| Patents for C09G 1 - Polishing compositions (7,846) |
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| 08/13/2002 | US6432828 Mixture containing oxidizer, complexing agent and abrasive |
| 08/13/2002 | US6432151 Preparing method of silica slurry for wafer polishing |
| 08/08/2002 | WO2002061824A2 Slurry and method for chemical mechanical polishing of copper |
| 08/08/2002 | WO2002061810A1 Ammonium oxalate-containing polishing system and method |
| 08/08/2002 | WO2002061028A1 Floor cleaner and gloss enhancer |
| 08/08/2002 | WO2002061008A2 Alkali metal-containing polishing system and method |
| 08/08/2002 | WO2002061007A1 Two component protective lustering agent for coated surface |
| 08/08/2002 | US20020106900 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
| 08/08/2002 | US20020104269 Polishing composition includes one or more photochemically reactive compounds, especially ketones, alkylhalides, azo compounds, aldehydes, amines, peroxides, titanium oxide, or combinations thereof. |
| 08/08/2002 | US20020104268 Slurry for chemical mechanical polishing |
| 08/07/2002 | EP1229094A2 Polishing composition and polishing method employing it |
| 08/07/2002 | EP1229093A1 Polishing composition and polishing method employing it |
| 08/07/2002 | EP1228161A1 Cmp products |
| 08/07/2002 | EP1228159A1 Improved cmp products |
| 08/06/2002 | US6429133 Composition compatible with aluminum planarization and methods therefore |
| 08/06/2002 | US6428721 Polishing composition and polishing method employing it |
| 08/01/2002 | WO2002059393A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 08/01/2002 | US20020102923 Polishing composition and polishing method for polishing a substrate to be used for a memory hard disk employing it |
| 08/01/2002 | US20020100895 For polishing multiple metal layers and thin-films where one of the layers or films is comprises of copper or a copper containing alloy |
| 08/01/2002 | CA2431591A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 07/31/2002 | EP1227116A1 Two-component coating composition and method of preparation |
| 07/31/2002 | EP1226220A1 Polishing system and method of its use |
| 07/31/2002 | CN1361923A Polishing mixture and process for reducing the incorporation of copper into silicon wafers |
| 07/31/2002 | CN1361750A Cerium phosphate and/or lanthenum sol, preparation method and use for polishing |
| 07/31/2002 | CN1361220A Acid aluminium shapes polishing agent containing hydrofluoric acid |
| 07/31/2002 | CN1361064A Cerium oxide sol and abrasive |
| 07/30/2002 | US6426295 Mixing surfactant of at least 100 parts per million to slurries to form polishing solution, chemical-mechanical planarizing of semiconductor wafer using polishing solution to form microelectronic substrate |
| 07/30/2002 | US6426294 Polishing conductive material film comprising copper or copper alloy using aqueous composition comprising pyridine-based carboxylic acid and acid having one carboxyl and one hydroxyl group or oxalic acid, abrasive grains and oxidizing agent |
| 07/30/2002 | US6425929 For cleanin and polishing fuel tanks of large trucks |
| 07/25/2002 | WO2002057382A2 A cmp polishing pad including a solid catalyst |
| 07/25/2002 | WO2002057052A1 Abrasive free polishing in copper damascene applications |
| 07/25/2002 | US20020098784 Abrasive free polishing in copper damascene applications |
| 07/25/2002 | US20020098700 In closed container without generating hydrogen gas; a dry acid, iron, and an inhibited carbon dioxide generating compound (an encapsulated carbonate or bicarbonate); activated by injection of water; delayed carbon dioxide generation |
| 07/25/2002 | US20020098697 Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same |
| 07/25/2002 | US20020096659 Polishing composition and polishing method employing it |
| 07/25/2002 | US20020095874 Slurry for chemical mechanical polishing |
| 07/25/2002 | US20020095873 Aqueous dispersions, process for their production, and their use |
| 07/25/2002 | US20020095872 For polishing a metal film formed on an insulating film with a concave on a substrate |
| 07/24/2002 | EP1224239A2 Zwitterionic siloxane polymers and ionically cross-linked polymers formed therefrom |
| 07/24/2002 | CN1359998A Acidic polishing cream for chemicomechanically polishing SiO2 isolating layer |
| 07/24/2002 | CN1359997A Polishing cream for polishing silicon dioxide film by chemicomechanical process |
| 07/24/2002 | CN1359996A Surface treatment agent for wood floor material and mfg. method thereof |
| 07/23/2002 | US6423303 Sunscreen agents, polysiloxane polyether copolymers with oils and emulsification system |
| 07/23/2002 | US6423125 Polishing composition |
| 07/18/2002 | WO2002056351A2 Polishing of semiconductor substrates |
| 07/18/2002 | WO2002055259A2 Tantalum removal during chemical mechanical processing |
| 07/18/2002 | US20020093002 Chemical mechanical polishing slurry |
| 07/18/2002 | US20020092827 Abrasive-free metal CMP in passivation domain |
| 07/17/2002 | EP1223609A1 Polishing compound for chemimechanical polishing and polishing method |
| 07/17/2002 | CN1087870C Improved polishing slurries and method for their use |
| 07/17/2002 | CN1087765C Slurry using Mn oxide abrasives and fabrication process of semiconductor device using such slurry |
| 07/16/2002 | US6419557 Polishing method and polisher used in the method |
| 07/11/2002 | WO2002053490A2 Method of making optical fluoride laser crystal components |
| 07/11/2002 | WO2000073396A9 Slurry composition and method of chemical mechanical polishing using same |
| 07/11/2002 | US20020090894 Method for polishing a semiconductor substrate member |
| 07/11/2002 | US20020090820 Tantalum removal during chemical mechanical polishing |
| 07/11/2002 | DE10064413A1 System zur Beschichtung von Fußböden System for the coating of floors |
| 07/10/2002 | EP1221469A2 Finishing agents and method of using the same |
| 07/10/2002 | CN1357587A Sprayed automobile cleaning and brightening soft wax composition containing polymer resin |
| 07/10/2002 | CN1357586A Polishing composition and polishing method of substrate for memory and hard disk |
| 07/10/2002 | CN1357585A Chemical and mechanical polishing paste for metal and dielectric structure |
| 07/09/2002 | USRE37786 Mixture of aminocarboxylic acid, oxidizer and water |
| 07/09/2002 | US6416685 Use of soft abrasive polymer particles in slurry can reduce mechanical abrasion |
| 07/04/2002 | WO2002051955A1 Prevention of precipitation defects on copper interconnects during cmp by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 07/04/2002 | WO2001074959A3 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 07/04/2002 | US20020086618 Cerium oxide sol and abrasive |
| 07/04/2002 | US20020083650 Polishing of semiconductor substrates |
| 07/04/2002 | DE10065027A1 Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung An aqueous dispersion, a process for their preparation and use |
| 07/03/2002 | EP1219568A2 Cerium oxide sol and abrasive |
| 07/03/2002 | EP1218466A1 Compositions for and methods of reducing/eliminating scratches and defects in silicon dioxide cmp process |
| 07/03/2002 | EP1218465A1 Polishing system with stopping compound and method of its use |
| 07/03/2002 | EP1218464A1 Chemical mechanical polishing systems and methods for their use |
| 07/03/2002 | EP0946647B1 Dispersions of blended polycarboxypolyamide resins and alkali dispersible resins, their preparation and their use |
| 07/03/2002 | CN1356369A Apparatus for preparing grinding liquid |
| 07/02/2002 | US6413869 Dielectric protected chemical-mechanical polishing in integrated circuit interconnects |
| 07/02/2002 | US6413441 Magnetic polishing fluids |
| 07/02/2002 | US6413288 CMP polishing slurry dewatering and reconstitution |
| 06/27/2002 | WO2002050205A1 System for covering floors |
| 06/27/2002 | WO2002050204A1 Method for the chemical-mechanical polishing of isolation layers based on sti technology at elevated temperatures |
| 06/27/2002 | WO2002050149A1 Polymer-based floor-coating agent free of metal salts |
| 06/27/2002 | US20020082375 Continuous bulk polymerization and esterification process and compositions including the polymeric product |
| 06/27/2002 | US20020081949 Polishing composition |
| 06/27/2002 | US20020081865 Two slurries of silica particles, an oxidizing agent, a corrosion inhibitor, and a cleaning agent with differing removal rates on copper, the barrier and dielectric material |
| 06/27/2002 | US20020081853 Abrasive slurry and process for a chemical-mechanical polishing of a precious-metal surface |
| 06/27/2002 | US20020081849 Chemical mechanical polishing compositions for CMP removal of iridium thin films |
| 06/27/2002 | US20020081323 Organic silicone resin powder |
| 06/27/2002 | US20020078859 Surface treating agent for ligneous floorings and process for manufacturing the same |
| 06/27/2002 | DE10063492A1 Verfahren zum chemisch-mechanischen Polieren von Isolationsschichten nach der STI-Technik bei erhöhten Temperaturen A method for chemical mechanical polishing of insulating layers after the STI technology at elevated temperatures |
| 06/27/2002 | DE10063491A1 Saure Polierslurry für das chemisch-mechanische Polieren von SiO¶2¶-Isolationsschichten Acid polishing slurry for chemical mechanical polishing of SiO¶2¶ insulating layers |
| 06/27/2002 | DE10063488A1 Polierslurry für das chemisch-mechanische Polieren von Siliciumdioxid-Filmen Polishing slurry for chemical mechanical polishing of silicon dioxide films |
| 06/26/2002 | EP1217651A1 Acid polishing slurry for the chemical mechanical polishing of SiO2-isolation layers |
| 06/26/2002 | EP1217650A1 Polishing slurry for the chemical mechanical polishing of silicon dioxide films |
| 06/26/2002 | EP1217051A2 Surface treating agent for ligneous floorings and process for manufacturing the same |
| 06/26/2002 | EP1216958A2 Method for production of aqueous dispersion and use thereof |
| 06/25/2002 | US6410634 A metal crosslinked polymeric film former, nonabrasive flatting agent and a liquid vehicle solvent; matte finishes; surface coverings for floors, wallpaper, counter tops and automobiles; flatting agent suspended without hard sediment |
| 06/25/2002 | US6409936 Integrated circuit; corundum abrasive particles; etchant; nonionic surfactant brij (polyoxyethylene cetyl ether) |
| 06/25/2002 | US6409782 Powder composition and method for polishing stone |
| 06/25/2002 | US6409781 Polishing slurries for copper and associated materials |
| 06/25/2002 | US6409780 Solid material with water and inorganic particles in a slurry |
| 06/20/2002 | WO2002048280A1 Cerium based abrasive material and method for evaluating cerium based abrasive material |