| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/27/2013 | CN103003381A Wafer backside coating containing reactive sulfur compound |
| 03/27/2013 | CN102994032A Antiseptic adhesive used for wood |
| 03/27/2013 | CN102994031A Epoxy adhesive |
| 03/27/2013 | CN102994015A Primer used for waterless offset printing plate-making, and preparation method and application thereof |
| 03/27/2013 | CN102993996A High-thermal-conductivity film for aluminum-based copper-coated plate, and preparation method thereof |
| 03/27/2013 | CN102993994A Thermal conductive sheet and producing method thereof |
| 03/27/2013 | CN102990644A Photo-induced bending conductive actuator and manufacturing method thereof |
| 03/27/2013 | CN102208568B Substrate used by flexible light-emitting device and preparation method thereof |
| 03/27/2013 | CN102208557B Substrate for flexible luminescent device and preparation method thereof |
| 03/27/2013 | CN102208538B Substrate for flexible photoelectronic device and preparation method thereof |
| 03/27/2013 | CN102153975B Adhesive, preparation method thereof, mica tape containing same and laminated board containing same |
| 03/27/2013 | CN102040933B Wear-resistant epoxy glue and preparation method thereof |
| 03/27/2013 | CN102020758B Low temperature curable epoxy compositions containing phenolic-blocked urea curatives |
| 03/27/2013 | CN101962527B Environment-friendly energy-saving carpet back rubber powder and production technology thereof |
| 03/27/2013 | CN101724368B Anti-impact epoxy structural rubber and preparation method thereof |
| 03/26/2013 | US8404969 Urethane resin, actinic energy ray curable adhesive, and back protective sheet for solar cell |
| 03/26/2013 | US8404078 Adhesion method, and biochemical chip and optical component made by the same |
| 03/21/2013 | WO2013038840A1 Film-like anisotropic conductive adhesive |
| 03/21/2013 | WO2013037930A1 Shape-memory material based on a structural adhesive |
| 03/21/2013 | US20130072595 Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners and catalysts |
| 03/21/2013 | US20130071622 Laminates with structured layers |
| 03/21/2013 | US20130069465 Adhesive resin composition for hdd motor and hdd motor fabricated using the same |
| 03/20/2013 | EP2570450A1 Shape memory material based on a structural adhesive |
| 03/20/2013 | EP2569384A2 Improvements in or relating to structural adhesives |
| 03/20/2013 | CN202808674U Rubber-plastic epoxy antiseptic cold winding belt |
| 03/20/2013 | CN102985505A Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 03/20/2013 | CN102985504A Interlaminar bonding agent and waterproof structure and waterproofing method |
| 03/20/2013 | CN102983656A 10 kilovolt level high-voltage motor insulation structure and manufacturing method thereof |
| 03/20/2013 | CN102977844A Modified vegetable protein adhesive and preparation method thereof |
| 03/20/2013 | CN102977830A Epoxy resin adhesive and preparation method and applications thereof |
| 03/20/2013 | CN102977829A Zero-halogen and flame-retardation epoxy resin composition, adhesive tape and preparation method of adhesive tape |
| 03/20/2013 | CN102977828A High-efficient epoxy resin adhesive and preparation method and applications thereof. |
| 03/20/2013 | CN102977806A Light guiding liquid adhesive and touch control display device applying the same |
| 03/20/2013 | CN102975430A Flame-retarding copper clad laminate coated with solid content containing phosphorous and no halogen and preparation method thereof |
| 03/20/2013 | CN102321447B High-heat-resistance toughened epoxy resin composition and application thereof in bonding sheet and copper-clad board |
| 03/20/2013 | CN102152685B Method for further curing adhesive layer of transfer printing film subjected to transfer printing |
| 03/20/2013 | CN101851481B Epoxy resin adhesive for manufacturing blades of wind driven generator and preparation method thereof |
| 03/20/2013 | CN101805576B Epoxy-resin single-component soft adhesive |
| 03/14/2013 | DE102011082484A1 Manufacturing a powder injection molded-composite component, comprises e.g. providing powder injection molded-green sheets to be connected into a composite component, applying an adhesive system on a joining point |
| 03/13/2013 | EP2566922A1 1c epoxy resin composition with reduced toxicity |
| 03/13/2013 | EP2566908A2 Potting for electronic components |
| 03/13/2013 | CN202798235U Insulation structure for 10kV level high-voltage motor |
| 03/13/2013 | CN102971354A Potting for electronic components |
| 03/13/2013 | CN102965063A Nanometer modified red gum and preparation method thereof |
| 03/13/2013 | CN102965062A Normal-temperature curing type flame-retardant anti-cracking low-halogen epoxy pouring sealant for automotive ignition coil |
| 03/13/2013 | CN102965061A Room temperature curing epoxy adhesive for splicing leather and preparation method of epoxy adhesive |
| 03/13/2013 | CN102965051A Environment-friendly waterproof all-purpose adhesive for buildings |
| 03/13/2013 | CN102391472B Epoxy resin microcapsule latent curing agent and preparation method thereof |
| 03/13/2013 | CN102226846B Manufacturing method for optical plate |
| 03/13/2013 | CN102079810B Synthesis and application of light-cured polyurethane-acrylic acid-epoxy resin adhesive |
| 03/13/2013 | CN101772532B Toughened adhesive material |
| 03/13/2013 | CN101643539B Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof |
| 03/07/2013 | WO2013031519A1 Solar cell conductive adhesive and connection method using same, solar cell module, and method for producing solar cell module |
| 03/07/2013 | WO2013030136A1 Curing agent for moisture-curing compositions |
| 03/07/2013 | US20130059945 Curable compositions |
| 03/07/2013 | US20130057490 Light guiding liquid glue and a touch sensitive display using the same |
| 03/07/2013 | US20130056686 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film |
| 03/07/2013 | US20130056153 Structural adhesives |
| 03/07/2013 | US20130056151 One component epoxy resin composition |
| 03/06/2013 | CN102952512A Preparation method of unsaturated polyester resin sealant |
| 03/06/2013 | CN102952511A Epoxy encapsulation and lamination adhesive and method of making same |
| 03/06/2013 | CN102952510A Preparation method of conductive adhesive |
| 03/06/2013 | CN102952509A Preparation method of epoxy resin sealant |
| 03/06/2013 | CN102952503A High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape |
| 03/06/2013 | CN102952502A Adhesive composition for semiconductors, adhesive film, and semiconductor device |
| 03/06/2013 | CN102952345A Preparation method of chlorosulfonated polyethylene sealant |
| 03/06/2013 | CN102952253A Epoxy resin based on 2,5-furandicarboxylic acid, preparation method and application thereof |
| 03/06/2013 | CN102408860B Flexible epoxy adhesive and application |
| 03/06/2013 | CN102070067B High-ductility hand strap |
| 03/06/2013 | CN101875830B Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
| 03/06/2013 | CN101781540B High-performance conducting resin and preparation method thereof |
| 02/28/2013 | WO2013028281A1 Toughener and toughened epoxy adhesive |
| 02/28/2013 | WO2013027541A1 Thermally cationically polymerizable composition, anisotropic conductive adhesive film, connected structure and manufacturing process therefor |
| 02/28/2013 | WO2013026865A1 Indicator for cure of two-component-epoxy adhesives |
| 02/28/2013 | WO2012178111A3 Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same |
| 02/28/2013 | WO2012125240A3 Polyamides and amidoamines from selectively modified amine amines |
| 02/28/2013 | US20130053497 Two-part, cyanoacrylate/cationically curable adhesive systems |
| 02/28/2013 | US20130053471 Method for the production of reinforced materials and reinforced materials obtained using this method |
| 02/27/2013 | EP2562210A1 Indicator for cure of two-component- epoxy adhesives |
| 02/27/2013 | EP2562194A1 Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate |
| 02/27/2013 | EP2562192A1 Hardener for moisture curable compositions |
| 02/27/2013 | EP2561029A2 One part epoxy resin including a low profile additive |
| 02/27/2013 | CN102947893A Anisotropic conductive material and process for production thereof, and mounting body and process for production thereof |
| 02/27/2013 | CN102947403A Improvements in or relating to structural adhesives |
| 02/27/2013 | CN102942892A Epoxy phenolic resin adhesive and epoxy phenolic adhesive tape and laminated board manufactured by adhesive |
| 02/27/2013 | CN102942891A Epoxy potting resin for bus ducts, and preparation method and application thereof |
| 02/27/2013 | CN102942890A Method for preparing adhesive |
| 02/27/2013 | CN102942889A Low-halogen epoxy potting adhesive, and preparation method and application thereof |
| 02/27/2013 | CN102942886A Magneto-conductivity gluewater and application thereof |
| 02/27/2013 | CN102942884A Conductive adhesive containing semisolid formed copper-based filler |
| 02/27/2013 | CN102942881A Adhesive sheet, and connecting structure for circuit member and semiconductor device which use the adhesive sheet |
| 02/27/2013 | CN102276791B Flame-retardant epoxy resin compound |
| 02/21/2013 | WO2013026024A1 Energy curable bonding resin |
| 02/21/2013 | WO2013024980A1 Hot melt composition |
| 02/21/2013 | WO2012088163A3 Method for preparing a conformally sealed printed wiring board using a coated substrate comprising a curable epoxy composition comprising imidazolium salts |
| 02/21/2013 | US20130042976 Film adhesives and processes for bonding components using same |
| 02/20/2013 | EP2559732A2 Epoxy encapsulating and lamination adhesive and method of making same |
| 02/20/2013 | EP2559717A1 Curable resin composition, adhesive epoxy resin paste, die-bonding agent, non-conductive paste, adhesive epoxy resin film, non-conductive epoxy resin film, anisotropic conductive paste, and anisotropic conductive film |
| 02/20/2013 | CN102936479A Pouring sealant for automobile igniter and preparation method and application thereof |
| 02/20/2013 | CN102936478A Elastic bicomponent normal-temperature cured epoxy resin adhesive and preparation method thereof |