Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
10/2012
10/26/2012WO2012144388A1 Laminated polishing pad
10/26/2012WO2012144329A1 Resin composition, two-pack type adhesive for laminates, multilayer film, and back sheet for solar cells
10/26/2012WO2012144261A1 Cationic polymerizable adhesive and polarizing plate obtained using same
10/26/2012WO2012144260A1 Cationic polymerizable adhesive and polarizing plate obtained using same
10/25/2012US20120267803 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
10/24/2012EP2513243A2 Crimping fold bond
10/24/2012CN102746822A Polymer asphalt based waterproof adhesive material and preparation process and construction process thereof
10/24/2012CN102746815A Latent polyurethane adhesive
10/24/2012CN102746814A Novel modified nanometer titanium dioxide doping alicyclic epoxy resin LED (light emitting diode) encapsulation glue
10/24/2012CN102746798A High-heat-conductivity semi-cured glue film and preparation method of high-heat-conductivity semi-cured glue film
10/24/2012CN102746615A Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation
10/24/2012CN102746487A LED-packaging epoxy resin composition
10/24/2012CN102744934A Double copper-coated surface base material structure for LED flexible strip and manufacturing method thereof
10/24/2012CN101914360B Low-temperature hot-seal adhesive and preparation method thereof
10/18/2012WO2012141200A1 Anisotropic conductive film, connection method, and connected structure
10/18/2012WO2012141167A1 Reinforcing material for solid polymer fuel cell, and cohesive/adhesive composition for use in same
10/18/2012WO2012141030A1 Epoxy resin composition
10/18/2012WO2012141027A1 Anisotropic conductive film
10/18/2012WO2012140902A1 Adhesive composition, adhesion method using same, layered body, and tire
10/18/2012WO2012139974A2 Impact-modified adhesives
10/18/2012US20120263950 Pressure-sensitive adhesive dispersion comprising polymers with ureido groups or ureido-analogous groups and with glycidyl groups
10/18/2012DE102011007897A1 Schlagzähmodifizierte Klebstoffe Toughened Adhesives
10/18/2012DE102011007893A1 Thermobondingverfahren Thermobondingverfahren
10/17/2012CN102741348A Curable composition, cured article, and use of curable composition
10/17/2012CN102732201A Wear-resistant and weather-resistant epoxy resin coating adhesive and its preparation method
10/17/2012CN102732200A Vegetable oil-based adhesive, composite plywood and method for manufacturing composite plywood
10/17/2012CN102732199A Rapid permeation bottom underfill and preparation method thereof
10/17/2012CN102732198A Pouring sealant for carrying out pouring sealing on travelling wave tube slow-wave system, and preparation method thereof
10/17/2012CN102732197A Preparation process of adhesive suitable for adhesive coated copper foil
10/17/2012CN102732186A Modified starch adhesive and method for preparing same
10/17/2012CN102732029A Halogen-free resin composition, bonding sheet and copper-clad laminate
10/17/2012CN102153730B Method for preparing high-strength epoxy resin adhesive
10/17/2012CN101914348B Sealing adhesive and preparation method thereof
10/17/2012CN101818038B Method for preparing film adhesive for aluminum honeycomb panel sandwich structure
10/16/2012US8286465 Self-filleting die attach paste
10/11/2012WO2012138356A1 B-stageable and skip-curable wafer back side coating adhesives
10/11/2012WO2012138030A1 Adhesive film for an organic el device, composite included in the adhesive film for an organic el device, and organic el display device including the adhesive film for an organic el device
10/11/2012WO2012138029A1 Adhesive film for an organic el device, composite included in the adhesive film, and organic el device and display device which include the adhesive film
10/11/2012WO2012107556A3 Electrically conductive adhesives comprising at least one metal precursor
10/11/2012US20120259042 Toughened epoxy resin formulations
10/11/2012US20120259041 Adhesive compostion
10/11/2012US20120258315 Assembly of two substrates bonded by a rigid polymer, and methods for assembly and dismantling by means of migration of said bonded assembly
10/11/2012US20120256326 Adhesive composition, semiconductor device making use thereof, and production method thereof
10/10/2012CN102725324A Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device
10/10/2012CN102719214A Insulating glue for lithium ion batteries and using method of insulating glue
10/10/2012CN102719213A Modified nano zinc oxide doped cycloaliphatic epoxy resin light-emitting diode (LED) packaging adhesive
10/10/2012CN102719212A Silane coupling agent modified cycloaliphatic epoxy resin surface mount device (SMD) packaging adhesive
10/10/2012CN102719211A Silver nanowire-filled self-repairing conducting resin and preparation method thereof
10/10/2012CN102719210A Adhesive with insulating and heat-conducting properties used at ultralow temperature
10/10/2012CN102719201A Method for fabricating adhesive sheet
10/10/2012CN102719199A Preparation method of three-dimensional anisotropic conductive film
10/10/2012CN102719058A One liquid type cyanate-epoxy composite resin composition
10/10/2012CN102093737B Composition for copper foil-clad laminated sheet and copper foil-clad laminated sheet prepared from composition
10/10/2012CN101987947B Adhesive composition for halogen-free covering film and covering film coated by the same
10/10/2012CN101821312B Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition
10/10/2012CN101589127B Toughened binder compositions for use in advance processes
10/04/2012WO2012133163A1 Polarizing plate and laminated optical member
10/04/2012WO2012133162A1 Laminate optical member and polarizing plate using photocurable adhesive
10/04/2012WO2012133161A1 Photocurable adhesive, polarizing plate, and laminate optical member
10/04/2012WO2012132656A1 Heat-conductive, pressure-sensitive adhesive composition, heat-conductive, pressure-sensitive adhesive sheet formed body, method for producing each, and electronic component
10/04/2012WO2012070871A3 Adhesive composition
10/04/2012US20120251707 Adhesives
10/03/2012EP2505610A1 Single-component epoxy resin composition and use thereof
10/03/2012CN102712834A Adhesive reel
10/03/2012CN102712833A Adhesive sheet and bonding method using same
10/03/2012CN102708755A Anti-counterfeiting label with ultraviolet-cured glue film
10/03/2012CN102703013A Polyester hot-melt adhesive and coating method thereof
10/03/2012CN102703012A Heat conduction COB (Chip On Board) epoxy adhesive and preparation method thereof
10/03/2012CN102703011A Adhesive of reinforcement plate, and manufacturing method of adhesive
10/03/2012CN102703010A Epoxy adhesion for lithium battery flexible package and lithium battery flexible package material
10/03/2012CN102703009A Preparation method of nano silicon dioxide/polyacrylate modified epoxy resin adhesive
10/03/2012CN102703008A Silane coupling agent modified resin cycloaliphatic epoxy resin high-power LED (light emitting diode) packaging adhesive
10/03/2012CN102702994A Adhesive for flexible printed circuit board and preparation method thereof
10/03/2012CN102702989A Cover film for flexible copper clad plate and preparation method thereof
10/03/2012CN102702986A Environment-friendly sealing gum
10/03/2012CN102093667B Epoxy resin composite and covering film prepared from same
10/03/2012CN102002338B Preparation method of waterproof soyabean protein adhesive
10/03/2012CN101948667B Adhesive for compounding marble veneer with base material and preparation method thereof
10/03/2012CN101691418B Adhesive epoxy composition and process for applying it
10/03/2012CN101392159B Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
10/03/2012CN101323772B Ultra-thin stone and aluminum honeycomb composite modified epoxy adhesive and preparation thereof
09/2012
09/27/2012WO2012127978A1 Light-reflective anisotropic conductive adhesive and light-emitting device
09/27/2012WO2012126391A1 HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED
09/27/2012US20120244347 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
09/27/2012US20120244332 Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate
09/26/2012CN102695768A Anisotropic electrically-conductive adhesive agent
09/26/2012CN102690623A Epoxy waterproof system
09/26/2012CN102690622A Repairing adhesive for high-grade facing stone and preparation method thereof
09/26/2012CN102690621A Novel LED (light-emitting diode) package resin made from nanometer zinc oxide doping with alicyclic epoxy resin
09/26/2012CN102690620A Ultraviolet-resistant nano titanium dioxide doped cycloaliphatic epoxy resin LED (light emitting diode) packaging glue
09/26/2012CN102690612A White insulation paper semi-solidified glue film structure for insulation bus and manufacturing method of white insulation paper semi-solidified glue film structure
09/26/2012CN102690501A Epoxy waterproof system with high bonding strength
09/26/2012CN102690499A Epoxy waterproof composition
09/26/2012CN102690495A Hot-melting type halogen-free fire-retardant heat conducting and dielectric insulating layer resin and application thereof
09/26/2012CN102689463A Flexible copper-clad plate
09/26/2012CN102290168B Dry production method for low-adhesive-content mica tape
09/26/2012CN102206322B Epoxy-modified organic silicone resin for manufacturing composite glue, and processing technology thereof
09/26/2012CN102020828B Phosphorus-nitrogen compound intumescence active flame retardant modified epoxy resin and preparation method and application thereof
09/26/2012CN101602925B Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof
09/26/2012CN101528802B Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer
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