| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 01/04/2012 | EP2401339A1 One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
| 01/04/2012 | CN102307925A Room temperature curing epoxy adhesive |
| 01/04/2012 | CN102304845A Jointing process for pure felt conveyer belt and jointing glue used in jointing process |
| 01/04/2012 | CN102304339A High-temperature adhesive and application thereof |
| 01/04/2012 | CN102304338A Bonding resin with conductive property |
| 01/04/2012 | CN102304272A Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same |
| 01/04/2012 | CN101397486B Bi-component epoxide-resin adhesive and preparation method thereof |
| 01/04/2012 | CN101298548B Epoxy modified polyurethane cryogenic adhesive |
| 01/03/2012 | US8088245 Tensile strength; elongation; bonding strength |
| 01/03/2012 | CA2493515C Hybrid plastisol/hot melt compositions |
| 12/29/2011 | WO2011162256A1 Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof |
| 12/29/2011 | WO2011123356A3 Epoxy adhesive compositions comprising an adhesion promoter |
| 12/29/2011 | US20110319515 Divinylarene dioxide resin compositions |
| 12/29/2011 | US20110319513 Spray coatable adhesive for bonding silicon dies to rigid substrates |
| 12/29/2011 | US20110315223 Coating having improved hydrolytic resistance |
| 12/28/2011 | EP1539871B1 Epoxy resin composition |
| 12/28/2011 | CN102295905A 缓粘结预应力筋用高性能缓粘结材料及其制备方法 Slow bonded prestressing tendons slow performance bonding material and method |
| 12/28/2011 | CN102295904A 一种环氧树脂-聚硫橡胶胶粘剂的制备方法 An epoxy resin - polysulfide rubber adhesive preparation |
| 12/28/2011 | CN102295895A 具有优异的粘合性能和耐热性的热固性双面粘合膜 Having excellent adhesion properties and heat resistance of a thermosetting double-sided adhesive film |
| 12/28/2011 | CN102295894A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
| 12/28/2011 | CN102295893A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
| 12/28/2011 | CN102295892A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
| 12/28/2011 | CN101368075B 高压电器绝缘胶粘剂 High-voltage electrical insulation adhesive |
| 12/22/2011 | WO2011117229A3 Epoxy resin composition with reduced toxicity |
| 12/22/2011 | US20110313082 Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
| 12/22/2011 | US20110308727 Partially Crosslinked Adhesive-Supported Porous Film for Battery Separator and its Use |
| 12/21/2011 | CN102292407A 电子零件用胶粘剂 Electronic Components Adhesives |
| 12/21/2011 | CN102291955A 电子设备用筐体及其制造方法 Electronic equipment housing and manufacturing method thereof |
| 12/21/2011 | CN102290204A 用于构造低铁芯损耗大块非晶体金属磁性部件的方法 Method for constructing low core loss amorphous metal magnetic component chunks for |
| 12/21/2011 | CN102290168A 一种少胶云母带的干法生产方法 A Reduced glue dry mica production methods |
| 12/21/2011 | CN102286261A Led用氨基固化体系环氧功能化有机硅导电胶粘剂 Led curing system with amino functional silicone conductive epoxy adhesive |
| 12/21/2011 | CN102286260A Led用耐黄变高透光率绝缘环氧胶及制备方法和应用 Led by anti-yellowing epoxy insulation with high transmittance and preparation method and application |
| 12/21/2011 | CN102286259A Led用环氧功能化有机硅导电胶粘剂 Led by a conductive epoxy functional silicone adhesive |
| 12/21/2011 | CN101265400B 室温可控固化建筑胶及其制备方法 Temperature controlled curing construction adhesive and its preparation method |
| 12/15/2011 | WO2011156225A2 Wafer backside coating containing reactive sulfur compound |
| 12/15/2011 | WO2011156060A2 Dual cure adhesives |
| 12/15/2011 | WO2011155348A1 Light-reflective anisotropic electrically conductive paste, and light-emitting device |
| 12/15/2011 | US20110305883 Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
| 12/15/2011 | US20110303439 Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
| 12/14/2011 | EP2393864A1 Room temperature curing epoxy adhesive |
| 12/14/2011 | CN102277118A 无卤阻燃环氧树脂建筑结构胶粘剂及其制备方法 Halogen-free flame retardant epoxy resin adhesive structures and its preparation method |
| 12/14/2011 | CN102277117A 一种用于兆瓦级风力发电叶片的碳纳米管增强环氧结构胶及其制备方法 A carbon nanotube-megawatt wind turbine blades are reinforced epoxy structural adhesive and its preparation method |
| 12/14/2011 | CN102277116A 一种绝缘材料胶黏剂 An insulating adhesive material |
| 12/14/2011 | CN102277115A High-temperature resistant adhesive |
| 12/14/2011 | CN102277109A 一种环保型光固化导电银胶的制备方法 An eco-friendly light-curing adhesive conductive silver preparation |
| 12/14/2011 | CN102277098A 一种粘合剂组合物 An adhesive composition |
| 12/14/2011 | CN102277097A 一种炭黑导电胶及其制备方法 One carbon black conductive adhesive and its preparation method |
| 12/14/2011 | CN102276791A 阻燃环氧树脂复合物 Flame retardant epoxy resin composites |
| 12/14/2011 | CN102276788A 一种基于没食子酸的环氧树脂及其制备方法和应用 Epoxy resin and its preparation method and application based on gallic acid |
| 12/14/2011 | CN102275381A 聚氯乙烯塑料/橡胶输墨辊及制备方法 PVC / rubber inking rollers and preparation methods |
| 12/14/2011 | CN101591466B 包含环氧树脂的粘合促进剂组合物 Adhesion promoter composition comprises an epoxy resin |
| 12/14/2011 | CN101551058B 彩色的具有导电功能的玻璃钢格栅及其生产方法 Colored glass steel grille and production method of a conductive feature |
| 12/14/2011 | CN101348701B 光学用浅色低应力改性环氧胶粘剂及制备方法 Optical light-colored low-stress modified epoxy adhesive and preparation method |
| 12/13/2011 | US8075721 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| 12/13/2011 | US8074423 Parquet joint kit system and method for manufacturing a parquet joint kit system |
| 12/08/2011 | WO2011152404A1 Composition for use as coating material and adhesive, method for adhesive bonding, and laminated products |
| 12/08/2011 | WO2011152126A1 Cationically polymerizable composition, adhesive containing same, and cured product and polarizing plate which are obtained using same |
| 12/08/2011 | US20110301263 Gap-filling adhesive of stone |
| 12/08/2011 | US20110297317 One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
| 12/08/2011 | US20110297316 Low temperature method and system for forming field joints on undersea pipelines |
| 12/07/2011 | CN102272908A 晶片接合用树脂浆料、使用该浆料的半导体装置的制造方法及半导体装置 The method of manufacturing a wafer bonding resin slurry, the slurry using a semiconductor device and a semiconductor device |
| 12/07/2011 | CN102272252A 环氧树脂的金属稳定剂和分散方法 An epoxy stabilizer and a metal dispersion method |
| 12/07/2011 | CN102272228A 用于环氧树脂的金属稳定剂 Metal stabilizers for epoxy resins |
| 12/07/2011 | CN102272226A 无溴阻燃环氧树脂中的金属化合物 Non-brominated flame retardant epoxy resin metal compounds |
| 12/07/2011 | CN102270749A 一种柔性发光器件用基板及其制备方法 A flexible substrate for the light emitting device and its preparation method |
| 12/07/2011 | CN101732997B 一种酮苯溶剂回收的螺旋卷式膜组件的密封方法 A sealing method for benzene solvent recovery spiral wound membrane module ketone |
| 12/07/2011 | CN101563776B 引线框固定材料、引线框及半导体装置 Fixed leadframe material, lead frame and semiconductor device |
| 12/07/2011 | CN101402836B 有机活性胶状物及胶焊非金属与金属材料的方法 The method of organic active jelly and plastic welding of non-metallic and metallic materials |
| 12/07/2011 | CN101392090B 一种压电导电环氧树脂复合阻尼材料及其制备方法 A piezoelectric damping conductive epoxy composite material and its preparation method |
| 12/07/2011 | CN101368078B 一种用于软木粘接和修补的粘胶剂及配制方法 Adhesive bonding agent for cork and repair method of preparation |
| 12/06/2011 | US8071698 Surface-promoted cure of cationically curable compositions comprising vinyl ethers |
| 12/06/2011 | US8071217 Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer |
| 12/01/2011 | WO2011147016A1 Conductive adhesive |
| 12/01/2011 | US20110291260 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device |
| 12/01/2011 | CA2800727A1 Conductive adhesive |
| 11/30/2011 | CN102265388A 热固型芯片接合薄膜 Thermosetting die bonding film |
| 11/30/2011 | CN102264855A 粘合剂用树脂组合物、含有它的粘合剂、粘合片以及将粘合片作为粘合层含有的印制线路板 Binder resin composition containing the same adhesive, adhesive sheet and the adhesive sheet containing a printed circuit board as an adhesive layer |
| 11/30/2011 | CN102264853A 膜状粘合剂和各向异性导电粘合剂 The film-like adhesive and the anisotropic conductive adhesive |
| 11/30/2011 | CN102260480A 一种耐高温改性环氧树脂胶粘剂及其制备方法 A modified epoxy resin adhesive and preparation method of high temperature |
| 11/30/2011 | CN101880374B Silicon framework hyperbranched epoxy resin and preparation method thereof |
| 11/30/2011 | CN101617390B 切割/芯片接合薄膜 Cutting / die-bonding film |
| 11/30/2011 | CN101368077B 一种环氧树脂胶液 An epoxy resin glue |
| 11/30/2011 | CN101210162B 一种半导体胶及其制备方法 A semiconductor gum and its preparation method |
| 11/24/2011 | US20110287250 Adhesive sheet, semiconductor device, and process for producing semiconductor device |
| 11/23/2011 | EP2388279A1 Two-part adhesive |
| 11/23/2011 | EP1920005B1 Epoxy compositions having improved impact resistance |
| 11/23/2011 | CN102253502A Bonding agent and electro-optic assembly and electrophoretic medium thereof |
| 11/23/2011 | CN102250574A Hot-melt adhesive for preventing corrosion of repaired mouth of pipeline |
| 11/23/2011 | CN102250573A High shear and high peel strength epoxy adhesive |
| 11/23/2011 | CN102250556A Lightproof polyimide back glue film |
| 11/23/2011 | CN102250317A Rapid curable epoxy resin for electronic packaging, and application thereof |
| 11/23/2011 | CN102248771A Polyvinyl chloride (PVC) plastic/rubber ink-conveying roller and preparation method thereof |
| 11/22/2011 | US8062469 Adhesive resin composition and bonding method |
| 11/22/2011 | US8062468 Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins |
| 11/22/2011 | US8062467 Two-component adhesive for producing semi-finished products and composite sandwich materials |
| 11/22/2011 | CA2384176C Uv-curable compositions |
| 11/17/2011 | US20110281399 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 11/16/2011 | EP2385974A1 Metal stabilizers for epoxy resins and dispersion process |
| 11/16/2011 | EP2385970A1 Metal stabilizers for epoxy resins |
| 11/16/2011 | EP2385969A1 Metallic compounds in non-brominated flame retardant epoxy resins |