| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 07/05/2012 | US20120172481 Photocurable adhesive composition, module apparatus using the same, and method of assembling a module |
| 07/05/2012 | US20120172477 Photocurable adhesive composition |
| 07/05/2012 | US20120171915 Acrylic Compositions Adhering to Low Surface Energy Substrates |
| 07/05/2012 | US20120171484 Dual Crosslinked Tackified Pressure Sensitive Adhesive |
| 07/05/2012 | US20120171362 Hydrocarbon adhesive composition and method for treating substrate surface using same |
| 07/05/2012 | US20120168814 Adhesive composition |
| 07/05/2012 | CA2823342A1 Structural hybrid adhesives |
| 07/04/2012 | CN102549102A Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 07/04/2012 | CN102549097A Thermosetting adhesive composition, thermosetting adhesive sheet, method for producing same, and reinforced flexible printed wiring board |
| 07/04/2012 | CN102549091A Adhesive film, multilayer circuit board, electronic component, and semiconductor device |
| 07/04/2012 | CN102533210A Automobile windshield sealing glue |
| 07/04/2012 | CN102533195A Anisotropic conductive film |
| 07/04/2012 | CN102533194A Layered silicate intercalation composite adhesive for wind-driven generator blade and preparation method thereof |
| 07/04/2012 | CN102533193A Bi-component epoxy resin construction adhesive and preparation method thereof |
| 07/04/2012 | CN102533192A Flame retardant high-heat-conductivity epoxy resin electronic adhesive glue |
| 07/04/2012 | CN102533191A High temperature-resistant halogen-free ion migration-resistant epoxy resin adhesive |
| 07/04/2012 | CN102533190A Carbon nano-tube compound epoxy resin adhesive and application method thereof |
| 07/04/2012 | CN102533189A Wet-heat resisting automobile folding adhesive and preparation method thereof |
| 07/04/2012 | CN102533170A Adhesive composition for semiconductor and adhesive film with the same |
| 07/04/2012 | CN102533166A Bonding film composition used for semiconductor assembly and bonding film formed by the same |
| 07/04/2012 | CN102533165A Plastic binder and production method thereof |
| 07/04/2012 | CN102533148A Cutting chip bonding film, composition used for cutting chip bonding film and semiconductor device |
| 07/04/2012 | CN102533146A Adhesive film for semiconductor device |
| 07/04/2012 | CN102532809A Organosilicon-epoxy resin composition and preparation method thereof |
| 07/04/2012 | CN102532483A Thermosetting resin compound containing carboxyl modified polyurethane resin |
| 07/04/2012 | CN101928541B UV curable adhesive |
| 07/04/2012 | CN101792576B Epoxy acrylate prepolymer resin, preparation method thereof and application thereof in bicomponent structural adhesive |
| 07/04/2012 | CN101638567B High-temperature curing high-strength solid epoxy adhesive toughened by butyronitrile and preparation method thereof |
| 07/04/2012 | CN101550325B Wind-power class bi-component epoxy adhesive and preparation method thereof |
| 07/04/2012 | CN101544064B Intelligent structure self-healing method and health monitoring system based on light repairing technology |
| 07/04/2012 | CN101525466B Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof |
| 07/04/2012 | CN101440267B Adhesive for shock resistance structure of automobile |
| 06/28/2012 | WO2012088163A2 Method for preparing a conformally sealed printed wiring board using a coated substrate comprising a curable epoxy composition comprising imidazolium salts |
| 06/28/2012 | WO2012087546A1 Curable adhesive composition |
| 06/28/2012 | WO2012086445A1 Anaerobically curable composition |
| 06/28/2012 | WO2012084959A1 Storage-stable heat-curable granular material mixture |
| 06/28/2012 | WO2012084806A2 Heat-curing sealant compositions having fast skin formation and high tensile strength |
| 06/28/2012 | US20120161355 Self-repairing concrete having polyurethane polymer micro-capsules and method for fabricating the same |
| 06/28/2012 | DE112010000826T5 Elektrisches Stromspeichersystem unter Verwendung von Wasserstoff und Verfahren zum Speichern von elektrischem Strom unter Verwendung von Wasserstoff Electric power storage system using hydrogen and method for storing electric power by using hydrogen |
| 06/27/2012 | EP2468835A1 Cationically polymerizable adhesive and polarizing plate obtained using same |
| 06/27/2012 | EP2468834A1 Heat-curing sealant compositions with fast skinning and high tensile strength |
| 06/27/2012 | EP2468794A1 Storage-stable and heat -curable mixture of granulates |
| 06/27/2012 | EP2468792A1 Curable adhesive composition |
| 06/27/2012 | EP2226347B1 Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 06/27/2012 | CN102516922A Embedded sleeve anchoring adhesive, and preparation method and application thereof |
| 06/27/2012 | CN102516919A Preparation method of monocomponent polyurethane flocking adhesive |
| 06/27/2012 | CN102516916A Liquid crystal sealant composition |
| 06/27/2012 | CN102516915A Preparation method of modified cross-linked bisphenol A reinforcement adhesive for ballastless track mortar defect repair |
| 06/27/2012 | CN102516914A Halogen-free flame-retardant epoxy resin electronic pouring sealant |
| 06/27/2012 | CN102516913A Environment-friendly flame-retardant fold adhesive and preparation method thereof |
| 06/27/2012 | CN102516912A Method for preparing composite curing agent modified bisphenol F thermosetting adhesive repairing agent special for ballastless track gap and crack damage |
| 06/27/2012 | CN102516894A Special structure film for mirror seat of rear-view mirror in automobile and preparation method thereof |
| 06/27/2012 | CN102516866A Ultraviolet light curing material |
| 06/27/2012 | CN102516717A Thermoplastic elastomer toughened epoxy resin, its preparation and its application |
| 06/27/2012 | CN102516714A Preparation method of nano epoxy resin composite material |
| 06/27/2012 | CN102516500A Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof |
| 06/27/2012 | CN102079956B White covering film and manufacturing method thereof |
| 06/27/2012 | CN102010680B Thermosetting type seam tape composition for seam sealing, seam tape and preparation method of seam tape |
| 06/27/2012 | CN101969244B Dry mica tape |
| 06/27/2012 | CN101880514B Single-component under-filler with favorable repairing property and preparation method thereof |
| 06/27/2012 | CN101770171B Photosensitive composition, sealing structure and manufacturing method of sealing structure |
| 06/27/2012 | CN101767558B Compound rear protective plate of truck |
| 06/27/2012 | CN101608106B Room-temperature curing adhesive for insulator sleeve adhesion |
| 06/27/2012 | CN101580686B Epoxide resin pouring sealant with low density and high impact resistance and preparation method thereof |
| 06/27/2012 | CN101525439B Modified epoxide resin for structural adhesive of wind generating blades and preparation method thereof |
| 06/27/2012 | CN101440268B Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof |
| 06/21/2012 | WO2012081842A2 Adhesive composition for semiconductors, adhesive film using same, and uses thereof |
| 06/21/2012 | WO2012081771A1 Adhesive composition for a semiconductor, an adhesive film comprising the same and a semiconductor package using the same |
| 06/21/2012 | WO2012081243A1 Radiation curable adhesive and back surface-protecting sheet for solar batteries |
| 06/21/2012 | US20120156501 Curable and cured adhesive compositions |
| 06/21/2012 | US20120153513 Thermosetting encapsulation adhesive sheet |
| 06/21/2012 | US20120153230 Method for producing latent curing agent |
| 06/21/2012 | US20120152459 Styrene-Acrylic-Based Binders and Methods of Preparing and Using Same |
| 06/20/2012 | EP1886800B1 Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure |
| 06/20/2012 | CN102510661A Anisotropic electroconductive film and circuit board using same |
| 06/20/2012 | CN102504745A Double curing encapsulating adhesive and preparation method thereof |
| 06/20/2012 | CN102504744A Adhesive for temporary bonding and preparation method thereof |
| 06/20/2012 | CN102504743A Single-component underfill capable of being stored at room temperature and preparation method thereof |
| 06/20/2012 | CN102504742A Bonding glue quickly solidified at room temperature |
| 06/20/2012 | CN102504741A High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) |
| 06/20/2012 | CN102504740A Bonder for KT (Karat) board for advertisement |
| 06/20/2012 | CN102504739A Adhesive for retarded adhesive steel strand |
| 06/20/2012 | CN102504738A Quick mending agent |
| 06/20/2012 | CN102504205A Preparation method for epoxy hardener resistant to boiling water boiling |
| 06/20/2012 | CN101768327B Halogen-free bonding film and resin used for same |
| 06/20/2012 | CN101293960B Polyamine composition |
| 06/19/2012 | US8202920 Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
| 06/19/2012 | US8202622 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
| 06/14/2012 | WO2012077710A1 Bush- and bracket-integrated stabilizer bar |
| 06/14/2012 | WO2012077377A1 Resin composition |
| 06/13/2012 | EP2462202A2 Method for attaching a magnet on or in a rotor or stator |
| 06/13/2012 | CN102498578A Protective sheet for the backside of a solar cell, manufacturing method therefor, and solar cell module |
| 06/13/2012 | CN102498184A High performance adhesive compositions |
| 06/13/2012 | CN102492387A High-strength wind energy blade splicing structural adhesive |
| 06/13/2012 | CN102492386A Epoxy resin adhesive for binding polyethylene wood-plastic composite material |
| 06/13/2012 | CN102492376A Method for preparing perchlorovinyl conductive adhesive dried quickly at room temperature |
| 06/13/2012 | CN102490412A Halogen-free environment-friendly copper-clad foil plate and preparation method thereof |
| 06/13/2012 | CN101544879B Preparation method for high strength solventless epoxy adhesive |
| 06/13/2012 | CN101486883B Adhesive composition used for non-halogen coating and coating using the same |
| 06/13/2012 | CN101205444B Adhesive film composition, associated dicing die bonding film, and die package |