| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 02/20/2013 | CN102936477A Heat transfer printing adhesive for glass matrix, heat transfer printing film, preparation method and application |
| 02/20/2013 | CN102936476A Heat transfer printing adhesion agent, heat transfer printing film and heat transfer printing method |
| 02/20/2013 | CN102936468A Flame-retardant epoxy resin adhesive and flexible copper-clad plate made by using same |
| 02/14/2013 | WO2013021936A1 Conductive adhesive tape winding unit |
| 02/14/2013 | WO2013021494A1 Method for producing resin composition, and adhesive agent |
| 02/14/2013 | US20130041088 Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film |
| 02/13/2013 | CN102934243A Light-reflective anisotropic electrically conductive paste, and light-emitting device |
| 02/13/2013 | CN102933670A Dual cure adhesives |
| 02/13/2013 | CN102925100A High-thermal conductivity conductive silver adhesive and preparation method thereof |
| 02/13/2013 | CN102925095A Transfer size |
| 02/13/2013 | CN102925094A Ultraviolet light polymerization adhesive and preparation method thereof |
| 02/13/2013 | CN102925093A Lead-acid storage battery sealing gum |
| 02/13/2013 | CN102925092A Epoxy resin nano composite adhesive film and preparation method thereof |
| 02/13/2013 | CN102925091A High-strength high-toughness epoxy resin adhesive and preparation method thereof |
| 02/13/2013 | CN102925090A Preparation method of conductive silver adhesive for electromagnetic shielding |
| 02/13/2013 | CN102925089A Flexible heat-conducting resin, and prepreg and metal base copper clad laminate prepared from same |
| 02/13/2013 | CN102925088A Solar crystalline silicon wafer temporary adhesive and its preparation method |
| 02/13/2013 | CN102925066A Epoxy resin adhesive film and preparation method thereof |
| 02/13/2013 | CN102924871A 环氧树脂组合物 The epoxy resin composition |
| 02/13/2013 | CN102276788B Epoxy resin based on gallic acids as well as preparation method and application thereof |
| 02/13/2013 | CN102231311B Production method of single-side reinforced small-glue mica tap by using polyester non-woven fabric |
| 02/13/2013 | CN102093832B High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| 02/13/2013 | CN101880372B Active prepolymer, preparation method thereof and polyurea adhesive and epoxy resin adhesive containing the same |
| 02/13/2013 | CN101831264B Isotropic high-performance thermal conductive adhesive for filling carbon nano tube |
| 02/13/2013 | CN101602929B Percolation efficiency of the conductivity of electrically conductive adhesives |
| 02/07/2013 | WO2012126391A9 HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAAs) NANOMATERIALS FOR HIGH BRIGHTNESS LED |
| 02/07/2013 | US20130034736 Shape memory material based on a structural adhesive |
| 02/06/2013 | EP2553036A1 Reinforcing element for reinforcement in cavities of structural components |
| 02/06/2013 | EP2553035A1 Shape memory material based on a structural adhesive |
| 02/06/2013 | EP2553034A1 Shape memory material based on a structural adhesive |
| 02/06/2013 | EP2552992A2 Epoxy adhesive compositions comprising an adhesion promoter |
| 02/06/2013 | EP2552991A1 Curable compositions |
| 02/06/2013 | EP2552979A1 Fluoroelastomer compositions having self-bonding characteristics and methods of making same |
| 02/06/2013 | CN102911632A Epoxy anchoring adhesive for high speed railway embedded steel bar and preparation method thereof |
| 02/06/2013 | CN102911631A Adhesive composition with single-component epoxy structure |
| 02/06/2013 | CN102911614A Adhesive tape for manufacturing semiconductor devices and method for manufacturing semiconductor devices by using adhesive tape |
| 02/06/2013 | CN102911345A Preparation method and application of epoxy resin adhesive |
| 02/06/2013 | CN101967362B Special sealant with electrochemical activity for resisting crevice corrosion and preparation method thereof |
| 02/06/2013 | CN101921566B Structural adhesive for steel bonding |
| 02/05/2013 | US8366867 Bonded structure, sealed structure, electronic component including the same, bonding method, and sealing method |
| 01/31/2013 | WO2013015469A1 Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
| 01/31/2013 | WO2013015012A1 Base material film for semiconductor processing sheet, semiconductor processing sheet, and method for manufacturing semiconductor device |
| 01/31/2013 | US20130028540 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for lamlinate |
| 01/30/2013 | EP2551321A1 Curing agent composition for epoxy resin based adhesive, and adhesive for porous materials |
| 01/30/2013 | CN102906941A Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure |
| 01/30/2013 | CN102906211A Adhesive agent composition and adhesive film |
| 01/30/2013 | CN102906198A Curable composition, hardened material, and method for using curable composition |
| 01/30/2013 | CN102899002A Adhesive used for bonding vulcanized ethylene propylene diene monomer rubber and cast iron, and application thereof |
| 01/30/2013 | CN102898997A Nano rubber powder modified epoxy adhesive |
| 01/30/2013 | CN102898996A Impact-resistant epoxy adhesive |
| 01/30/2013 | CN102898995A Room-temperature solid high-temperature-resistant epoxy adhesive |
| 01/30/2013 | CN102898994A Epoxy potting adhesive |
| 01/30/2013 | CN102898993A High strength epoxy pouring sealant composition and application thereof |
| 01/30/2013 | CN102898992A 一种工业用的胶水 An industrial glue |
| 01/30/2013 | CN102898991A Ultralow-temperature epoxy adhesive |
| 01/30/2013 | CN102898990A Epoxy adhesive for ceramic bonding |
| 01/30/2013 | CN102898989A Epoxy adhesive drying rapidly at room temperature |
| 01/30/2013 | CN102898988A High elastic corrosion resistant epoxy sealant and preparation method thereof |
| 01/30/2013 | CN102898966A Glue sheet and use thereof |
| 01/30/2013 | CN102208563B Substrate for flexible luminescent device and preparation method thereof |
| 01/30/2013 | CN102208542B Substrate for flexible photoelectronic device and preparation method thereof |
| 01/24/2013 | WO2013013128A2 Thermally expanding adhesive sheet and manufacturing method thereof |
| 01/24/2013 | WO2013010492A1 Conductive adhesive for capacitor and the corresponding capacitors |
| 01/24/2013 | US20130022748 Environmentally friendly water-based epoxy resin composition and a use therefor |
| 01/24/2013 | US20130020724 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby |
| 01/23/2013 | EP2548933A1 Heat-resistant adhesive |
| 01/23/2013 | EP2548904A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 01/23/2013 | CN102888204A Novel conductive adhesive for capacitor and capacitor adopting the novel conductive adhesive |
| 01/23/2013 | CN102250573B High shear and high peel strength epoxy adhesive |
| 01/23/2013 | CN102211894B Underwater solvent-free epoxy anchoring adhesive and preparation method thereof |
| 01/23/2013 | CN102086365B Adhesive, preparation method and application in integrated circuit board embedment thereof |
| 01/22/2013 | US8357260 Partially crosslinked adhesive-supported porous film for battery separator and its use |
| 01/17/2013 | WO2013008757A1 Dicing-tape-integrated adhesive sheet, semiconductor device, multilayered circuit board and electronic component |
| 01/17/2013 | WO2013008455A1 Solar cell backside protective sheet and solar cell |
| 01/17/2013 | US20130017396 Adhesive film for semiconductor device, film for backside of flip-chip semiconductor, and dicing tape-integrated film for backside of semiconductor |
| 01/16/2013 | CN102884130A 1C epoxy resin composition with reduced toxicity |
| 01/16/2013 | CN102884099A Curable compositions |
| 01/16/2013 | CN102876280A Cyanate ester/bis-oxazoline thermostable adhesive and preparation method thereof |
| 01/16/2013 | CN102876277A Adhesive composition, circuit connecting material using same, method for connecting circuit members, and circuit connection structure |
| 01/16/2013 | CN102876275A Adhesive for adhering ceramic and metal |
| 01/16/2013 | CN102876274A Glue for cutting process of solar cell silicon wafers |
| 01/16/2013 | CN102876273A Room temperature cured anti-flow sealing adhesive used for engineering plastic methane tank, and application thereof |
| 01/16/2013 | CN102876272A Heat-conduction binding material and preparation method thereof |
| 01/16/2013 | CN102876271A Glass adhesive for sightseeing elevator and preparation method for glass adhesive |
| 01/16/2013 | CN102876270A Epoxy resin conducting adhesive with high bonding strength |
| 01/16/2013 | CN102876269A High-strength epoxy adhesive and preparation method thereof |
| 01/16/2013 | CN102876256A Durable pressure-sensitive adhesive |
| 01/16/2013 | CN102876247A Modified cyanate adhesive film and preparation method thereof |
| 01/16/2013 | CN102876245A Adhesive film for semiconductor device, film for backside of flip-chip semiconductor, and dicing tape-integrated film for backside of semiconductor |
| 01/16/2013 | CN102277109B Preparation method of environmentally-friendly photocuring silver conductive adhesive |
| 01/16/2013 | CN101910350B Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| 01/16/2013 | CN101851479B Application of graphite conductive adhesive to prepare electrode-detection binder |
| 01/16/2013 | CN101669414B Light-transmitting electromagnetic-shielding laminate and method for producing the same, light-transmitting radio wave absorber, and adhesive composition |
| 01/16/2013 | CN101654607B High purity photo-thermal curing adhesive and preparation method thereof |
| 01/16/2013 | CN101654605B Modified epoxy resin adhesive and preparation method thereof |
| 01/10/2013 | WO2013005691A1 Novel (meth)acrylic resin and resin composition utilizing same |
| 01/10/2013 | WO2013005470A1 Adhesive film, and dicing/die bonding film and method for processing semiconductor using said dicing/die bonding film |
| 01/10/2013 | WO2013004023A1 Sealant of liquid crystal panel and modification method thereof |
| 01/10/2013 | WO2012006001A3 Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| 01/10/2013 | US20130012669 Thermosetting resin composition and application thereof |