| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 05/01/2013 | CN103074020A Room-temperature cured, low-viscosity and low temperature-resistant adhesive |
| 05/01/2013 | CN103074019A Halogen-free epoxy adhesive and flexible copper-clad plate prepared from same |
| 05/01/2013 | CN103074018A Modified chip-on-board glue and preparation method thereof |
| 05/01/2013 | CN103074017A High-voltage alternating current motor spherical-bearing insulation technology |
| 05/01/2013 | CN103074001A Method for positioning and bonding megawatt wind power blade web |
| 05/01/2013 | CN103074000A Novel environmental-friendly double-component acrylate adhesive and preparation method thereof |
| 05/01/2013 | CN102127385B Special adhesive for adhering sample for measuring adhesive force of paint film coating and preparation method thereof |
| 05/01/2013 | CN102127289B Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same |
| 05/01/2013 | CN102079957B Low-temperature rapidly-curable surface mounting adhesive |
| 05/01/2013 | CN101985548B Refrigerating agent-resistant adhesive for high-voltage motor and preparation method thereof |
| 05/01/2013 | CN101896530B Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 05/01/2013 | CN101892027B Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same |
| 04/30/2013 | US8430990 Adhesive resin composition and bonding method |
| 04/25/2013 | WO2013057265A1 Adhesive substance, in particular for encapsulating an electronic assembly |
| 04/25/2013 | WO2012168385A3 Aqueous adhesive composition based on epoxide resin |
| 04/25/2013 | US20130102698 Dual cure adhesives |
| 04/24/2013 | CN103068946A Epoxy structural adhesive |
| 04/24/2013 | CN103064208A Polymer stable vertical alignment liquid crystal display panel and liquid crystal display |
| 04/24/2013 | CN103059793A Adhesive composition, adhesive layer and lamination structure thereof |
| 04/24/2013 | CN103059790A Heat-resistant, flame resistant and anti-brittle fracture modified epoxy resin adhesive and preparation method thereof |
| 04/24/2013 | CN103059789A Preparation process for adhesive coated foil adhesive with high resistance to stripping and dip soldering |
| 04/24/2013 | CN103059788A Modified epoxide resin pouring sealant and preparation method thereof |
| 04/24/2013 | CN103059787A Thermal conductive adhesive composition, bonding sheet by using composition and thermal conductive cutting chip foil |
| 04/24/2013 | CN103059786A Adhesive for insulating materials |
| 04/24/2013 | CN103059767A Conductive silver paste with high-temperature resistance and low sheet resistance and preparation method of conductive silver paste |
| 04/24/2013 | CN103059760A Heat conductive adhesive film with heat dissipation function and manufacturing method thereof |
| 04/24/2013 | CN102433099B Preparation method of emulsification and compatibilization of soybean protein adhesive |
| 04/24/2013 | CN102321233B Preparation method of epoxy resin-based polymer dispersion liquid crystal film material |
| 04/24/2013 | CN102220101B Double-component epoxy adhesive for bonding ceramics, preparation method and using method thereof |
| 04/24/2013 | CN102153979B Intermediate-temperate rapidly-cured surface mount adhesive for lead-free welding |
| 04/24/2013 | CN102134459B Processing process of weft polyester shrunk adhesive band |
| 04/24/2013 | CN101952364B Microencapsulated silane coupling agent |
| 04/24/2013 | CN101622324B Low temperature curable conductive adhesive and capacitors formed thereby |
| 04/18/2013 | WO2013055158A2 Adhesive for polarizing plate, and polarizing plate comprising same |
| 04/18/2013 | WO2013055154A2 Double-sided polarizing plate and optical device including same |
| 04/18/2013 | WO2013053328A1 Gel time controllable two part epoxy adhesive |
| 04/18/2013 | WO2013053100A1 Gel time controllable two part epoxy adhesive |
| 04/18/2013 | DE102012008214A1 Surface modification of components made of light metals, comprises performing pre-treatment comprising removing oxide layer and producing fresh microporous oxide layer, and incorporating reactive polymer in pores of oxide layer |
| 04/17/2013 | EP2581955A1 Light-reflective anisotropic electrically conductive paste, and light-emitting device |
| 04/17/2013 | EP2580298A2 Wafer backside coating containing reactive sulfur compound |
| 04/17/2013 | EP2580295A2 Dual cure adhesives |
| 04/17/2013 | CN103045147A Cold-proof and damp-proof epoxy resin main agent for crystal glue drip and preparation method thereof |
| 04/17/2013 | CN103045146A Water-boiling degumming type modified epoxy adhesive for cutting silicon single crystal rods and preparation method thereof |
| 04/17/2013 | CN103045145A Epoxy adhesive used for carbon fiber reinforcement and preparation method thereof |
| 04/17/2013 | CN103045144A Epoxy gas cylinder adhesive and method for preparing same |
| 04/17/2013 | CN103045143A Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive |
| 04/17/2013 | CN103045142A Epoxy wear-resisting ceramic wafer bonding glue and preparation method thereof |
| 04/17/2013 | CN103044918A Organosilicone resin/epoxy resin hybrid materials for packaging light emitting diodes |
| 04/17/2013 | CN102272228B Metal stabilizers for epoxy resins |
| 04/17/2013 | CN102108268B Environment-friendly halogen-free inflaming retarding adhesive tape and production process thereof |
| 04/17/2013 | CN102102001B High thermal conductivity graphene-based epoxy resin adhesive and preparation method thereof |
| 04/17/2013 | CN102040935B Weak-exothermic room temperature curing epoxy adhesive |
| 04/17/2013 | CN102010686B Double-solidification system fast-flowing underfill and preparation method thereof |
| 04/11/2013 | WO2013051458A1 Adhesive composition for medical apparatus and endoscopic device |
| 04/11/2013 | WO2013050543A1 Polymeric ptc thermistors |
| 04/11/2013 | WO2013013128A3 Thermally expanding adhesive sheet and manufacturing method thereof |
| 04/11/2013 | US20130090431 Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| 04/11/2013 | US20130088542 Epoxy resin composition |
| 04/10/2013 | EP2578650A1 Composition for use as coating material and adhesive, method for adhesive bonding, and laminated products |
| 04/10/2013 | EP2578624A1 Polymeric PTC thermistors |
| 04/10/2013 | EP2576717A1 Conductive adhesive |
| 04/10/2013 | CN103038299A Composition for use as coating material and adhesive, method for adhesive bonding, and laminated products |
| 04/10/2013 | CN103031107A Glass bonding agent |
| 04/10/2013 | CN103031102A Bicomponent dip solution for bonding polyester chord thread and rubber and preparation process of bicomponent dip solution |
| 04/10/2013 | CN103031098A SMT paster adhesive and preparation method thereof |
| 04/10/2013 | CN103031097A Composite high-strength adhesive resin and preparation method thereof |
| 04/10/2013 | CN103031096A Segregated asphalt pavement repairing solution and application thereof |
| 04/10/2013 | CN102408862B Antifriction putty |
| 04/10/2013 | CN102391812B Iron repairing agent |
| 04/10/2013 | CN102167962B Photocuring adhesive used for adhering optic glass lenses and preparation method thereof |
| 04/04/2013 | WO2013047046A1 Adhesive agent and method for disassembling adhered structure |
| 04/04/2013 | WO2013045398A1 Optoelectronic component comprising an adhesive layer, method for producing an adhesive layer in an optoelectronic component, and use of an adhesive to form adhesive layers in optoelectronic components |
| 04/04/2013 | US20130085209 Epoxy resin compositions comprising a 2-oxo-[1,3] dioxolane derivative |
| 04/04/2013 | US20130082547 Sealing resin composition for hdd motor and hdd motor fabricated by using the same |
| 04/04/2013 | DE102011114559A1 Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen An optoelectronic component comprising an adhesive layer Process for the preparation of an adhesive layer in an optoelectronic device and use of an adhesive for forming adhesive layers in optoelectronic devices |
| 04/03/2013 | CN103025840A Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| 04/03/2013 | CN103025839A Adhesive composition, coating composition, primer using same, inkjet ink, adhesive method, and laminate |
| 04/03/2013 | CN103013438A Repairing adhesive of textile machine |
| 04/03/2013 | CN103013426A Adhesive used for bonded nylon |
| 04/03/2013 | CN103013416A Light sensitive glass film binding agent |
| 04/03/2013 | CN103013414A Alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and preparation method thereof |
| 04/03/2013 | CN103013413A Flame-retardant adhesive for timbers |
| 04/03/2013 | CN103013412A Adhesive for silicon rod/silicon ingot slicing and method for preparing same |
| 04/03/2013 | CN103013411A Insulated and heat-conducting film adhesive and preparation method thereof |
| 04/03/2013 | CN103013410A Binding agent with high fire resistance |
| 04/03/2013 | CN103013409A Epoxy resin adhesive |
| 04/03/2013 | CN103013408A Preparation method of conductive adhesive cured at room temperature |
| 04/03/2013 | CN103013407A Preparation method of spot-weld adhesive |
| 04/03/2013 | CN103012744A Method for modifying epoxide resin by using polyurethane prepolymer with spiro structure |
| 04/03/2013 | CN103009744A Glass building adhering film |
| 04/03/2013 | CN102417806B High-temperature binder, preparation method and application thereof |
| 04/03/2013 | CN102031082B Benzimidazole diamine curing type epoxy adhesive and preparation method thereof |
| 04/03/2013 | CN101812280B Environment-friendly heat conduction insulating glue used by high-power LEDs and preparation method |
| 04/03/2013 | CN101245231B Adhesive composition, adhesive film, and method for producing semiconductor device |
| 03/28/2013 | WO2013042614A1 Novel hydrazide compound and resin composition using same |
| 03/28/2013 | WO2013041568A1 Electrically conductive adhesives comprising silver-coated particles |
| 03/28/2013 | WO2013041425A1 Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners and catalysts |
| 03/28/2013 | WO2012075344A3 Improved adhesive film layer for printed circuit board applications |
| 03/28/2013 | US20130079475 Adhesive compositions for use in die attach applications |
| 03/28/2013 | US20130079435 Benzylated Polyamine Curing Agents |