | CN101159320A Material for packaging cell |
| 04/09/2008 | CN101157839A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 04/09/2008 | CN101157838A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 04/09/2008 | CN101157837A Felting laminate for resin and method for manufacturing laminated body using same |
| 04/09/2008 | CN101157836A Red-green dry-pasting glue and preparation technique thereof |
| 04/09/2008 | CN101157835A Modified epoxide resin adhesive and uses thereof |
| 04/09/2008 | CN101157319A Manufacturing method of glass ornaments |
| 04/09/2008 | CN100380741C Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 04/09/2008 | CN100379813C Water adhesive composition for adhering elastomer |
| 04/03/2008 | WO2008037559A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 03/27/2008 | WO2008035791A1 Bonding method and adhesive resin composition |
| 03/27/2008 | US20080073029 Bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent |
| 03/27/2008 | DE102007041865A1 Handhabungsschicht und mit ihr gebildete adhäsive Teile Handling layer and formed with their adhesive parts |
| 03/27/2008 | DE102006042796A1 Kleb- oder Dichtstoff mit modifizierten anorganischen Partikeln Adhesive or sealant with modified inorganic particles |
| 03/27/2008 | DE102006042488A1 Adhesive or sealant useful in the construction of aircraft or motor vehicles comprises a colorant that is not part of an epoxy resin and changes color irreversibly at high temperature |
| 03/27/2008 | DE102006042095A1 Basismaterial für fotostrukturierbare Resists und Dielektrika Base material for photo-patternable resist and dielectrics |
| 03/26/2008 | EP1903086A1 Vinyl ester adhesive compositions |
| 03/26/2008 | EP1903085A1 Vinyl ester adhesive compositions |
| 03/26/2008 | CN101148572A Epoxy group anti-skid glue and preparation method thereof |
| 03/26/2008 | CN101148571A Fire resistant epoxy conducting adhesive and preparation method thereof |
| 03/25/2008 | US7348057 Acrylic adhesive sheet |
| 03/20/2008 | WO2008032850A1 Photopolymerizable composition |
| 03/19/2008 | EP1900774A1 Hardenable resin composition |
| 03/19/2008 | CN101147210A Electroconductive joining material and electric or electronic device using the same |
| 03/19/2008 | CN101144000A Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
| 03/19/2008 | CN101143453A Plastic-bamboo composite tube coiled forming technology method |
| 03/19/2008 | CN101143431A Semi-crisp corundum fine grinding abrasive band |
| 03/19/2008 | CN100375772C Flame-proof low-smoke low-toxicity epoxy adhesive |
| 03/18/2008 | US7345140 Phenol-reacted non-ester alicyclic diepoxides |
| 03/18/2008 | US7345105 Conductive adhesive composition |
| 03/13/2008 | WO2008030910A1 Flexible microelectronics adhesive |
| 03/13/2008 | WO2008030049A1 High-strength adhesive composition |
| 03/13/2008 | DE10208027B4 Wässriger reaktiver Beflockungsklebstoff für polymere Substrate und seine Verwendung Aqueous reactive flocking for polymeric substrates and its use |
| 03/12/2008 | EP1666846B1 Magnetic encoder |
| 03/12/2008 | CN101139511A Binder for electric insulating ceramic jacket and binding method of ceramic jacket |
| 03/12/2008 | CN101139510A Epoxide-resin rubber adhesive and preparation method thereof |
| 03/12/2008 | CN101139509A Monocomponent epoxide-resin rubber adhesive and preparation method thereof |
| 03/11/2008 | US7342053 Resin composition, adhesive film using the same and multilayer printed circuit board |
| 03/06/2008 | US20080054227 Compositions for use in electronics devices |
| 03/06/2008 | DE102007033214A1 Glueing workpieces together comprises using an adhesive in which a catalyst is formed or activated on exposure to ultraviolet or visible light and induces hardening without further irradiation |
| 03/05/2008 | EP1894980A1 Dicing die bonding film |
| 03/05/2008 | CN101134884A Magic glue |
| 03/05/2008 | CN101134878A 切割管芯键合膜 Cutting die bonding film |
| 03/05/2008 | CN101134370A Whole steel wire radial tyre cold-patch rubber sheet and special glue for repairing tyre using said rubber sheet |
| 02/28/2008 | WO2008023452A1 Adhesive tape, joint structure, and semiconductor package |
| 02/28/2008 | US20080051550 Novel sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition adhesive |
| 02/28/2008 | US20080048376 Plastic products containing images and methods of manufacture related thereto |