| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 07/10/2013 | CN103194163A Preparation method of moderate-temperature solidified and high-temperature resistant conductive adhesive |
| 07/10/2013 | CN103194162A Conductive adhesive with high vibration damping performance and preparation method thereof |
| 07/10/2013 | CN103194161A Positive temperature coefficient (PTC) material used for heat safety protection of lithium ion battery, and application thereof |
| 07/10/2013 | CN103193958A Preparation method and applications of hyperbranched epoxy polymer |
| 07/10/2013 | CN102627752B Preparation method for waterborne epoxy resin emulsion |
| 07/10/2013 | CN102208558B Substrate for flexible luminescent device and preparation method thereof |
| 07/10/2013 | CN102010572B Environment-friendly epoxy resin composition as well as preparation method and application thereof |
| 07/10/2013 | CN101928540B Epoxy conductive adhesive and preparation method thereof |
| 07/10/2013 | CN101836334B Anisotropic electroconductive film, and process for producing connection structure using the same |
| 07/10/2013 | CN101833215B Transfer structure of flexible electronic device and manufacturing method thereof |
| 07/10/2013 | CN101654504B Alkylated 4-aminobenzyl-4-aminocyclohexane |
| 07/10/2013 | CN101578344B Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them |
| 07/09/2013 | US8480846 Silica and also epoxy resins |
| 07/09/2013 | US8480845 Thermosetting solvent-free single-component compositions and their use |
| 07/04/2013 | WO2013097761A1 Adhesive composition for temporarily bonding use in wafer manufacturing |
| 07/04/2013 | WO2013055154A3 Double-sided polarizing plate and optical device including same |
| 07/04/2013 | US20130171454 Composition Capable of Radiation Activated Catalysis and Radiation Curable Urethane Containing the Composition |
| 07/03/2013 | CN103189464A Adhesive composition, method for producing semiconductor device, and semiconductor device |
| 07/03/2013 | CN103184025A Crack pouring adhesive for concrete cracks and application of crack pouring adhesive |
| 07/03/2013 | CN103184024A Reversible bonding-debonding epoxy resin adhesive and preparation method thereof |
| 07/03/2013 | CN103184023A Conductive silver adhesive for micropore filling and preparation method thereof |
| 07/03/2013 | CN103184022A Adhesive composition used for temporary adhesion in wafer preparation |
| 07/03/2013 | CN103184017A Additive for anisotropic conductive adhesives and preparation method thereof |
| 07/03/2013 | CN103184016A Anisotropic conductive film and electronic device |
| 07/03/2013 | CN103184014A Adhesive composition for semiconductor, adhesive film and semiconductor device |
| 07/03/2013 | CN102643621B Epoxy resin adhesive for impregnation with high heat resistance and preparation method thereof |
| 07/03/2013 | CN102504738B Quick mending agent |
| 07/03/2013 | CN102391816B High-temperature repairing agent |
| 07/03/2013 | CN102391814B Abrasion-resistant repair agent |
| 07/03/2013 | CN102311715B Healant for chemical pipes and preparation method thereof |
| 07/03/2013 | CN102174172B Waterborne rosin-based epoxy resin and preparation method as well as application thereof |
| 07/03/2013 | CN102119201B One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| 07/03/2013 | CN101760162B Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof |
| 06/27/2013 | WO2013094998A1 Adhesive composition for semiconductor, and adhesive film comprising same |
| 06/27/2013 | WO2013094924A1 Adhesive film for semiconductor and semiconductor package using same |
| 06/27/2013 | WO2013094543A1 Conductive adhesive |
| 06/27/2013 | US20130165603 Adhesive Composition And Adhesive Film Comprising The Same |
| 06/27/2013 | US20130165551 Adhesive resin composition for hdd motor and hdd motor fabricated using the same |
| 06/26/2013 | EP2606097A1 Pressure sensitive adhesives based on renewable resources and related methods |
| 06/26/2013 | CN203021491U Bonding film |
| 06/26/2013 | CN103180400A Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds |
| 06/26/2013 | CN103180359A Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| 06/26/2013 | CN103178213A Organic light emitting display device and method for fabricating the same |
| 06/26/2013 | CN103173183A Polyurethane modified epoxy resin adhesive and preparation method thereof |
| 06/26/2013 | CN103173177A Black sealant composition for liquid crystal display element |
| 06/26/2013 | CN103173176A Bi-component modified epoxy adhesive and preparation method thereof |
| 06/26/2013 | CN103173175A Organic silicone modified epoxy resin sealant and preparation method thereof |
| 06/26/2013 | CN103173174A Adhesive resin composition for HDD motor and HDD motor fabricated using the same |
| 06/26/2013 | CN103173173A Bi-component epoxy adhesive and preparation method thereof |
| 06/26/2013 | CN103173172A High-damping halogen-free pouring sealant and preparation method thereof |
| 06/26/2013 | CN103173171A Preparation method of colored skid-free road surface layer binding material |
| 06/26/2013 | CN103173160A Shock and noise reduction-type conductive adhesive |
| 06/26/2013 | CN103173159A Frame sealant compound, method for preparing same and display device |
| 06/26/2013 | CN103173143A Anisotropic conductive film and semiconductor device |
| 06/26/2013 | CN103172832A Epoxy resin early-strength curing agent for binding and preparation method thereof |
| 06/26/2013 | CN103171232A Method for compositing leather on surface of bonder used by car door interior parts and containing modified diatomite |
| 06/26/2013 | CN101961936B Halogen-free fire-retarding dry mica tape |
| 06/26/2013 | CN101961935B Corona-resistant slight-glue mica tape and adhesive therefor |
| 06/26/2013 | CN101636672B Photocurable adhesive agent, polarizing plate using the photocurable adhesive agent, method for production of the polarizing plate, optical member, and liquid crystal display device |
| 06/20/2013 | WO2013089062A1 Adhesive agent, and method for connecting electronic component |
| 06/20/2013 | US20130158231 Liquid curable epoxy resin composition and adhesive agent containing same |
| 06/20/2013 | US20130158166 Curable epoxy composition with quaternary ammonium bicarbonate curing catalyst |
| 06/20/2013 | US20130154129 Anisotropic conductive film and semiconductor device bonded by the same |
| 06/20/2013 | US20130154125 Adhesive film and electronic device including the same |
| 06/19/2013 | EP2603568A1 Epoxy structural adhesive |
| 06/19/2013 | CN103168059A Resin composition |
| 06/19/2013 | CN103160234A High-performance thermosetting epoxy resin adhesive for roads and bridges and preparation method thereof |
| 06/19/2013 | CN103160233A Cardanol modified epoxy pouring sealant and preparation method thereof |
| 06/19/2013 | CN103160232A Pouring sealant containing modified magnesium powder and preparation method of pouring sealant |
| 06/19/2013 | CN103160229A Glue liquor for environment-friendly light laminated board, laminated board and preparation method of glue liquor |
| 06/19/2013 | CN103160221A Anisotropic conductive film and semiconductor device bonded by the same |
| 06/19/2013 | CN103160220A Adhesive film and electronic device including the same |
| 06/19/2013 | CN103160219A Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same |
| 06/19/2013 | CN102634314B Heat-conducting epoxy dipped adhesive and preparation method |
| 06/19/2013 | CN102504205B Preparation method for epoxy hardener resistant to boiling water boiling |
| 06/19/2013 | CN102337099B Single-component photo-curable and thermal-curable adhesive and preparation method thereof |
| 06/19/2013 | CN101643538B Benzylated aminopropylated ethylenediamines and uses thereof |
| 06/19/2013 | CN101643537B Alkylated aminopropylated ethylenediamines and uses thereof |
| 06/13/2013 | WO2013086014A1 Vegetable oil-based pressure-sensitive adhesives |
| 06/13/2013 | WO2013086012A2 Pressure sensitive adhesives based on fatty acids |
| 06/13/2013 | WO2013086004A1 Pressure sensitive adhesives based on carboxylic acids and epoxides |
| 06/13/2013 | WO2013084708A1 Cationic hardening resin composition for hard disk drive assembly |
| 06/13/2013 | WO2013055158A3 Adhesive for polarizing plate, and polarizing plate comprising same |
| 06/13/2013 | US20130149531 Adhesive material |
| 06/13/2013 | US20130146816 One part epoxy resin including acrylic block copolymer |
| 06/13/2013 | US20130146223 Hardener for epoxy resins |
| 06/13/2013 | CA2858186A1 Structural adhesive compositions |
| 06/12/2013 | CN103155108A Method for manufacturing electronic component |
| 06/12/2013 | CN103146344A Aqueous inorganic and fireproof foam adhesive |
| 06/12/2013 | CN103146334A Flame-retardant intermediate-temperature cured epoxy film and preparation method thereof |
| 06/12/2013 | CN103146333A Environment-friendly decorative material for motor vehicles |
| 06/12/2013 | CN103146332A Injected type sealing agent applied to variable pressure resisting medium and processing method thereof |
| 06/12/2013 | CN103146331A 4,4'-bis(2,4-diamidophenoxy)biphenyl high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/12/2013 | CN103146330A 2,2-bis[4-(2,4-diamidophenoxy)phenyl]hexafluoropropane high-temperature-resistant epoxy adhesive and preparation method thereof |
| 06/12/2013 | CN103146329A Preparation method for epoxy adhesive modified by surface-modified nanoparticles |
| 06/12/2013 | CN103146314A Adhesive composition for semiconductor and adhesive film comprising the same |
| 06/12/2013 | CN103144388A Preparation method and application of polyaniline/titanium dioxide/graphene conductive composite membrane |
| 06/12/2013 | CN102516714B Preparation method of nano epoxy resin composite material |
| 06/12/2013 | CN102453458B Nano rubber modified room temperature cured high temperature resistant structure adhesive |
| 06/12/2013 | CN102391824B Preparation process for polyamide hot-melt adhesive powder |