| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 09/20/2012 | US20120237774 Polyamides and Amidoamines From Selectively Modified Amine Amines |
| 09/19/2012 | EP2500932A1 Adhesive composition |
| 09/19/2012 | CN102686691A Polyester adhesive composition |
| 09/19/2012 | CN102686690A Circuit connection material, connection structure using same, and temporary pressure-bonding method |
| 09/19/2012 | CN102686689A Adhesive composition for polarizing plate and polarizing plate using the same |
| 09/19/2012 | CN102676112A Low-temperature curing cyanate ester adhesive and preparation method thereof |
| 09/19/2012 | CN102676109A Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate |
| 09/19/2012 | CN102676108A Water absorbent adhesive |
| 09/19/2012 | CN102676107A High-power LED encapsulation glue adopting organosilicon modified cycloaliphatic epoxide resin |
| 09/19/2012 | CN102676106A High-temperature-resistant adhesive foil composite adhesive for precision metal foil resistance chip and preparation method thereof |
| 09/19/2012 | CN102676105A High thermal conductivity membrane adhesive, adhesive composition and semiconductor package using the adhesive and manufacturing method thereof |
| 09/19/2012 | CN102676104A Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties |
| 09/19/2012 | CN102676103A Porcelain imitated adhesive |
| 09/19/2012 | CN102676102A Silver nanowire doped conductive silver colloid and preparation method thereof |
| 09/19/2012 | CN102676093A Die-bonding film and use thereof |
| 09/19/2012 | CN102676092A Adhesive, adhesive sheet and electronic device |
| 09/19/2012 | CN102676082A Fiber, fiber aggregate and adhesive having the same |
| 09/19/2012 | CN102676040A Solar component circuit protective agent and battery piece connecting structure applying same |
| 09/19/2012 | CN102675797A Aqueous polymer dispersio, composition comprising the same, and method for forming aqueous polymer dispersion of multi-stage polymeric particles |
| 09/19/2012 | CN102675488A Bicomponent free radical type visible light initiation system and application thereof |
| 09/19/2012 | CN102673048A Method for manufacturing high-thermal-conductivity aluminum-based copper clad plate |
| 09/19/2012 | CN101570674B Halogen-free flame retardant type bonding agent composition |
| 09/18/2012 | US8268104 Methods of using UV curing cationic epoxy for windshield repair |
| 09/13/2012 | WO2012121822A1 Polyether hybrid epoxy curatives |
| 09/13/2012 | WO2012121336A1 Adhesive for electronic components, and manufacturing method for semiconductor chip mount |
| 09/13/2012 | WO2012120997A1 Double-coated adhesive tape |
| 09/13/2012 | US20120232189 Energetic Adhesive for Venting Cookoff |
| 09/13/2012 | DE102011013645A1 Epoxidharzsystem mit visueller Kontrolle des Aushärtezustandes Epoxy resin system with visual control of Aushärtezustandes |
| 09/13/2012 | CA2828693A1 Polyether hybrid epoxy curatives |
| 09/12/2012 | EP2496657A1 Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes |
| 09/12/2012 | CN102666762A Protective sheet for coating film |
| 09/12/2012 | CN102666723A Single-component epoxy resin composition and use thereof |
| 09/12/2012 | CN102666722A One-pack type liquid epoxy resin composition and adhesion method using same |
| 09/12/2012 | CN102660218A Hydrolysable adhesive |
| 09/12/2012 | CN102660213A Surface treatment method for heat-conducting filler for epoxy heat-conducting adhesive |
| 09/12/2012 | CN102660212A Single-component epoxy heat-conducting adhesive |
| 09/12/2012 | CN102660211A Modified epoxy adhesive for aramid paper honeycomb |
| 09/12/2012 | CN102660210A Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof |
| 09/12/2012 | CN102660201A Optical member comprising anisotropic conductive film |
| 09/07/2012 | WO2012117759A1 Thermosetting composition, adhesive film, and multilayer printed circuit board |
| 09/07/2012 | WO2012091306A3 Adhesive composition for semiconductors, and adhesive film using same |
| 09/07/2012 | WO2012081842A3 Adhesive composition for semiconductors, adhesive film using same, and uses thereof |
| 09/06/2012 | US20120222889 Polyamideimide adhesives for printed circuit boards |
| 09/05/2012 | EP2495271A1 Polyether hybrid epoxy curatives |
| 09/05/2012 | CN102653668A Silver conductive adhesive for LED (Light Emitting Diode) encapsulation and preparation method thereof |
| 09/05/2012 | CN102653666A Method for preparing hot melt adhesive |
| 09/05/2012 | CN102653623A Epoxy resin imbibed polymer particles |
| 09/05/2012 | CN101993670B Preparation method of active group containing polyacrylate flexibilizer |
| 09/05/2012 | CN101864261B Amphiphilic block copolymer-modified epoxy resin and adhesives made therefrom |
| 09/05/2012 | CN101650331B Enzyme bioelectrochemical sensing chip and preparation method thereof |
| 09/05/2012 | CN101547990B Pumpable epoxy paste adhesives resistant to wash-off |
| 09/05/2012 | CN101215452B Nano luminous epoxy adhesive and preparation method thereof |
| 09/04/2012 | US8257528 Substrate joining method and 3-D semiconductor device |
| 08/30/2012 | WO2012114613A1 Thermally conductive adhesive |
| 08/30/2012 | WO2012013330A3 Oriented structural adhesives |
| 08/29/2012 | EP2492331A1 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor devices using same |
| 08/29/2012 | EP2491088A2 Impact resistant two-component epoxy-based substance curing at room temperature |
| 08/29/2012 | CN102652164A Resin composition for aqueous adhesive, aqueous adhesive, adhesive sheet, and method for producing composition for aqueous adhesive |
| 08/29/2012 | CN102649899A Conductive elargol and production method thereof |
| 08/29/2012 | CN101914265B Non-halogen phosphorus-containing flame retardant high-frequency epoxy resin composition and application thereof to bonding sheet and copper-clad plate |
| 08/29/2012 | CN101564929B Method for preparing low-shrinkage-factor copper clad laminate by applying nano-stuffing |
| 08/29/2012 | CN101358052B Polymer binder for water-scraped without set-off intaglio ink composition |
| 08/23/2012 | WO2012110230A1 Improved structural adhesives |
| 08/23/2012 | WO2012091842A3 Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds |
| 08/23/2012 | WO2012084806A3 Heat-curing sealant compositions having fast skin formation and high tensile strength |
| 08/23/2012 | US20120214002 One-pack type liquid epoxy resin composition and adhesion method using same |
| 08/23/2012 | US20120213993 Adhesive composition and adhesive dry film |
| 08/23/2012 | US20120211161 Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes |
| 08/23/2012 | US20120211160 Adhesive compositions containing graphenic carbon particles |
| 08/22/2012 | EP2489712A1 Protective sheet for coating film |
| 08/22/2012 | CN102648262A Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes |
| 08/22/2012 | CN102643621A Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof |
| 08/22/2012 | CN101979437B Phosphorus-nitrogen composite expanded composition and preparation method and application thereof |
| 08/22/2012 | CN101608105B Adhesive for packaging smart card module |
| 08/16/2012 | WO2012107556A2 Electrically conductive adhesives comprising at least one metal precursor |
| 08/16/2012 | WO2011141148A3 Improvements in or relating to structural adhesives |
| 08/15/2012 | EP2487215A1 Electrically conductive adhesives comprising at least one metal precursor |
| 08/15/2012 | EP2486070A1 Increase in the toughness of a material achieved by means of a curable composition including at least one vinyl ester monomer |
| 08/15/2012 | CN102640576A Resin composition for use in formation of bonding layer in multilayer flexible printed circuit board, resin varnish, resin-coated copper foil, manufacturing method for resin-coated copper foil for use in manufacturing of multilayer flexible printed circuit board |
| 08/15/2012 | CN102639660A Composition, tape, and use thereof |
| 08/15/2012 | CN102634316A Moisture-activated epoxy resin composition |
| 08/15/2012 | CN102634315A Formula of macromolecular pouring material for underwater repairing equipment and preparation method of formula |
| 08/15/2012 | CN102634314A Heat-conducting epoxy dipped adhesive and preparation method |
| 08/15/2012 | CN102634313A Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof |
| 08/15/2012 | CN102634312A Silvering powder conductive adhesive for LED packaging and production method thereof |
| 08/15/2012 | CN102634311A Ceramic fiber modified wear-resistance adhesive |
| 08/15/2012 | CN102634290A Double-component transparent epoxy resin LED (light emitting diode) patch packing adhesive |
| 08/15/2012 | CN102634286A Photo-thermal dual curable type anisotropic conductive resin and conductive film as well as preparation method of conductive resin and conductive film |
| 08/15/2012 | CN102633988A Modified lauryl amine hardener, manufacturing method and application of modified lauryl amine hardener |
| 08/15/2012 | CN101508878B Bonder and method of preparing the same |
| 08/15/2012 | CN101475788B High strength polyurethane modified epoxy construction structure glue and manufacturing method thereof |
| 08/15/2012 | CN101362926B Adhesive sheet, dicing tape integrated type adhesive sheet, and semiconductor device producing method |
| 08/15/2012 | CN101323773B High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof |
| 08/09/2012 | WO2012105558A1 Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board |
| 08/09/2012 | WO2012105547A1 Curable resin composition and cured product thereof |
| 08/09/2012 | WO2012105220A1 Polyurethane adhesive, adhesive for solar cell protective sheet, and backside protective sheet for solar cell |
| 08/09/2012 | WO2011107450A3 Two-component structural adhesive which is impact resistant at room temperature |
| 08/08/2012 | EP2484739A1 Conductive connection material, method for connection between terminals and method for manufacturing connecting terminal |
| 08/08/2012 | EP2484710A1 Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate |
| 08/08/2012 | CN102627933A Thixotrope for high-power wind turbine blade and preparation method thereof |