| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 08/08/2012 | CN102627932A High temperature resistant epoxy-imine resin adhesive and preparation method thereof |
| 08/08/2012 | CN102627931A Pre-catalytic bonding glue and preparation method thereof |
| 08/08/2012 | CN102627930A Epoxy structural adhesive for wind wheel blades and its preparation method |
| 08/08/2012 | CN102627929A Underfill flowable at room temperature and rapidly solidified at low temperature, and preparation method thereof |
| 08/08/2012 | CN102627928A Low temperature curing adhesive for camera modules, and preparation method thereof |
| 08/08/2012 | CN102627753A Epoxy resins comprising a cycloalphatic diamine curing agent |
| 08/08/2012 | CN102627752A Preparation method for waterborne epoxy resin emulsion |
| 08/07/2012 | US8236872 Adhesive composition and optical member |
| 08/02/2012 | WO2012102079A1 Electrically conductive adhesive composition, connector and solar cell module |
| 08/02/2012 | WO2012102077A1 Conductive adhesive composition, connector, and solar cell module |
| 08/02/2012 | WO2012102076A1 Conductive binder composition, metal wire with conductive binder, bonded unit, and solar cell module |
| 08/02/2012 | WO2012101869A1 Conductive binder composition and method for producing the same, bonded unit, and solar cell module and method for producing the same |
| 08/02/2012 | US20120196404 Adhesive Compositions for a Semiconductor, an Adhesive Sheet for a Semiconductor and a Production Method of a Semiconductor Device |
| 08/02/2012 | US20120196075 Resin composition, semiconductor wafer bonding product and semiconductor device |
| 08/02/2012 | US20120193015 Specular coatings for composite structures |
| 08/01/2012 | EP1524307B1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 08/01/2012 | CN102618207A Bi-component polysulfide sealant and preparation method thereof |
| 08/01/2012 | CN102618201A Enhanced vibration-proof adhesive with following property and preparation method thereof |
| 08/01/2012 | CN102618200A Organosilicone-epoxy-polyimide adhesive and preparation method thereof |
| 08/01/2012 | CN102618199A Anti-cracking green adhesive for ceiling decoration seams |
| 08/01/2012 | CN102618195A Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
| 07/26/2012 | WO2012099256A1 Adhesive agent composition and laminated body |
| 07/26/2012 | US20120189845 Semiconductor device manufacturing method |
| 07/25/2012 | EP2479801A1 Protective sheet for the backside of a solar cell, manufacturing method therefor, and solar cell module |
| 07/25/2012 | EP2479233A1 Light-reflective anisotropic electroconductive adhesive agent and light-emitting device |
| 07/25/2012 | EP2479228A1 Adhesive film, multilayer circuit board, electronic component, and semiconductor device |
| 07/25/2012 | CN202346951U Epoxy coal asphalt cold winding belt |
| 07/25/2012 | CN102604578A Grouting material for reinforcing underwater concrete crack |
| 07/25/2012 | CN102604577A Flexibility-regulable epoxy resin adhesive and preparation method thereof |
| 07/25/2012 | CN102604558A Heat-resistant laminated-positioning electronic adhesive tape for solar cell and preparation method thereof |
| 07/25/2012 | CN102604512A Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate |
| 07/25/2012 | CN102604046A DMP-30 (dimethyl phthalate-30) closing method and application of DMP-30 in epoxy adhesive |
| 07/25/2012 | CN102050930B Photocurable resin composition containing anthraquinone derivative |
| 07/25/2012 | CN101797825B Copper-clad laminate suitable for high-order high density interconnect build-up multilayer and preparation method thereof |
| 07/25/2012 | CN101698772B Preparation method of glass sealant primer |
| 07/25/2012 | CN101679828B Heat-resistant structural epoxy resins |
| 07/25/2012 | CN101654005B Method for manufacturing halogen-free FR-4 copper-clad laminate |
| 07/25/2012 | CN101503607B High strength glass fibre reinforced plastic adhesive and preparation |
| 07/25/2012 | CN101412896B Bicomponent epoxy adhesive and preparation thereof |
| 07/19/2012 | WO2012096206A1 Process for production of polymer member |
| 07/19/2012 | US20120181709 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor device using the same |
| 07/18/2012 | EP2477224A2 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties |
| 07/18/2012 | EP2476549A1 Steel material composite and manufacturing method thereof |
| 07/18/2012 | EP2475731A1 Curable and cured adhesive compositions |
| 07/18/2012 | EP2475730A1 Curable and cured adhesive compositions |
| 07/18/2012 | CN1962798B Epoxy resin adhesive composition and optical semiconductor adhesive adopting same |
| 07/18/2012 | CN102598419A Circuit connecting material and connection structure for circuit member using same |
| 07/18/2012 | CN102598236A Adhesive composition |
| 07/18/2012 | CN102598235A Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
| 07/18/2012 | CN102597044A Thermopolymerization initiator system and adhesive composition |
| 07/18/2012 | CN102585746A Metal wear resistant repairing composite coating material and preparation method of metal wear resistant repairing composite coating material |
| 07/18/2012 | CN102585745A Frame sealing adhesive, and preparation method and application thereof |
| 07/18/2012 | CN102585744A Adhesive composition and preparation method and application thereof in silk-screen printing |
| 07/18/2012 | CN102585743A Conductive adhesive and preparation method thereof |
| 07/18/2012 | CN102585709A Adhesive composition, film-like adhesive and connection structure for circuit member |
| 07/18/2012 | CN102585438A Epoxy resin composition for encapsulation and electronic component device |
| 07/18/2012 | CN102585437A High heat-resisting epoxy resin compound and bonding sheet and copper clad laminate made from same |
| 07/18/2012 | CN102585170A Light-curing resin composition and optical material |
| 07/18/2012 | CN102582206A Preparation method of copper-clad plate made from nano composite plastic |
| 07/18/2012 | CN102582176A Mica tape for motor and preparation method of mica tape |
| 07/18/2012 | CN101974143B Organic silicon modified epoxy acrylate aqueous dispersion and preparation method thereof |
| 07/18/2012 | CN101790564B Saturated polyester resin composition and hot melt adhesive composition |
| 07/18/2012 | CN101743288B Detachable adhesive containing reaction product of oxidizing agent and amine compound |
| 07/18/2012 | CN101575489B White adhesive for flexible printed circuit and preparation method thereof |
| 07/18/2012 | CN101553545B Bonding method and adhesive resin composition |
| 07/18/2012 | CN101278027B Anisotropic conductive adhesive |
| 07/18/2012 | CN101120043B Surfacing and/or joining method |
| 07/18/2012 | CA2764095A1 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties |
| 07/12/2012 | WO2012093510A1 Resin composition |
| 07/12/2012 | US20120178853 Solventless one liquid type cyanate ester-epoxy composite resin composition |
| 07/11/2012 | EP2473573A1 High performance adhesive compositions |
| 07/11/2012 | CN102575139A Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
| 07/11/2012 | CN102575138A Curable and cured adhesive compositions |
| 07/11/2012 | CN102575137A Adhesive resin composition for silicon wafers |
| 07/11/2012 | CN102574987A Solvent-free and one-pack type cyanic ester/epoxy composite resin composition |
| 07/11/2012 | CN102574985A Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate |
| 07/11/2012 | CN102574366A Composite member |
| 07/11/2012 | CN102559136A High-performance thermosetting epoxy asphalt binder and preparation method thereof |
| 07/11/2012 | CN102559134A Tung oil based material for solar battery packaging and packaging method and application thereof |
| 07/11/2012 | CN102559121A Ultraviolet (UV)/moisture dual-cured laminated adhesive and preparation method thereof |
| 07/11/2012 | CN102559120A Temperature-resistant, corrosion-resistant and high-adhesion adhesive and preparation method thereof |
| 07/11/2012 | CN102559119A One-component epoxy encapsulating adhesive with good rheological stability and preparation method thereof |
| 07/11/2012 | CN102559118A High-temperature-resistant conductive adhesive and preparation method thereof |
| 07/11/2012 | CN102559117A High-thixotropy epoxy encapsulating adhesive |
| 07/11/2012 | CN102559116A High-heat-conduction low-voltage-resistance epoxy resin potting adhesive |
| 07/11/2012 | CN102559115A Chip-level bottom filling adhesive and preparation method thereof |
| 07/11/2012 | CN102559114A Conductive adhesive, and circuit board and electronic component module using the same |
| 07/11/2012 | CN102559113A Adhesive Resin Composition, Its Cured Product And Adhesive Film |
| 07/11/2012 | CN102559096A Adhesive used for bonding inner-layer plate frame and outer-layer plate frame of automobile |
| 07/11/2012 | CN102559092A Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method |
| 07/11/2012 | CN102559077A Usage of adhesive film as circuit-connecting material and usage of adhesive film in manufacturing circuit-connecting material |
| 07/11/2012 | CN102558861A Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same |
| 07/11/2012 | CN102558765A Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| 07/11/2012 | CN102558502A Epoxy resin with adjustable thermal degradation temperature and preparation method thereof |
| 07/10/2012 | US8217096 Photocurable pressure-sensitive adhesive composition |
| 07/10/2012 | US8216684 Electronics; composite films |
| 07/05/2012 | WO2012091306A2 Adhesive composition for semiconductors, and adhesive film using same |
| 07/05/2012 | WO2012088693A1 Exterior thermal insulation system |
| 07/05/2012 | WO2012042543A3 Adhesive composition and uses thereof |
| 07/05/2012 | US20120172495 Underfill for high density interconnect flip chips |