Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
12/2012
12/12/2012CN102816552A Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof
12/12/2012CN102816548A Epoxy resin potting special for high-tension ignition coil of automobile and preparation method thereof
12/12/2012CN102816540A Bonding system comprising an adhesive or sealant and a primer
12/12/2012CN102816501A Seam binding agent with modified fatty amine as epoxy curing agent resin
12/12/2012CN102816289A Preparation method for epoxy pouring sealant with characteristics of low viscosity, high elongation rate, and high strength
12/12/2012CN102206324B Full-biobased epoxy resin composition and condensate
12/12/2012CN101906281B High-temperature resistant structural adhesive and preparation method thereof
12/12/2012CN101857735B Silicon dioxide eutectic filling material and preparation method of laminate
12/12/2012CN101768417B Bonded structural adhesive and preparing method thereof
12/12/2012CN101649174B Preparation method of high temperature resistant single-component solventless epoxy adhesive
12/12/2012CN101437914B Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet
12/11/2012US8328977 forming composite materials by grafting to the surface of the fibers, before they are brought into contact with the resin having groups capable of acting as chain transfer agents during the polymerization of the resins; composites used in aircrafts, rails, boats, automobiles, weapons or sports equipment
12/06/2012WO2012166257A1 Metal panel assembly and method for making same
12/06/2012WO2012165665A1 Fire-retardant resin composition, metal-clad base laminate for flexible printed circuit board utilizing said composition, cover lay, adhesive sheet for flexible printed circuit board and flexible printed circuit board
12/06/2012WO2012165375A1 Resin composition, semiconductor device using same, and method of manufacturing semiconductor device
12/06/2012WO2012165259A1 Energy-beam-curable resin composition
12/06/2012WO2012139974A3 Impact-modified adhesives
12/06/2012CA2837663A1 Metal panel assembly and method for making same
12/05/2012EP2529856A1 Metal Panel Assembly And Method For Making Same
12/05/2012EP2528735A1 A multilayer structure, and a method for making the same
12/05/2012EP2528734A1 A multilayer structure, and a method for making the same
12/05/2012CN102812067A Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate
12/05/2012CN102812066A Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer
12/05/2012CN102807826A Halogen-free low-temperature quickly-cured mounting glue for bonding chip type electronic element
12/05/2012CN102146266B Dry-hang adhesive, rapid curing agent for dry-hang adhesive and preparation process of rapid curing agent
12/05/2012CN102108277B Entropy alloy powder conductive adhesive and manufacturing method thereof
12/05/2012CN102020962B Catalysis curing epoxy binding agent
12/05/2012CN101792520B Low-corrosive epoxy resins and production method thereof
12/05/2012CN101781541B In situ preparation method of nano silver/epoxy conductive adhesive
12/05/2012CN101646706B Epoxy group-terminated polymers, the compositions thereof and the use thereof as impact resistance modifiers
12/04/2012US8323773 Laminates with structured layers
11/2012
11/29/2012WO2012160916A1 Adhesive composition, film adhesive, adhesive sheet and semiconductor device
11/29/2012US20120299216 Vacuum Infusion Adhesive and Methods Related Thereto
11/29/2012US20120299203 Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device
11/28/2012CN102802873A 保持垫 Holding pad
11/28/2012CN102796480A Adhesive for printed circuit board
11/28/2012CN102796479A Adhesive for producing laminated bus insulating pad, preparation method of adhesive and production method of insulating pad
11/28/2012CN102796478A Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof
11/28/2012CN102796466A Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device
11/28/2012CN102363723B Preparation method for high-temperature resistant copper foil adhesive
11/28/2012CN102199407B High-dispersing nanometer silver and high-performance conductive adhesive
11/28/2012CN102191001B Epoxy conductive adhesive composition
11/28/2012CN101911259B Dicing/die bonding film
11/28/2012CN101845287B Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof
11/28/2012CN101536185B Adhesive tape and semiconductor device using the same
11/27/2012US8318278 Adhesive attachment and method
11/22/2012WO2012158336A1 Novel structural adhesive and use thereof
11/22/2012WO2012157627A1 Curable heat-dissipating composition
11/22/2012WO2012157375A1 Circuit connection material, circuit member connection structure, and circuit member connection structure manufacturing method
11/22/2012WO2012068414A3 Structural adhesive compositions
11/21/2012EP2524953A1 Anisotropic electrically-conductive adhesive agent
11/21/2012CN102791819A Heat-resistant adhesive
11/21/2012CN102786904A Fixing glue for cutting crystalline materials and preparation method thereof
11/21/2012CN102786903A Modified epoxy adhesive for stone combination and preparation method thereof
11/21/2012CN102786902A Organosilicone-organofluorine epoxy adhesive and preparation method thereof
11/21/2012CN102786901A Conductive silver adhesive for high-power LED (light-emitting diode) and preparation method and curing and using method thereof
11/21/2012CN102115655B Single component flexible epoxy sealant
11/21/2012CN101939396B Adhesive composition for electronic components and adhesive sheet for electronic components using the same
11/21/2012CN101851478B Rapid-curing conductive adhesive composition and method for preparing same
11/21/2012CN101847396B Substitute boa skin of folk music instrument and manufacturing method thereof
11/21/2012CN101768328B Bonding film and used resin thereof
11/21/2012CN101747854B Adhesive combination, covering film and flexible circuit board
11/21/2012CN101696349B Adhesive, preparation method thereof, and epoxy glass fabric prepared from adhesive
11/21/2012CN101479311B Heat curable resin composition, and mounting method and reparing process for circuit board using the heat curable composition
11/20/2012US8313608 Method of aligning an imaging device in an optical system
11/15/2012US20120289112 Carbon nanotube reinforced adhesive
11/15/2012DE112005000992B4 Wasserhaltige selbstklebende Beschichtung für Elektrostahl Aqueous adhesive coating for electrical steel
11/14/2012EP2522704A1 Adhesive sheet and bonding method using same
11/14/2012CN102782074A Resin composition for adhesive agent, adhesive agent comprising the resin composition, adhesive sheet, and printed wiring board involving the adhesive sheet as adhesive layer
11/14/2012CN102775952A Plastic toy repairing adhesive and preparation method thereof
11/14/2012CN102775948A Hydrophilic epoxy resin binder and preparation method and application thereof
11/14/2012CN102775947A Pavement abrasion-resistant layer based on epoxy resin and method for preparing same
11/14/2012CN102775940A White mastics and preparation method thereof
11/14/2012CN102161749B Self-toughening epoxy resin curing agent and preparation method thereof
11/14/2012CN101709207B Mucilage glue suitable for large-gap bonding of respective ceramics and glass products or between same
11/14/2012CN101402838B Silver staining palladium alloy microsphere conductive adhesive and method of producing the same
11/14/2012CN101268163B Bonding agent composition, bonding agent tablet using same and its uses
11/13/2012US8309633 Low temperature, cationically curable compositions with improved cure speed and toughness
11/08/2012WO2012151171A1 Trimethyl borate in epoxy resins
11/08/2012WO2012092332A3 Structural hybrid adhesives
11/08/2012US20120283358 Adhesive composition for use in an immunosensor
11/07/2012EP2520630A1 Polyester adhesive composition
11/07/2012CN102766430A Adhesive of hot melting coating for laminated steel process and preparation method thereof
11/07/2012CN102766428A Ultraviolet curable resin composition and application thereof
11/07/2012CN102766427A Epoxy resin optical fiber adhesive glue doped by nano ultraviolet absorbing agent
11/07/2012CN102766426A Conductive adhesive for encapsulating semiconductor chip and preparation method thereof
11/07/2012CN102766425A Bicomponent seam paste
11/07/2012CN102766318A Dicyclopentadiene dioxide composite material and preparation method thereof
11/07/2012CN102766116A Dehydroabietylamine-based epoxy resin and preparation method and application thereof
11/07/2012CN102765225A Pyramid-lattice metal sandwich plate and preparation method thereof
11/07/2012CN101815769B Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
10/2012
10/31/2012CN202511041U Light emitting diode (LED) bulb lamp
10/31/2012CN102757761A Epoxy asphalt bonding layer material for cement concrete bridge surface and preparation method thereof
10/31/2012CN102757756A Two-component transparent epoxy resin optical fiber adhesive
10/31/2012CN102757755A Preparation method for high-temperature resistant, leak-proof and corrosion-resistant adhesive
10/31/2012CN102757750A An adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound
10/31/2012CN101935510B Epoxy resin conductive silver colloid with high adhesive strength
10/31/2012CN101798494B Normal-temperature curing epoxy waterproof adhesive of bridge deck
10/29/2012CA2757090A1 Adhesively bonded frame section for agricultural sprayer boom
10/26/2012WO2012144458A1 Hot-melt adhesive sheet for laminated polishing pad and adhesive-layer-bearing support layer for laminated polishing pad
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