| Patents for C09G 1 - Polishing compositions (7,846) |
|---|
| 03/20/2003 | US20030055184 Synthesis of poly-alpha olefin and use thereof |
| 03/20/2003 | US20030052308 A slurry for chemical mechanical polishing (CMP), containing alumina abrasive, aqueous ozone as oxidant with predetermined concentration and a benzotriazole as corrosion inhibitor |
| 03/20/2003 | US20030051413 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; H2O2 and water |
| 03/20/2003 | US20030051412 Cerium based abrasive material and method for evaluating cerium based abrasive material |
| 03/19/2003 | EP1292971A2 Ceria slurry and process for the chemical-mechanical polishing of silicon dioxide |
| 03/19/2003 | EP1163311B1 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| 03/19/2003 | EP0946119B1 All purpose cleaner and polish in abrasive applicator |
| 03/18/2003 | US6533850 No separation of the abrasives and additives and does not require shaking or mixing; water, gelling agent, chelating agent, abrasive, alkaline electrolyte viscosity increasing agent sufficient to raise the pH |
| 03/18/2003 | US6533832 For semiconductors; mixture of abrasive and alkanolamine |
| 03/18/2003 | US6533644 Method of texturing and agent therefor |
| 03/13/2003 | WO2003021651A1 Polishing fluid for metallic film and method for producing semiconductor substrate using the same |
| 03/13/2003 | WO2003020856A1 Synthesis of poly-alpha olefin and use thereof |
| 03/13/2003 | WO2003020839A1 Polishing composition |
| 03/13/2003 | US20030047710 Chemical-mechanical polishing |
| 03/13/2003 | US20030047539 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same |
| 03/13/2003 | CA2462169A1 Synthesis of poly-alpha olefin and use thereof |
| 03/11/2003 | US6530968 Chemical mechanical polishing slurry |
| 03/06/2003 | WO2003019646A1 Cmp polishing of barrier film |
| 03/06/2003 | WO2003018714A1 Abrasive free formulations for chemical mechanical polishing of copper and assocated materials and method of using the same |
| 03/06/2003 | US20030045097 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light |
| 03/06/2003 | US20030041773 Novel polish compositions and method of use |
| 03/06/2003 | US20030041527 10-40% of stannic oxide with an average particle size of 1-10 mu m, 60-90% of a stainless steel powder with an apparent density of 4.5-5 kg/dm3 and particle size of < .5mm and .01-20% of a powder wax |
| 03/06/2003 | US20030041526 Polishing composition |
| 03/05/2003 | EP1287088A1 Polishing composition |
| 03/05/2003 | CN1400995A Cerium based abrasive material and method for evaluating cerium based abrasive material |
| 03/05/2003 | CN1400266A Chemimechanical overall planar polishing solution of copper and tantalum in super-large-scale integrated circuit multilayer copper wiring |
| 03/04/2003 | US6527819 Polishing slurries for copper and associated materials |
| 03/04/2003 | US6527818 Excellent balance between chemical etching and mechanical polishing performance and aqueous dispersion for chemical mechanical polishing comprising an abrasive, water and a heteropolyacid |
| 03/04/2003 | US6527817 Composition and method for planarizing surfaces |
| 03/04/2003 | US6527622 CMP method for noble metals |
| 02/27/2003 | WO2003016424A1 Polishing slurry comprising silica-coated ceria |
| 02/27/2003 | WO2003015981A2 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same |
| 02/27/2003 | US20030040259 For narrow recesses spacings; solidification of fluid containing abrasive particles |
| 02/27/2003 | US20030040182 Methods and compositions for chemical mechanical polishing |
| 02/27/2003 | US20030037697 Second step polishing by CMP |
| 02/26/2003 | CN1399668A Composition and method for planarizing surfaces |
| 02/26/2003 | CN1398939A Polishing composition and its polishing method |
| 02/26/2003 | CN1398938A Chemical and mechanical leveling polishing liquid for multilayer copper wire in large scale integrated circuit |
| 02/25/2003 | US6524376 Anticorrosive agent |
| 02/25/2003 | US6524168 Composition and method for polishing semiconductors |
| 02/25/2003 | US6524167 Method and composition for the selective removal of residual materials and barrier materials during substrate planarization |
| 02/20/2003 | WO2003015148A1 Slurry composition for use in chemical mechanical polishing of metal wiring |
| 02/20/2003 | WO2003014251A1 Non-magnetic particles having a plate shape and method for production thereof, abrasive material, polishing article and abrasive fluid comprising such particles |
| 02/20/2003 | WO2003014021A1 Granules based on pyrogenically produced aluminium oxide, their production process and use |
| 02/20/2003 | US20030036569 Do not readily protonate (even in aqueous solutions of low pH), commonly encountered in many extreme applications due to the very low basicity of the perfluorinated anion. |
| 02/20/2003 | US20030036339 Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
| 02/20/2003 | US20030036267 Copper-based metal polishing solution and method for manufacturing semiconductor device |
| 02/18/2003 | US6521574 Copper-based metal polishing solution and method for manufacturing a semiconductor device |
| 02/18/2003 | US6520840 CMP slurry for planarizing metals |
| 02/13/2003 | WO2003012169A1 Metal surface protection film forming agent and application thereof |
| 02/13/2003 | WO2002044293A3 Method and composition for the removal of residual materials during substrate planarization |
| 02/13/2003 | WO2002024413A3 Polishing by cmp for optimized planarization |
| 02/13/2003 | US20030032371 Chemical mechanical polishing compositions and methods relating thereto |
| 02/13/2003 | US20030032368 Method for repairing and lustering deffects on hydrophilic coat surface |
| 02/13/2003 | US20030029095 For precise polish-finishing of metal, plastic, or glass, particularly employed for precise finishing of the surface of an aluminum magnetic disk (hard disk) |
| 02/12/2003 | EP1283250A1 Polishing composition and polishing method employing it |
| 02/11/2003 | US6518334 Preparation and use of dispersions of blended polycarboxypolyamide resins and alkali dispersible resins and compositions thereof |
| 02/11/2003 | US6517417 Polishing pad with a transparent portion |
| 02/06/2003 | US20030027499 Composition and method for polishing rigid disks |
| 02/06/2003 | US20030025200 Process of manufacturing semiconductor device and slurry used therefor |
| 02/05/2003 | CN1395295A Method for producing semiconductor device and used slurry |
| 02/04/2003 | US6514862 Particles, solvent and a quaternary ammonium compound such as (2-hydroxyethyl)trimethylammonium chloride; improved removal selectivity between a layer to be polished and a silicon nitride stop layer |
| 02/04/2003 | US6514821 Method for planarizing dielectric layer of flash memory |
| 01/30/2003 | WO2003009349A2 Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials |
| 01/30/2003 | US20030022502 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function |
| 01/30/2003 | US20030022499 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same |
| 01/30/2003 | US20030022081 Polycarbonate resin base; acrylic resin layer; ultraviolet absorbent coated on one surface of polycarbonate and a cured layer of polyorganosiloxane and a silicone-containing polymer ultraviolet absorbent on acrylic resin are cured |
| 01/30/2003 | US20030019162 Method for making abrasive compositions and products thereof |
| 01/29/2003 | EP1279708A1 Polishing composition and polishing method employing it |
| 01/29/2003 | CN1100104C Nano-class polishing liquid and its preparing process |
| 01/23/2003 | WO2003006205A2 Barrier removal at low polish pressure |
| 01/23/2003 | US20030017786 CMP slurry and method for manufacturing a semiconductor device |
| 01/23/2003 | US20030017785 Metal polish composition and polishing method |
| 01/22/2003 | EP1276826A2 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
| 01/22/2003 | CN1392215A Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it |
| 01/21/2003 | US6509272 Positioning pad for contact with wafer surface and planarizing surface using pad and fluid composition including a chelating agent |
| 01/21/2003 | US6509269 Elimination of pad glazing for Al CMP |
| 01/21/2003 | US6508953 Slurry for chemical-mechanical polishing copper damascene structures |
| 01/21/2003 | US6508952 Chemical mechanical abrasive composition for use in semiconductor processing |
| 01/16/2003 | WO2003005431A1 Chemical mechanical polishing slurry for semiconductor integrated circuit, polishing method and semiconductor integrated circuit |
| 01/16/2003 | WO2003004590A1 Lanolin substitute, production method thereof and applications of same |
| 01/16/2003 | US20030013387 Barrier removal at low polish pressure |
| 01/16/2003 | US20030013386 Chemical mechanical polishing compositions and methods relating thereto |
| 01/16/2003 | US20030013385 Nitride CMP slurry having selectivity to nitride |
| 01/16/2003 | US20030013306 Barrier to prevent copper diffusion; polishing using reducing agent |
| 01/16/2003 | CA2452298A1 Lanolin substitute, production method thereof and applications of same |
| 01/15/2003 | EP1274807A2 Polishing agent and method for producing planar layers |
| 01/15/2003 | EP1274772A1 Hydrophobizing microemulsions |
| 01/14/2003 | US6506682 Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof |
| 01/09/2003 | WO2003002678A1 Floor polish composition |
| 01/09/2003 | US20030007920 Crystalline ceric oxide sol and process for producing the same |
| 01/09/2003 | US20030006397 Slurry for chemical mechanical polishing silicon dioxide |
| 01/09/2003 | US20030006396 Polishing composition for CMP having abrasive particles |
| 01/09/2003 | US20030005647 Reactive aqueous metal oxide sols as polishingslurries for low dielectric constant materials |
| 01/08/2003 | EP1274123A1 Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same |
| 01/08/2003 | EP1272580A2 System for the preferential removal of silicon oxide |
| 01/08/2003 | EP1272579A2 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 01/08/2003 | CN1390248A Composition and method for planarizing surfaces |
| 01/08/2003 | CN1389533A Wooden floor and furniture curing agent and its prepn. |
| 01/07/2003 | US6503418 Ta barrier slurry containing an organic additive |