Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
04/2012
04/26/2012US20120100379 Fluoroelastomer bonding compositions suitable for high-temperature applications
04/26/2012US20120100367 Cellulose microfibrils as air release agent
04/25/2012EP2444467A1 Aqueous adhesive agent composition
04/25/2012CN101722590B 真空浇注及apg工艺中嵌件的表面处理方法 Vacuum casting process and apg surface treatment method inserts
04/25/2012CN101698984B 清洁刮刀的制造方法 The method of manufacturing the cleaning blade
04/25/2012CN101440266B 一种表面贴装技术用贴片胶及其制备方法 A surface mount technology with a patch of plastic and its preparation method
04/25/2012CN101343514B 金属板材专用粘合胶及其制备方法 Special adhesive sheet metal and its preparation method
04/24/2012US8163835 Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods
04/24/2012US8163819 Adhesive compositions, micro-fluid ejection devices and methods for attaching micro-fluid ejection heads
04/19/2012WO2012049939A1 Method for manufacturing electronic component
04/19/2012WO2012049938A1 Method for manufacturing electronic component
04/19/2012WO2011156225A3 Wafer backside coating containing reactive sulfur compound
04/19/2012WO2011133317A3 One part epoxy resin including a low profile additive
04/19/2012US20120095133 Core/shell rubbers for use in electrical laminate compositions
04/19/2012US20120094119 Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet
04/19/2012DE102010042602A1 Conductive connecting agent useful for producing electrical or thermal contact between semiconductor chip and substrate of the optoelectronic component, comprises adhesive matrix and filler particles incorporated in it
04/18/2012EP2129207B1 Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition
04/18/2012CN102417808A 一种耐高温胶粘剂及其制备方法 A high temperature adhesive and its preparation method
04/18/2012CN102417806A 一种高温粘结剂及其制备方法和应用 A high-temperature adhesive and its preparation method and application
04/18/2012CN102417805A 一种室温固化环氧树脂柔性密封胶及其制备方法 One kind of room temperature curing epoxy resin and a preparation method of a flexible sealant
04/18/2012CN102417804A 一种胶黏剂及其制备方法和使用方法 One kind of adhesive and its preparation method and use
04/18/2012CN101260223B Thermosetting die bonding film
04/11/2012EP2439246A1 Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet
04/11/2012CN102414288A 胶粘性树脂组合物、以及使用其的层压体和柔性印刷线路板 The adhesive resin composition and the use thereof and a flexible printed wiring board laminate
04/11/2012CN102414287A Adhesive resin composition, laminate using same, and flexible printed wiring board
04/11/2012CN102414241A 含咪唑化合物的微囊化组合物、使用其的固化性组合物及母料型固化剂 Microencapsulated compositions containing the imidazole compound, the use thereof, and the curable composition curing agent masterbatch
04/11/2012CN102408862A 一种减摩修补剂 One kind of friction Putty
04/11/2012CN102408861A 一种双组分环氧结构胶及其制备方法 A two-component epoxy structural adhesive and its preparation method
04/11/2012CN102408860A Flexible epoxy adhesive and application
04/11/2012CN102408859A Halogen-free environment-friendly bonding agent and preparation method thereof
04/11/2012CN102408858A 稳定型导电胶及其制备方法 Stable conductive plastic and a preparation method
04/11/2012CN102408857A 一种植筋胶及其制备工艺 One kind of anchorage glue and preparation process
04/11/2012CN102408856A 一种用于led封装的导电胶及其制备方法 Conductive plastic and preparation method for led encapsulation
04/11/2012CN102408840A Adhesive film, and connection structure and connecting method for circuit member
04/11/2012CN101516941B Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
04/05/2012WO2012044443A1 Epoxy resin compositions
04/05/2012WO2012043958A1 Polarizing plate and liquid crystal display device including same
04/05/2012WO2012043923A1 Adhesive composition and adhesive sheet for manufacturing semiconductor package
04/05/2012WO2012043922A1 Adhesive composition and film for preparing semiconductor
04/05/2012WO2012043764A1 Adhesive composition, method for manufacturing semiconductor device, and semiconductor device
04/05/2012WO2012042665A1 Adhesive composition, coating composition, primer using same, inkjet ink, adhesive method, and laminate
04/05/2012WO2012042543A2 Adhesive composition and uses thereof
04/05/2012WO2011156060A3 Dual cure adhesives
04/05/2012US20120083564 Hardener composition for epoxy resins
04/05/2012US20120082853 Urethane resin, actinic energy ray curable adhesive, and back protective sheet for solar cell
04/05/2012US20120080808 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
04/04/2012EP2225285B1 Method for preparing a hard film or coating from a cationically crosslinkable/polymerizable composition comprising an iodonium borate and giving off an acceptable odour
04/04/2012CN102399531A 耐油密封剂及其制备方法 Oil-resistant sealant and preparation method
04/04/2012CN102399523A 一种纳米银填充室温固化导电胶 Nano silver-filled conductive adhesive cured at room temperature
04/04/2012CN102399502A Adhesive film for solar cell electrode and method for manufacturing solar cell module using the same
04/04/2012CN102399358A 水作为发泡剂的热固性环氧树脂组合物 The thermosetting epoxy resin composition of water as a blowing agent
03/2012
03/29/2012US20120076994 Modified polyamide acrylate oligomers
03/28/2012EP2433996A1 Adhesive composition and endoscope
03/28/2012CN102396113A Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
03/28/2012CN102391824A Preparation process for polyamide hot-melt adhesive powder
03/28/2012CN102391818A Insulated thermal conductive adhesive and preparation method thereof
03/28/2012CN102391817A Underwater epoxy structure adhesive and preparation method thereof
03/28/2012CN102391816A High-temperature repairing agent
03/28/2012CN102391815A Anticorrosive repair agent
03/28/2012CN102391814A Abrasion-resistant repair agent
03/28/2012CN102391813A Single-component epoxy resin conductive adhesive
03/28/2012CN102391812A Iron repairing agent
03/28/2012CN102391811A Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED)
03/28/2012CN102391810A Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof
03/28/2012CN102391809A Thermosetting die bonding film
03/28/2012CN102391808A Preparation of medium-temperature solidified epoxy adhesive and application of medium-temperature solidified epoxy adhesive in flexible polyester copper-clad plate
03/28/2012CN102391807A Preparation method of rapidly solidified anisotropic conductive adhesive
03/28/2012CN102391719A Polymer binding agent for water-scraping set-off resistant ink composite for engraved intaglio plate printing
03/28/2012CN102391472A Epoxy resin microcapsule latent curing agent and preparation method thereof
03/28/2012CN102390127A Iron-based laminated sheet with copper foil coating, and preparation method thereof
03/28/2012CN101654606B Epoxy adhesive and preparation method thereof
03/22/2012WO2012035755A1 Liquid curable epoxy resin composition and adhesive agent containing same
03/22/2012WO2012013543A3 Insulation system having improved partial discharge strength
03/22/2012US20120071584 Structural epoxy resins containing core-shell rubbers
03/22/2012US20120067763 Can with bisphenol a capture system
03/22/2012US20120067519 Nacre composites, methods of synthesis, and methods of use
03/21/2012CN102388079A One-pack type cyanate-epoxy composite resin composition
03/21/2012CN102382611A Slow-binder for steel stranded wire
03/21/2012CN102382610A Binding-retarding agent for prestressed steel stranded wire
03/21/2012CN102382609A Adhesive for slow bonded prestressing reinforcing steel
03/21/2012CN102382608A Steel strand slow setting adhesive
03/21/2012CN102382607A Composite gluing material for quick leaking stoppage of pipelines
03/21/2012CN102382606A Graphene filling isotropic high-performance conducting adhesive and preparation method thereof
03/21/2012CN102382595A Modified montmorillonite and binder composite containing modified montmorillonite
03/21/2012CN102382590A Thermosetting adhesive tape or sheet
03/21/2012CN102382584A Slice for forming semiconductor chip protective film
03/21/2012CN102382581A An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
03/21/2012CN102382580A An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
03/21/2012CN102382579A Acrylic ester structural adhesive having high intensity and high thixotropy and preparation method thereof
03/21/2012CN101654004B Method for manufacturing CTI copper-clad laminate
03/21/2012CN101600295B Anisotropic conducting film and circuit board using same
03/21/2012CN101529590B Semiconductor electronic component and semiconductor device using the same
03/15/2012US20120064252 Cyclohexane oxidation process byproduct derivatives and methods for using the same
03/14/2012EP1448746B1 Hybrid adhesives, articles, and methods
03/14/2012CN102373030A Adhesive for retard-bonded steel stranded wire
03/14/2012CN102373029A Preparation method of rapid curing of flexible conductive adhesive under room temperature
03/08/2012WO2012029737A1 Adhesive composition for two-pack type laminate
03/08/2012WO2012029718A1 Method for disassembling bonded body, and adhesive
03/08/2012US20120059087 Pressure sensitive adhesives based on renewable resources and related methods
03/08/2012US20120055631 Heat curable epoxy resin composition with water as foaming agent
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