| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 04/13/2011 | CN102015953A Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device |
| 04/13/2011 | CN102015884A Conductive resin composition |
| 04/13/2011 | CN102010686A Double-solidification system fast-flowing underfill and preparation method thereof |
| 04/13/2011 | CN102010685A Epoxy resin conductive adhesive and preparation method thereof |
| 04/13/2011 | CN102010684A Bakelite cover adhesive for automatic generator |
| 04/13/2011 | CN102010680A Thermosetting type seam tape composition for seam sealing, seam tape and preparation method of seam tape |
| 04/13/2011 | CN102010679A Adhesive for connection of circuit member and semiconductor device using the same |
| 04/13/2011 | CN102010677A Thermosetting die bonding film, dicing die bonding film and semiconductor device |
| 04/13/2011 | CN102010572A Environment-friendly epoxy resin composition as well as preparation method and application thereof |
| 04/13/2011 | CN101323769B Resin paste for die bonding |
| 04/13/2011 | CN101274689B Electromagnetic inductive composite aluminum foil seal gasket and manufacturing process therefor |
| 04/12/2011 | US7922860 Manufacturing inkjet head by adhering with epoxy resins and alkyl imidazole |
| 04/07/2011 | WO2011040442A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 04/07/2011 | WO2011040438A1 Adhesive composition |
| 04/07/2011 | WO2011040399A1 Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate |
| 04/07/2011 | WO2011040064A1 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
| 04/07/2011 | WO2011039948A1 Adhesive resin composition for silicon wafers |
| 04/07/2011 | DE102010044116A1 Producing component, including e.g. sports equipment, comprises applying thermally hardenable, expandable adhesive film based on epoxide on the components, optionally joining components together and thermally heating joined components |
| 04/06/2011 | EP2303945A1 Uv cured high alpha linolenic acid linseed oil epoxy |
| 04/06/2011 | CN102007171A Adhesive formula and method for treating reinforcement inlays |
| 04/06/2011 | CN102007157A Polyurethane polymer based on amphiphilic block copolymers and its use as impact resistance modifier |
| 04/06/2011 | CN102002338A Preparation method of waterproof soyabean protein adhesive |
| 04/06/2011 | CN102002336A Solvent-free high-performance conductive adhesive |
| 04/06/2011 | CN102002327A Photo-curing type adhesive, optical pickup unit and manufacturing method thereof |
| 04/06/2011 | CN102002323A Adhesive film with dicing sheet and method of manufacturing the same |
| 03/31/2011 | WO2011036836A1 Solvent-free and one-pack type cyanic ester/epoxy composite resin composition |
| 03/31/2011 | US20110073344 Gasket containing carbon nanotubes |
| 03/30/2011 | EP2302013A1 Anisotropic conductive adhesive |
| 03/30/2011 | EP1954759B1 Curable compositions |
| 03/30/2011 | CN101993676A Hot melt adhesive |
| 03/30/2011 | CN101993670A Active group containing polyacrylate flexibilizer, preparation method thereof and epoxy resin adhesive modified by same |
| 03/30/2011 | CN101147210B Electroconductive joining material |
| 03/29/2011 | US7914641 Sealing material for flat panel display |
| 03/24/2011 | WO2011034070A1 Protective sheet for the backside of a solar cell, manufacturing method therefor, and solar cell module |
| 03/24/2011 | WO2011033743A1 Adhesive film, multilayer circuit board, electronic component, and semiconductor device |
| 03/24/2011 | US20110067813 Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 03/24/2011 | DE102009026548A1 Klebefolie oder Klebeband auf Basis von Epoxiden Adhesive foil or tape-based epoxies |
| 03/24/2011 | CA2774308A1 Adhesive film, multilayer circuit board, electronic component, and semiconductor device |
| 03/23/2011 | EP2297262A1 Silver coated flaky material filled conductive curable composition and the application in die attach |
| 03/23/2011 | CN101987947A Adhesive composition for halogen-free coverlay film and coverlay film coated by the same |
| 03/22/2011 | US7910656 Epoxy resin, a second epoxy resin modified with an acrylonitrile-butadiene rubber, a toughener; assembly of parts of a vehicle |
| 03/22/2011 | CA2446919C Hot-melt adhesive provided in the form of granulated material |
| 03/17/2011 | WO2011031429A1 Curable and cured adhesive compositions |
| 03/17/2011 | WO2011031399A1 Curable and cured adhesive compositions |
| 03/17/2011 | WO2011030621A1 Light-reflective anisotropic electroconductive adhesive agent and light-emitting device |
| 03/17/2011 | US20110064953 Assemblies and Methods for Reducing Warp and Bow of a Flexible Substrate During Semiconductor Processing |
| 03/16/2011 | EP2295486A1 Low temperature curable epoxy compositions containing phenolic-blocked urea curatives |
| 03/16/2011 | CN101985549A SMT (surface mounted technology) surface mount adhesive and preparation method thereof |
| 03/16/2011 | CN101985548A Refrigerating agent-resistant adhesive for high-voltage motor and preparation method thereof |
| 03/16/2011 | CN101985547A Single-component epoxy electronic potting adhesive capable of being stored at room temperature and preparation method thereof |
| 03/16/2011 | CN101985546A Magnetic conducting glue for turntable type test temperature sensor aluminum baffle plate |
| 03/16/2011 | CN101985513A POSS/epoxy nanometer hybrid material and preparation method and application thereof |
| 03/09/2011 | EP2292713A1 Flame-retardant adhesive composition and laminated film |
| 03/09/2011 | CN101454713B Liquid crystal sealing agent and liquid crystal display cell using the same |
| 03/03/2011 | WO2011025873A1 High performance adhesive compositions |
| 03/03/2011 | US20110054074 Adhesive |
| 03/03/2011 | DE102009028942A1 Induktiv aushärtbare Klebstoffzusammensetzung Inductively curable adhesive composition |
| 03/03/2011 | CA2772333A1 High performance adhesive compositions |
| 02/24/2011 | WO2011021441A1 Cationically polymerizable adhesive and polarizing plate obtained using same |
| 02/24/2011 | US20110043733 Adhesive polarization plate, image display and methods for manufacturing adhesive polarization plate and image display |
| 02/24/2011 | US20110042002 Fastening element for fastening to a base body and method for fastening said fastening element |
| 02/23/2011 | EP2285862A1 Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 02/23/2011 | EP1850351B1 Adhesive for circuit connection |
| 02/23/2011 | CN101979437A Phosphorus-nitrogen composite expanded composition and preparation method and application thereof |
| 02/22/2011 | US7892396 Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| 02/17/2011 | US20110039109 Activator for epoxy resin compositions |
| 02/17/2011 | US20110039108 High strength epoxy adhesive and use thereof |
| 02/17/2011 | US20110036497 Pumpable epoxy paste adhesives resistant to wash-off |
| 02/17/2011 | DE102009036082A1 Production of glass adhesive for use in restoring stained glass, involves removing fines from powdered glass, homogenising in a liquid dispersant and mixing the homogenised powder with an adhesive |
| 02/16/2011 | EP2283068A1 Thermally conductive composite material comprising aluminum powder, process for producing the composite material and use of the composite material |
| 02/16/2011 | CN101974304A Vinylester resin stone adhesive and preparation method thereof |
| 02/16/2011 | CN101974303A High-brightness impact-resistant aluminum epoxy repair adhesive and preparation method thereof |
| 02/16/2011 | CN101974302A Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive |
| 02/16/2011 | CN101974227A Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof |
| 02/16/2011 | CN101974143A Organic silicon modified epoxy acrylate aqueous dispersion and preparation method thereof |
| 02/16/2011 | CN101578010B Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate |
| 02/10/2011 | US20110034602 Thixotropic reactive composition |
| 02/10/2011 | DE102009028180A1 Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator A method of securing a magnet on or in a rotor or stator |
| 02/09/2011 | EP2282374A1 Circuit material |
| 02/09/2011 | EP2282365A1 Partially crosslinked adhesive-supported porous film for battery separator and its use |
| 02/09/2011 | EP2282328A1 Adhesive film |
| 02/09/2011 | EP2281015A1 Adhesive with a high resistance |
| 02/09/2011 | CN101970096A Microcapsules having a radiation-induced or thermal release |
| 02/09/2011 | CN101969244A Dry mica tape |
| 02/09/2011 | CN101967362A Special sealant with electrochemical activity for resisting crevice corrosion and preparation method thereof |
| 02/09/2011 | CN101967361A Composition of epoxy resin heat-conducting adhesive |
| 02/03/2011 | WO2011013663A1 Actinic-energy-ray-curable adhesive composition for plastic film or sheet |
| 02/03/2011 | WO2011012647A1 Epoxy resin-based compositions modified for impact resistance |
| 02/03/2011 | US20110024039 One-part epoxy-based structural adhesive |
| 02/02/2011 | CN101962527A Environment-friendly energy-saving carpet back rubber powder and production technology thereof |
| 02/02/2011 | CN101961936A Halogen-free fire-retarding dry mica tape |
| 02/02/2011 | CN101961935A Corona-resistant slight-glue mica tape and adhesive therefor |
| 02/02/2011 | CN101290950B Back film of solar cell and preparing technique thereof |
| 02/01/2011 | US7879956 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 01/27/2011 | WO2011010047A1 Two part epoxy adhesive system having improved open time |
| 01/27/2011 | WO2011009984A1 Resin with high heat transfer |
| 01/27/2011 | US20110021005 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device |
| 01/27/2011 | DE102009027825A1 Katalyse von Epoxidharzformulierungen mit schwerlöslichen Katalysatoren Catalysis of epoxy resin formulations with sparingly soluble catalysts |
| 01/26/2011 | EP1948735B1 Flame retardant prepregs and laminates for printed circuit boards |
| 01/26/2011 | CN101959796A Silica and also epoxy resins |