| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
|---|
| 06/07/2012 | WO2012073851A1 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 06/07/2012 | WO2012073703A1 Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| 06/07/2012 | WO2012073672A1 Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| 06/07/2012 | WO2012016258A3 Adhesive for fixing and/or embedding an electronic component and method and use |
| 06/07/2012 | US20120141803 Curable and cured adhesive compositions |
| 06/06/2012 | EP2459613A1 Epoxy resin-based compositions modified for impact resistance |
| 06/06/2012 | CN102485822A Photocuring adhesive and its preparation method |
| 06/06/2012 | CN101767556B Composite automobile bumper |
| 05/31/2012 | WO2012070871A2 Adhesive composition |
| 05/31/2012 | US20120133061 Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| 05/31/2012 | DE102007043559B4 Verwendung eines lichthärtenden thermoplastischen Epoxidharzklebstoffs zum Blocken oder Kleben von optischen Bauelementen Using a light-curing epoxy resin adhesive thermoplastic to block or bonding of optical components |
| 05/30/2012 | EP2457971A1 Resin with high heat transfer |
| 05/30/2012 | EP2456805A1 Two part epoxy adhesive system having improved open time |
| 05/30/2012 | CN1908105B Aqueous compositions for use as adhesive and composite structure |
| 05/30/2012 | CN102482553A Light-reflective anisotropic electroconductive adhesive agent and light-emitting device |
| 05/30/2012 | CN102482548A 固化性和固化的粘合剂组合物 And curing the curable adhesive composition |
| 05/30/2012 | CN102482547A Hydrocarbon adhesive composition and method for treating substrate surface using same |
| 05/30/2012 | CN102478067A Bearing consisting of carbon/carbon composite and aluminum or copper alloy and manufacturing method thereof |
| 05/30/2012 | CN102477271A 一种环氧密封胶及其制备方法 An epoxy sealant and preparation method |
| 05/30/2012 | CN102477270A 一种耐水性快速固化胶黏剂 One kind of fast-curing adhesive water resistance |
| 05/30/2012 | CN101942072B Synthetic method of epoxy acrylate |
| 05/30/2012 | CN101877258B Plate-shaped suspension type bi-insulation composite insulator |
| 05/30/2012 | CN101792641B Environment-friendly adhesive for quickly adhering aluminum alloy and PVC thin film, preparation and application thereof |
| 05/30/2012 | CN101714513B Method for producing the semiconductor device |
| 05/30/2012 | CN101665674B Single-component thread locking epoxy precoated adhesive and preparation method thereof |
| 05/30/2012 | CN101619201B Underwater epoxy adhesive and preparation method thereof |
| 05/30/2012 | CN101536172B Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, manufacture methods thereof |
| 05/30/2012 | CN101457133B Lead accumulator epoxy resin sealant and preparation method thereof |
| 05/30/2012 | CN101402831B Thermal-activated adhesive film and method of producing the same |
| 05/30/2012 | CN101166789B Composition containing fluorine-containing aromatic polymer and laminated body containing fluorine-containing aromatic polymer |
| 05/24/2012 | WO2012065819A1 Method for manufacturing wheelchairs and wheelchair manufactured by said method |
| 05/24/2012 | US20120129980 Structural adhesive compositions |
| 05/24/2012 | US20120128987 Epoxy resin-based composition modified for impact resistance |
| 05/24/2012 | US20120128499 Structural adhesive compositions |
| 05/23/2012 | CN102473619A Film for semiconductor and semiconductor device manufacturing method |
| 05/23/2012 | CN102471664A Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same |
| 05/23/2012 | CN102471661A Adhesive composition and endoscope |
| 05/23/2012 | CN102471660A Cationically polymerizable adhesive and polarizing plate obtained using same |
| 05/23/2012 | CN102471659A 将磁体粘附于转子或定子之上或之中的方法 The magnets on the rotor or the stator is adhered to or within a method |
| 05/23/2012 | CN102471642A Actinic-energy-ray-curable adhesive composition for plastic film or sheet |
| 05/23/2012 | CN102471561A 用于电工用层压板组合物的核/壳橡胶 For electrical laminates composition for core / shell rubber |
| 05/23/2012 | CN102471560A Energy ray-curable epoxy resin composition having excellent curing properties in deep portions |
| 05/23/2012 | CN102471495A Aluminum chelate-based latent curing agent |
| 05/23/2012 | CN102471461A Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/23/2012 | CN102471459A 抗冲击性改进的基于环氧树脂的组合物 Improved impact resistance of the compositions based on epoxy resins |
| 05/23/2012 | CN102471456A 快速固化性优异的能量射线固化型环氧树脂组合物 Rapid curability energy-ray-curable epoxy resin composition |
| 05/23/2012 | CN102464964A Adhesive composition |
| 05/23/2012 | CN102464954A Composite adhesive sheet, film comprising same and manufacturing method of film |
| 05/23/2012 | CN102464861A 一种修复管道碳纤维复合材料体系及应用 A carbon fiber composite pipeline system and application fixes |
| 05/23/2012 | CN101824152B Preparation method and application of resin having double curing groups |
| 05/23/2012 | CN101598261B Abrasion resistant material featuring ceramic embedded in metal and preparation method thereof |
| 05/23/2012 | CN101418201B Adhesive composite for flexible circuit board |
| 05/23/2012 | CN101328274B Sticking method of crystalloid resin forming body |
| 05/23/2012 | CN101240154B Single-component high peel strength epoxy resin adhesive and preparation method thereof |
| 05/18/2012 | WO2012063895A1 Composition for vulcanizing adhesion |
| 05/18/2012 | WO2012063804A1 Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure |
| 05/18/2012 | WO2012063641A1 Inkjet head and method for producing inkjet head |
| 05/17/2012 | US20120123023 (meth)acrylate polymer, a resin composition and a shaped article |
| 05/17/2012 | US20120121913 Adhesive composition |
| 05/16/2012 | EP2453469A1 Film for semiconductor and semiconductor device manufacturing method |
| 05/16/2012 | EP2452964A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these |
| 05/16/2012 | EP2451872A1 Core/shell rubbers for use in electrical laminate compositions |
| 05/16/2012 | CN102460669A Insulating resin film, bonded body using insulating resin film, and method for manufacturing bonded body |
| 05/16/2012 | CN102459489A Adhesive composition, bonding method, laminate and tire |
| 05/16/2012 | CN102459488A 水性粘接剂组合物 The aqueous adhesive composition |
| 05/16/2012 | CN102453460A Asphalt felt binder as well as preparation and application thereof |
| 05/16/2012 | CN102453458A Nano rubber modified room temperature cured high temperature resistant structure adhesive |
| 05/16/2012 | CN102453457A Novel epoxy reins adhesive |
| 05/16/2012 | CN102453225A Thermosetting resin composition and its application in prepreg film or laminated plate |
| 05/10/2012 | US20120115992 Adhesive system and method of producting a wood based product |
| 05/10/2012 | US20120115988 Catalysis of epoxy resin formulations having sparingly soluble catalysts |
| 05/10/2012 | US20120111499 Nanoscale superparamagnetic poly(meth)acrylate polymers |
| 05/10/2012 | US20120111497 Complex epoxy resin adhesive added with carbon nanotubes and method of using the same |
| 05/09/2012 | CN102449093A Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| 05/09/2012 | CN102447168A Adhesive film, and connection structure and connecting method for circuit member |
| 05/09/2012 | CN102443373A Electrical connection material and a solar cell including the same |
| 05/09/2012 | CN102443372A Electron beam solidified epoxy resin conductive adhesive and preparation method thereof |
| 05/09/2012 | CN102443371A Hard splicing-locking stuffing and preparation method thereof |
| 05/09/2012 | CN102443370A Low-halogen high-conductivity single-ingredient conductive gum |
| 05/09/2012 | CN101503608B Phenolic epoxy resin system conductive adhesive and preparation thereof |
| 05/09/2012 | CN101418205B Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate |
| 05/09/2012 | CN101402839B Adhesion agent for aluminum cellular composite board and method of producing the same |
| 05/09/2012 | CN101358121B Preparation method of high temperature resistant epoxy adhesive capable of room temperature curing |
| 05/03/2012 | WO2012056629A1 Resin composition |
| 05/03/2012 | WO2011140402A3 Potting for electronic components |
| 05/03/2012 | US20120108762 Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus |
| 05/03/2012 | US20120103517 Heat-resistant structural epoxy resins |
| 05/03/2012 | DE102011075401A1 Adhesive, which is curable by UV radiation, useful for bonding components in optical systems e.g. lighting devices, comprises an epoxide resin, a reactive diluent, an adhesion promoter, a UV polymerization initiator, and nanoscale filler |
| 05/02/2012 | CN102435103A Bullet-proof and stab-resistant clothes and preparation method thereof |
| 05/02/2012 | CN102435102A Bullet-proof and stab-resistant clothes and preparation method thereof |
| 05/02/2012 | CN102433099A Preparation method of emulsification compatibilization soybean protein adhesive |
| 05/02/2012 | CN102433098A Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method |
| 05/02/2012 | CN102433097A Heat-resistant adhesive |
| 05/02/2012 | CN102433090A Water-based environmentally-friendly energy-saving lamp casting rubber and preparation method thereof |
| 05/02/2012 | CN102433087A High-temperature-resistant paper-plastic laminating adhesive and preparation method thereof |
| 05/02/2012 | CN102432835A Curable compositions |
| 05/02/2012 | CN101602926B Room temperature curing epoxy adhesive and preparation method thereof |
| 04/26/2012 | WO2012054685A2 Fluoroelastomer bonding compositions suitable for high-temperature applications |
| 04/26/2012 | WO2012053661A1 High-molecular-weight epoxy resin and resin film, resin composition, and cured article using high-molecular-weight epoxy resin |
| 04/26/2012 | WO2012053589A1 Adhesive composition, method for producing semiconductor device, and semiconductor device |