| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 01/10/2013 | US20130012620 Curing agents for epoxy resins |
| 01/10/2013 | DE202011110111U1 Adhäsivfilm für Solarzellenelektrode Adhesive film for solar cell electrode |
| 01/09/2013 | EP2542637A2 Two-component structural adhesive which is impact resistant at room temperature |
| 01/09/2013 | CN102869742A Shape memory material based on a structural adhesive |
| 01/09/2013 | CN102869741A Shape memory material based on a structural adhesive |
| 01/09/2013 | CN102869740A One part epoxy resin including a low profile additive |
| 01/09/2013 | CN102863937A Epoxy conductive silver adhesive with imidazole nickel salt serving as accelerant and preparation method of epoxy conductive silver adhesive |
| 01/09/2013 | CN102863936A Heating solidification type dual-component epoxy pouring sealant and preparation method thereof |
| 01/09/2013 | CN102863935A Adhesive, adhesive-based crown cap and preparation method of crown cap |
| 01/09/2013 | CN102863924A Preparation method of silver-plated copper powder/epoxy resin conductive adhesive |
| 01/09/2013 | CN102863913A Novel transparent conductive film and preparation method thereof |
| 01/09/2013 | CN102863742A 热硬化性树脂组成物及其应用 Thermosetting resin composition and its application |
| 01/09/2013 | CN102862872A Reel for adhesive tape, winding body |
| 01/09/2013 | CN102010685B Epoxy resin conductive adhesive and preparation method thereof |
| 01/09/2013 | CN101914359B Bar glue |
| 01/09/2013 | CN101857789B Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof |
| 01/09/2013 | CN101851330B Alpha, omega-amino terminated polyether compound with phenolic hydroxyl group, preparation method thereof and epoxy resin adhesive containing the same |
| 01/09/2013 | CN101698787B Epoxy resin binder used for repairing blade and preparation method thereof |
| 01/09/2013 | CN101679611B Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 01/03/2013 | WO2012095826A3 Removable adhesive/sealant composition |
| 01/02/2013 | CN202643625U Special protection film with anti-dazzle inner structure for outer screen |
| 01/02/2013 | CN102858838A Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 01/02/2013 | CN102858836A Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film |
| 01/02/2013 | CN102850988A Epoxy resin pouring sealant and usage method |
| 01/02/2013 | CN102850987A Special epoxy adhesive for high-voltage electronic ignition coil of automobile |
| 01/02/2013 | CN102850986A Novel halogen-free flame retardant epoxy resin sealing glue |
| 01/02/2013 | CN102850985A Steel grit glue and preparation method of steel grit glue |
| 01/02/2013 | CN102850984A Low-stress epoxy resin composition applicable to packaging small-size surface mounted devices |
| 01/02/2013 | CN102850983A Special mending agent for textile machinery |
| 01/02/2013 | CN102850982A Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure |
| 01/02/2013 | CN102850981A Epoxy resin adhesive |
| 01/02/2013 | CN102850980A Epoxy resin glue for silicon rod cutting and preparation method thereof |
| 01/02/2013 | CN102850979A Porcelain imitating adhesive |
| 01/02/2013 | CN102850978A Room temperature cured high-temperature resistant epoxy adhesive |
| 01/02/2013 | CN102850973A Low-water-absorptivity acrylate structural adhesive and preparation method thereof |
| 01/02/2013 | CN102850948A Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
| 01/02/2013 | CN102320861B Method for producing cementation healing fussure stone |
| 01/02/2013 | CN102208550B Substrate for flexible photoelectronic device and preparation method thereof |
| 01/02/2013 | CN102127290B Epoxy resin composition and flexible copper-clad plate prepared from same |
| 01/02/2013 | CN102079875B High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same |
| 01/02/2013 | CN101940080B Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article |
| 01/02/2013 | CN101892026B Isotropous conductive adhesive and preparation method thereof |
| 01/02/2013 | CN101864251B Organic adhesive for electrode paste of silicon solar cell and preparation method thereof |
| 01/02/2013 | CN101658083B Use of an adhesive composition for die-attaching high power semiconductors |
| 01/02/2013 | CN101643569B 环氧树脂组合物 The epoxy resin composition |
| 01/02/2013 | CN101555310B Curing agent for low temperature cure applications |
| 12/27/2012 | WO2012178111A2 Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same |
| 12/27/2012 | WO2012177337A1 Pressure-sensitive adhesives with onium-epoxy resin crosslinking system |
| 12/27/2012 | WO2012174623A1 Support material, sheet moulding compound and process for making a moulding material |
| 12/27/2012 | US20120328811 Epoxy Resin Compositions |
| 12/27/2012 | US20120326301 Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device |
| 12/27/2012 | DE102011105593A1 Lining pipe, useful to renovate pipeline systems, comprises a fiber strip impregnated with an epoxy resin, where the epoxy resin is a epoxy resin, which is curable by photochemically initiated cationic polymerization process |
| 12/26/2012 | CN102844397A Two-component structural adhesive which is impact resistant at room temperature |
| 12/26/2012 | CN102839824A Steel-bonded reinforcement method for steel structure |
| 12/26/2012 | CN102838962A Epoxy resin adhesive and preparation method thereof |
| 12/26/2012 | CN102838961A Two-component epoxy end-blocking glue for membrane components and application thereof |
| 12/26/2012 | CN102838960A Low-viscosity epoxy structure adhesive and preparation method thereof |
| 12/26/2012 | CN102838959A Modified flame-retarding epoxy resin adhesive |
| 12/26/2012 | CN102838958A Preparation method of silver colloid for LED (Light Emitting Diode) with high thermal conductivity |
| 12/26/2012 | CN102838957A Coupling agent modified silicon dioxide doped cycloaliphatic epoxy resin LED packaging adhesive |
| 12/26/2012 | CN102838947A Modifier used for adhesive, production method thereof, adhesive, and circuit connection structure body |
| 12/26/2012 | CN102212247B 水性环氧树脂组合物及其制备方法 Waterborne epoxy resin composition and its preparation method |
| 12/26/2012 | CN102093671B Epoxy resin composite and pouring method thereof |
| 12/26/2012 | CN101928538B Polysulfone oligomer-containing thermosetting epoxy resin adhesive and preparation method thereof |
| 12/26/2012 | CN101159320B Material for packaging cell |
| 12/25/2012 | US8338536 Adhesive compositions for use in die attach applications |
| 12/20/2012 | WO2012173325A1 Adhesive film for a semiconductor package |
| 12/20/2012 | WO2012173055A1 Active-energy-ray-curable adhesive composition for plastic film or sheet |
| 12/20/2012 | WO2012173054A1 Active-energy-ray-curable adhesive composition for plastic film or sheet |
| 12/20/2012 | WO2012173038A1 Removable adhesive tape and manufacturing method thereof |
| 12/20/2012 | WO2012172959A1 Adhesive sheet, and method for manufacturing electronic component |
| 12/20/2012 | US20120321227 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 12/20/2012 | DE102011105209A1 Pressure-sensitive- and structural adhesive polymerizate present in band form, produced by free radical polymerization under ultra-violet, useful e.g. for coating molded part with polymerizate and applying on anti-adhesive carrier material |
| 12/20/2012 | DE102011077510A1 Primer zur Verbesserung der Adhäsion von Klebebändern auf schwer verklebbaren Kunststoffen und Metallen Primer to improve the adhesion of adhesive tapes on difficult to bond plastics and metals |
| 12/19/2012 | CN202610165U Antiglare protection film special for external screen |
| 12/19/2012 | CN102834907A Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device |
| 12/19/2012 | CN102834478A Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| 12/19/2012 | CN102829050A Method for improving alignment precision by using variable-power UV-curing adhesive |
| 12/19/2012 | CN102827567A Crack repair material for asphalt concrete pavement |
| 12/19/2012 | CN102827566A Single-component high/low-temperature-resistant epoxy resin composition |
| 12/19/2012 | CN102827565A One-component epoxy adhesive for automobiles and preparation method thereof |
| 12/19/2012 | CN102827458A Low-temperature-resistant high-energy-radiation-resistant epoxy resin material and preparation method thereof |
| 12/19/2012 | CN102827352A Heat curing agent and preparation method thereof, frame sealing adhesive, display panel and display device |
| 12/19/2012 | CN102827342A Epoxy group contained isocyanated acrylate monomer, and preparation method and application thereof |
| 12/19/2012 | CN102363722B Water-soluble insulating cement, cylinder fetal membrane with application of insulating cement and preparation method thereof |
| 12/19/2012 | CN101693822B Elastic epoxy glue |
| 12/19/2012 | CN101490196B Hot-melt adhesive for fixing IC module, and laminated tape and IC card using the adhesive |
| 12/13/2012 | WO2012169498A1 Anistropic conductive member |
| 12/13/2012 | WO2012168385A2 Aqueous adhesive composition based on epoxide resin |
| 12/13/2012 | US20120315388 Bonding system comprising an adhesive or sealant and a primer |
| 12/12/2012 | EP2532722A1 Water based epoxy resin primer compositions. |
| 12/12/2012 | EP2532694A1 Bonding system comprising an adhesive or sealant and a primer |
| 12/12/2012 | CN202595027U Glue line antistatic protective film |
| 12/12/2012 | CN202595026U Special pressure-sensitive adhesive tape for high-surface-energy epoxy package |
| 12/12/2012 | CN1923939B Semiconductor device, adhesive, and adhesive film |
| 12/12/2012 | CN102822304A Resin composition for adhesive agent, adhesive agent and adhesive sheet each comprising same, and printed circuit board comprising same as adhesive agent layer |
| 12/12/2012 | CN102822303A Curing agent composition for epoxy resin based adhesive, and adhesive for porous materials |
| 12/12/2012 | CN102822229A Epoxy adhesive compositions comprising adhesion promoter |
| 12/12/2012 | CN102821947A Multilayer structure, and a method for making the same |
| 12/12/2012 | CN102821946A Multilayer structure, and a method for making the same |