| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 06/12/2013 | CN102181253B Light emitting diode (LED) epoxy encapsulation adhesive |
| 06/12/2013 | CN101935502B Bonding structure and bonding method and disc driving device and manufacturing method thereof |
| 06/12/2013 | CN101805575B High-performance conductive silver paste and preparation method thereof |
| 06/06/2013 | WO2013082396A1 Epoxy curative composition and compositions therefrom |
| 06/06/2013 | WO2013080708A1 Resin composition, resin composition sheet, semiconductor device and method for manufacturing same |
| 06/06/2013 | WO2013079563A1 Dual cure system |
| 06/06/2013 | US20130143983 Liquid resin composition and semiconductor device |
| 06/06/2013 | CA2857026A1 Epoxy curative composition and compositions therefrom |
| 06/06/2013 | CA2856956A1 Dual cure system |
| 06/05/2013 | CN103140558A Adhesive composition and adhesive sheet for manufacturing semiconductor package |
| 06/05/2013 | CN103140533A Epoxy resin compositions |
| 06/05/2013 | CN103131383A Pitch waterproof sealant |
| 06/05/2013 | CN103131375A Liquid crystal problem-solving sealant composition for display component and sealant formed by curing same |
| 06/05/2013 | CN103131374A Inorganic/organic nano particle compound modification epoxy resin adhesive and preparation method thereof |
| 06/05/2013 | CN103131373A Composite adhesive for single-sided film reinforced little glue mica tape and preparation method thereof |
| 06/05/2013 | CN103131372A 2,6-bis(2,4-diamidophenoxy)toluene high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/05/2013 | CN103131371A 4,4'-bis(2,4-diamidophenoxy)diphenylmethane high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/05/2013 | CN103131370A 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/05/2013 | CN103131369A 4,4'-bis(2,4-diamidophenoxy)diphenylsulphone high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/05/2013 | CN103131368A 4,4'-bis(2,4-diamidophenoxy)diphenyl ether high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/05/2013 | CN103131367A Adhesive composition, adhesive film and electronic device |
| 06/05/2013 | CN103131366A Thermal curing granular epoxy adhesive and preparation method thereof |
| 06/05/2013 | CN103131365A Single component room temperature curing epoxy construction glue |
| 06/05/2013 | CN103131364A Preparation method of single component room temperature curing epoxy construction glue |
| 06/05/2013 | CN103131355A Under-fill material and method for producing semiconductor device |
| 06/05/2013 | CN102352211B Epoxy resin metal adhesive and preparation method thereof |
| 06/05/2013 | CN102220102B High-temperature resisting adhesive and preparation method thereof |
| 06/05/2013 | CN102181251B Epoxy resin adhesive modified by unsaturated polyimide and preparation method thereof |
| 06/05/2013 | CN102007171B Adhesive formula and method for treating reinforcement inlays |
| 06/05/2013 | CN101948668B Halogen-free inflaming retarding adhesive for preparing flexible copper clad laminate (CCL) material and preparation method thereof |
| 06/05/2013 | CN101528799B Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
| 05/30/2013 | US20130137796 Epoxy Adhesive |
| 05/29/2013 | CN202951464U Production system of epoxy resin pouring sealant |
| 05/29/2013 | CN103124778A Adhesive composition and film for preparing semiconductor |
| 05/29/2013 | CN103124474A Conductor foil with adhesive layer, conductor-clad laminate, printed wiring board and multilayer wiring board |
| 05/29/2013 | CN103122234A Adhesive for gluing piezoelectric ceramic buzzing slice and preparation method |
| 05/29/2013 | CN103122233A Conductive epoxy adhesive |
| 05/29/2013 | CN103122232A 2,2-di[4-(2,4-diamino phenoxy) phenyl] propane form high-temperature epoxy adhesive and preparation method thereof |
| 05/29/2013 | CN103122231A 1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and preparation method thereof |
| 05/29/2013 | CN103122230A Cold welding adhesive for leakage sealing of liquid propellant and application method |
| 05/29/2013 | CN103122229A High-performance sealant used in alkaline batteries and manufacturing method of high-performance sealant |
| 05/29/2013 | CN102277118B Halogen-free flame-retardant epoxy resin building structural adhesive and preparation method thereof |
| 05/29/2013 | CN102086352B Reinforced rubber sheet suitable for construction on steel plate with oil surface at low temperature, and preparation method thereof |
| 05/23/2013 | WO2013074265A1 Adhesive compositions |
| 05/23/2013 | WO2013073902A1 Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same |
| 05/23/2013 | US20130126789 Thermosetting adhesive |
| 05/23/2013 | US20130126091 Adhesive for fixing and/or embedding an electronic component and method and use |
| 05/22/2013 | EP2595460A1 Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof |
| 05/22/2013 | CN103119116A 导电粘合剂 Conductive adhesives |
| 05/22/2013 | CN103114526A Steel bridge deck pavement cold mixing maintenance material and manufacturing method thereof |
| 05/22/2013 | CN103113842A Single-component low-viscosity heat curing double-system structural adhesive and preparation method thereof |
| 05/22/2013 | CN103113841A Preparation method of strong-acid-resistant epoxy resin quick plugging agent |
| 05/22/2013 | CN103113544A Phenolic aldehyde modified amine curing agent and preparation method thereof |
| 05/22/2013 | CN102408857B Anchoring adhesive and preparation process thereof |
| 05/22/2013 | CN101678648B Steel product composite and process for producing the steel product composite |
| 05/16/2013 | WO2013070415A1 Structural adhesive and bonding application thereof |
| 05/16/2013 | WO2013069368A1 Adhesive agent composition |
| 05/16/2013 | WO2013067963A1 A structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same |
| 05/16/2013 | WO2013067947A1 Dual-curable adhesive composition, use thereof, and process for bonding substrates |
| 05/16/2013 | CA2854825A1 Structural adhesive and bonding application thereof |
| 05/15/2013 | EP2592126A1 Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each |
| 05/15/2013 | CN103109354A Method for manufacturing electronic component |
| 05/15/2013 | CN103102858A COB liquid epoxy resin packaging material and preparation method thereof |
| 05/15/2013 | CN103102857A High-temperature resistant adhesive for glass and preparation method thereof |
| 05/15/2013 | CN103102856A Method of producing adhesive through composite |
| 05/15/2013 | CN103102855A Metal repair adhesive for machining |
| 05/15/2013 | CN103102687A One-component room curing sealing material and preparation method thereof |
| 05/15/2013 | CN102127383B High-temperature-resistance adhesive capable of curing at room temperature |
| 05/15/2013 | CN101501154B Adhesive tape, joint structure, and semiconductor package |
| 05/15/2013 | CN101341225B Composite material, especially multilayer material, and adhesive or bonding material |
| 05/14/2013 | US8440746 One component epoxy structural adhesive composition prepared from renewable resources |
| 05/10/2013 | WO2013065788A1 Die bonding agent |
| 05/09/2013 | US20130115442 Structural adhesive and bonding application thereof |
| 05/08/2013 | EP2589635A1 Interlaminar bonding agent and waterproof structure and waterproofing method |
| 05/08/2013 | EP2588554A2 Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
| 05/08/2013 | CN103098192A Adhesive for electronic components, and manufacturing method for semiconductor chip mount |
| 05/08/2013 | CN103097427A Liquid curable epoxy resin composition and adhesive agent containing same |
| 05/08/2013 | CN103087665A High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof |
| 05/08/2013 | CN103087664A Relay liquid state epoxy resin pouring sealant and preparation method thereof |
| 05/08/2013 | CN103087663A Reinforcing film matrix composition and its preparation method, reinforcing film and steel plate composite material |
| 05/08/2013 | CN102492376B Method for preparing perchlorovinyl conductive adhesive dried quickly at room temperature |
| 05/08/2013 | CN102329593B High-strength structural adhesive |
| 05/08/2013 | CN102260480B High-temperature-resistant modified epoxy resin adhesive and preparation method thereof |
| 05/08/2013 | CN102153976B Preparation method of graphene/nano silver epoxy conductive adhesive |
| 05/08/2013 | CN102108264B Single-component epoxy structure adhesive tape and preparation method thereof |
| 05/08/2013 | CN102010679B Adhesive for connection of circuit member and semiconductor device using the same |
| 05/08/2013 | CN101955630B Delay cured resin composition |
| 05/08/2013 | CN101914362B Two-component adhesive capable of being cured at room temperature and synthesis method thereof |
| 05/08/2013 | CN101906280B Halogen-free epoxy adhesive for polyethylene terephthalate (PET) protective film or insulation layer and preparation method thereof |
| 05/08/2013 | CN101550324B Reversible dry adhesives |
| 05/07/2013 | CA2529737C Adhesive epoxy composition and process for applying it |
| 05/02/2013 | WO2013061830A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet-form molded body, manufacturing method of these, and electronic component |
| 05/02/2013 | WO2013061255A1 Adhesive composition |
| 05/02/2013 | CA2852382A1 Adhesive composition |
| 05/01/2013 | EP2586817A1 Aluminum chelate-based latent curing agent |
| 05/01/2013 | CN103080265A High performance die attach adhesives (DAAs) nanomaterials for high brightness LED |
| 05/01/2013 | CN103080258A Method for disassembling bonded body, and adhesive |
| 05/01/2013 | CN103074026A Bismaleimide/cyanate ester resin adhesive resisting to temperature as high as 220 DEG C and preparation method |
| 05/01/2013 | CN103074022A Heat-conducting electronic pouring sealant containing modified filler |
| 05/01/2013 | CN103074021A Organosilicon bimaleimide-epoxy conductive adhesive for LED |