| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 08/28/2013 | CN103265924A Silvered carbon nano-tube and epoxy resin conductive adhesive |
| 08/28/2013 | CN103265923A Epoxy resin composite for high-power LED (light-emitting diode) encapsulation and preparation method thereof |
| 08/28/2013 | CN103265922A Cold construction color cementing material for resin concrete |
| 08/28/2013 | CN103265907A Wear-resistant conductive adhesive composition |
| 08/28/2013 | CN103265906A Red glue containing wear resistance reinforcing agent and preparation method thereof |
| 08/28/2013 | CN103265905A Wear-resistant casting glue and preparation method thereof |
| 08/28/2013 | CN102582176B Mica tape for motor and preparation method of mica tape |
| 08/28/2013 | CN102504742B Bonding glue quickly solidified at room temperature |
| 08/28/2013 | CN102140324B Elastic adhesive for optical fiber gyro and preparation method of elastic adhesive |
| 08/28/2013 | CN102086372B Radiation curing adhesive and preparation method thereof |
| 08/28/2013 | CN101787251B Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
| 08/28/2013 | CN101781542B Binding agent suitable for high-order high-density interconnected laminated plates |
| 08/27/2013 | US8518208 High performance adhesive compositions |
| 08/22/2013 | US20130217804 Curable and cured compositions |
| 08/22/2013 | US20130213593 Polyamine Polyamidoamine Epihaloohydrin Compositions and Processes for Preparing and Using the Same |
| 08/21/2013 | CN1726242B Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 08/21/2013 | CN103261353A Heat-curing sealant compositions having fast skin formation and high tensile strength |
| 08/21/2013 | CN103261348A Adhesive composition for a semiconductor, an adhesive film comprising the same and a semiconductor package using the same |
| 08/21/2013 | CN103261262A High-molecular-eight epoxy resin and resin film, resin composition, and cured article using high-molecular-weight epoxy resin |
| 08/21/2013 | CN103254863A Latent single-component LCD (liquid crystal display) packaging adhesive |
| 08/21/2013 | CN103254862A Sandwich adhesive for high-strength aramid fibre paper honeycomb and preparation method thereby |
| 08/21/2013 | CN103254861A Preparation method of novel plastic binding agent |
| 08/21/2013 | CN103254850A High-strength outdoor sealant and preparation method thereof |
| 08/21/2013 | CN103254841A Adhesive for production of corrugated board |
| 08/21/2013 | CN103254569A Highly thermally conductive resin cured product, highly thermally conductive semi-cured resin film, method of manufacturing same, and highly thermally conductive resin composition |
| 08/21/2013 | CN102618207B Bi-component polysulfide sealant and preparation method thereof |
| 08/21/2013 | CN102352212B High-strength metal adhesive and preparation method thereof |
| 08/21/2013 | CN102161285B Thermal transfer coating film and preparation method thereof |
| 08/21/2013 | CN102089398B Anisotropic conductive adhesive |
| 08/15/2013 | WO2013086277A3 Structural adhesive compositions |
| 08/15/2013 | US20130210961 Epoxy Composition with Crystallization Inhibition |
| 08/14/2013 | CN103249794A Composition for vulcanizing adhesion |
| 08/14/2013 | CN103249580A Bush- and bracket-integrated stabilizer bar |
| 08/14/2013 | CN103242797A Polyimide adhesive |
| 08/14/2013 | CN103242793A Toughened single-component epoxy resin |
| 08/14/2013 | CN103242792A Primer for metal substrate structural bonding and preparation method thereof |
| 08/14/2013 | CN103242791A TGBAPOPP (N,N,N,N-tetraglycidyl-2,2-bis[4-(4-aminphenoxy)phenyl] propane) type heat-resistant adhesive and preparation method thereof |
| 08/14/2013 | CN103242790A High temperature resistant mica tape adhesive and preparation method thereof |
| 08/14/2013 | CN103242789A Sticking glue for sticking electrolytic zinc cathode plate insulation bar and production process of sticking glue |
| 08/14/2013 | CN103242788A Polyether modified epoxy resin sealant |
| 08/14/2013 | CN103242775A Acrylic ester modified epoxy resin conductive chip adhesive |
| 08/14/2013 | CN103242760A Composite-film-based adhesive tape |
| 08/14/2013 | CN103242747A Method for bonding low-pressure oil-filter outlet bushing of aeroengine |
| 08/14/2013 | CN103242510A Thermal conductive sheet |
| 08/14/2013 | CN102634286B Method for preparing photo-thermal dual curable type anisotropic conductive film |
| 08/14/2013 | CN102516916B Liquid crystal sealant composition |
| 08/14/2013 | CN102471661B Adhesive composition and endoscope |
| 08/14/2013 | CN102304339B High-temperature adhesive and application thereof |
| 08/14/2013 | CN102304272B Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same |
| 08/14/2013 | CN101747855B Low-resistivity single-component conductive silver paste and preparation method thereof |
| 08/14/2013 | CN101134878B 切割管芯键合膜 Cutting die bonding film |
| 08/07/2013 | EP2623575A1 Adhesive composition, coating composition, primer using same, inkjet ink, adhesive method, and laminate |
| 08/07/2013 | EP2621994A1 Epoxy resin compositions |
| 08/07/2013 | CN103232829A Light-moisture dual-curing adhesive |
| 08/07/2013 | CN103232828A High-adhesion and heat-resistant epoxy resin adhesive and using method thereof |
| 08/07/2013 | CN102391815B Anticorrosive repair agent |
| 08/07/2013 | CN102120865B Epoxy-phenolic aldehyde amine composition and preparation method and application thereof |
| 08/07/2013 | CN101855310B Composition for forming contact-bonding coating film of actinic-energy-ray curable type and strippable adhesive-coated paper employing the same |
| 08/06/2013 | US8501045 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
| 08/01/2013 | WO2013111775A1 Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method |
| 08/01/2013 | WO2013055158A4 Adhesive for polarizing plate, and polarizing plate comprising same |
| 08/01/2013 | US20130197130 B-stageable and skip-curable wafer back side coating adhesives |
| 07/31/2013 | CN103228753A Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
| 07/31/2013 | CN103224769A Fast curing high-strength removable structural adhesive and storage method thereof |
| 07/31/2013 | CN103224768A Steel-bar-planting glue and preparation method thereof |
| 07/31/2013 | CN103224767A Single-component epoxy resin sealant |
| 07/31/2013 | CN103224766A Solid wood floor adhesive |
| 07/31/2013 | CN102464861B Pipeline repairing carbon fiber composite material system and application thereof |
| 07/31/2013 | CN102234497B Structural pressure-sensitive adhesive, structural pressure-sensitive adhesive tape and preparation method of structural pressure-sensitive adhesive and structural pressure-sensitive adhesive tape |
| 07/31/2013 | CN102208555B Substrate used in luminescent device and preparation method thereof |
| 07/31/2013 | CN102181238B Heat-cured high-intensity flaky adhesive for automobile and preparation method thereof |
| 07/31/2013 | CN102002323B Adhesive film with dicing sheet and method of manufacturing the same |
| 07/25/2013 | US20130186562 Shape memory material based on a structural adhesive |
| 07/25/2013 | US20130186551 Foamed adhesive |
| 07/24/2013 | CN103222040A Adhesive composition, method for manufacturing semiconductor device, and semiconductor device |
| 07/24/2013 | CN103221449A Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-<wbr/>curing adhesive sheet |
| 07/24/2013 | CN102433087B High-temperature-resistant paper-plastic laminating adhesive and preparation method thereof |
| 07/24/2013 | CN101724225B Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam |
| 07/18/2013 | WO2013105163A1 Optical members and ultraviolet curable adhesive used in manufacturing same |
| 07/18/2013 | WO2013105162A1 Optical member, and ultraviolet-curable adhesive used in production of same |
| 07/18/2013 | US20130183520 Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet |
| 07/17/2013 | CN103205224A Acrylate emulsion laminating adhesive, and preparation method and application thereof |
| 07/17/2013 | CN102485822B Photocuring adhesive and its preparation method |
| 07/17/2013 | CN102391810B Heat-resisting color-changing anti-counterfeiting epoxy adhesive and preparation method thereof |
| 07/17/2013 | CN102209754B Resin composition for printed wiring board |
| 07/17/2013 | CN102208554B Substrate for flexible luminous device and preparation method thereof |
| 07/17/2013 | CN102153978B Room-temperature solidification heat-resistant epoxy adhesive |
| 07/17/2013 | CN101767481B Method for preparing highly heat-conductive copper-clad plate |
| 07/17/2013 | CN101679612B Resin composition for interlayer insulation of multilayer printed wiring board |
| 07/17/2013 | CN101615446B Rein membrane containing conductive particles and electronic component electrically connected with the same |
| 07/11/2013 | WO2013103116A1 Wafer-processing tape and method for manufacturing semiconductor device using same |
| 07/11/2013 | US20130178560 Two-part, cyanoacrylate /cationically curable adhesive systems |
| 07/11/2013 | US20130178554 Low-Tack, UV-Cured Pressure Sensitive Adhesive Suitable for Reclosable Packages |
| 07/11/2013 | US20130177719 Adhesive composition, coating composition, and primer, inkjet ink, adhesion method and laminate using the same composition |
| 07/10/2013 | CN103200772A Printed circuit board (PCB) with high computer telephone integration (CTI) and manufacturing method thereof |
| 07/10/2013 | CN103200766A Multilayer printed wiring board and manufacturing method thereof |
| 07/10/2013 | CN103199257A Binder for electrode of lithium battery and lithium battery containing the binder |
| 07/10/2013 | CN103194166A Photo-thermal double-curing conductive adhesive and preparation method thereof |
| 07/10/2013 | CN103194165A Method for preparing high-heat-conductivity conductive adhesive containing graphene |
| 07/10/2013 | CN103194164A High temperature self-repairing conductive silver adhesive and preparation method thereof |