Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
10/2003
10/07/2003US6630403 Mixing a surfactant to a slurry to form a polishing solution; and planarizing of the microelectronic substrate using polishing solution
10/02/2003WO2003080757A1 Cerium based abrasive material and method for preparation thereof
10/02/2003US20030186634 Polishing particles and a polishing agent
10/02/2003US20030186497 Methods of polishing, interconnect-fabrication, and producing semiconductor devices
10/02/2003US20030182868 A problem to be solved is to provide a slurry that is capable of flattening an uneven film on a substrate with good precision, and that has good stability, not separating into two layers, solidifying through flocculated settling or
09/2003
09/30/2003US6627115 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
09/30/2003US6627107 Slurry for chemical mechanical polishing silicon dioxide
09/30/2003US6626968 For manufacturing semiconductor device
09/30/2003US6626967 Polishing composition and polishing method employing it
09/25/2003US20030181142 CMP method for noble metals
09/25/2003US20030181046 Inhibiting removal of silicon dioxide during metal layer removal by bonding with organic polymer
09/25/2003US20030178320 Comprises acid (phosphoric, sulfuric, perchloric, and/or acetic) based electrolytes, chelate agent (ethylenediamine), and corrosion inhibitor (benzotriazole)
09/24/2003EP1346003A2 Cerium-based abrasive, production process thereof
09/24/2003EP0970156B1 Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films
09/24/2003CN1122094C 抛光组合物 The polishing composition
09/24/2003CN1122093C Polishing composition used for manufacturing storage hard disk and polishing method
09/23/2003US6623856 Dental glass powders comprising spherical glass particles of specific particle size distribution
09/18/2003WO2003076538A1 Methanol-containing silica-based cmp compositions
09/18/2003US20030176072 Polishing compositions for noble metals
09/18/2003US20030176068 Chemical mechanical polishing composition and process
09/18/2003US20030173329 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
09/17/2003EP1343852A1 System for covering floors
09/17/2003CN1443231A Polishing fluid composition
09/16/2003US6620508 Oxide powder and method for preparing the same, and product using the same
09/16/2003US6620216 Small particle size abrasive, oxidizing agent and organic phosphonic acid; reducing fine scratches
09/16/2003US6620215 Abrasive composition containing organic particles for chemical mechanical planarization
09/16/2003US6620037 Chemical mechanical polishing slurry useful for copper substrates
09/12/2003WO2003075332A1 Polishing composition and method for forming wiring structure
09/12/2003WO2003050864A3 Method for copper cmp using polymeric complexing agents
09/11/2003US20030171072 Improved chemical mechanical polishing of nickel phoshorous alloys
09/11/2003US20030170991 Method of polishing a multi-layer substrate
09/11/2003US20030170987 Method for manufacturing slurry
09/11/2003US20030168635 For use in flat panel displays and lighting elements
09/11/2003US20030168628 Methanol-containing silica-based CMP compositions
09/11/2003US20030168627 Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
09/11/2003US20030167963 Polishes and their use
09/10/2003EP1342766A1 Cerium based abrasive material and method for evaluating cerium based abrasive material
09/10/2003EP1341864A1 Method for making abrasive compositions and products thereof
09/10/2003CN1441017A Chemical and mechanical polishing size and chemical and mechanical polishing method using said size
09/10/2003CN1120869C Sprayed automobile cleaning and brightening soft wax composition containing polymer resin
09/09/2003US6616717 Containing an oxidizer for oxidizing the metal, a metal complexing compound, and a polymer to bond with silanol surface groups on the silica to inhibit its removal during removal of the layer of metal by the polishing.
09/09/2003US6616514 For use in removing a first substance from a surface of an article in preference to silicon nitride; includes an abrasive, an aqueous medium, and an organic polyol that does not dissociate protons
09/09/2003US6616510 Chemical mechanical polishing method for copper
09/04/2003WO2003073481A2 Feedforward and feedback control of semiconductor fabrication process using secondary electron microscopy and a focused ion beam system
09/04/2003WO2003073448A2 Control of semiconductor fabrication process using scanning electron microscopy and a focused ion beam device
09/04/2003WO2003072683A1 Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
09/04/2003WO2003072672A1 Method and composition for polishing a substrate
09/04/2003WO2003072671A1 Cmp formulations for the use on nickel-phosphorus alloys
09/04/2003WO2003072670A1 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
09/04/2003WO2003072669A2 Polishing composition
09/04/2003US20030166381 Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
09/04/2003US20030166338 CMP slurry for metal and method for manufacturing metal line contact plug of semiconductor device using the same
09/04/2003US20030166337 Chemical mechanical polishing systems and methods for their use
09/04/2003US20030164471 Compositions for chemical mechanical planarization of copper
09/03/2003CN1440449A Silane containing polishing composition for CMP
09/02/2003US6613300 Doped, pyrogenically prepared oxides
09/02/2003US6612911 Alkali metal-containing polishing system and method
09/02/2003CA2294583C Improved plasticized aqueous coating compositions
08/2003
08/28/2003WO2003071593A1 Polishing method and polishing fluid
08/28/2003WO2003071592A1 Method and device for polishing
08/28/2003WO2003043780A3 Method for polishing a substrate surface
08/28/2003US20030162938 Aqueous suspensions containing polymerized fatty acid-based polyamides
08/28/2003US20030162683 Hydrophobizing microemulsions which improve the protection, drying rate and shine of surfaces
08/28/2003US20030162481 Chemical mechanical polishing of dual orientation polycrystalline materials
08/28/2003US20030162399 Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures
08/28/2003US20030162398 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
08/28/2003US20030159362 Applying slurry to soft surface layer
08/27/2003EP1337601A1 Slurry for chemical-mechanical polishing copper damascene structures
08/26/2003US6610114 Oxidizing polishing slurries for low dielectric constant materials
08/21/2003WO2003068883A1 Anionic abrasive particles treated with positively-charged polyelectrolytes for cmp
08/21/2003WO2003068882A1 Free radical-forming activator attached to solid and used to enhance cmp formulations
08/21/2003WO2003068881A1 Process for chemical-mechanical polishing of metal substrates
08/21/2003WO2002004573A3 Ready-to-use stable chemical-mechanical polishing slurries
08/21/2003US20030157804 For use in fabricating semiconductors, integrated circuits and microelectromechanical systems
08/21/2003US20030154659 Polishing composition
08/20/2003CN1437763A Abrasives for chemical mechanical polishing
08/20/2003CN1437643A Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
08/19/2003US6607571 Polishing composition and method
08/19/2003US6607424 Aqueous polishing mixture for chemical mechanical polishing of semiconductor substrates, having pH under 5.0, that comprises blend of at least two polyacrylic acids, one with low number average molecular weight and one with high, in specified ratio
08/14/2003US20030153189 Low cost and low dishing slurry for polysilicon CMP
08/14/2003US20030153188 LSI device polishing composition and method for producing LSI device
08/14/2003US20030153184 Method of polishing a multi-layer substrate
08/14/2003US20030153183 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
08/14/2003US20030150838 Powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide having an average particle diameter of not more than 0.1 mu m.
08/13/2003EP1335009A1 Dispersion for chemical mechanical polishing
08/13/2003EP1334516A2 Slurry and method for chemical mechanical polishing of copper
08/13/2003EP0933166B1 Abrasive and method for polishing semiconductor substrate
08/13/2003CN1436225A Polishing composition for metal CMP
08/12/2003US6604987 CMP compositions containing silver salts
08/07/2003WO2003064551A1 Compositions and methods for chemical-mechanical planarization o f noble-metal-featured substrates. these treated substrates
08/07/2003US20030148711 Method of making optical fluoride laser crystal components
08/07/2003US20030148708 Process and composition for abrading pre-finished surfaces
08/07/2003US20030148616 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide
08/07/2003US20030146404 Using fluorinated adjuvant
08/06/2003EP1333477A2 Use of fluorinated additives in the etching or polishing of integrated circuits
08/06/2003EP1333476A2 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
08/06/2003EP1333080A2 Aqueous disperson containing silicon dioxide powder, coated with cerium oxide, process for its preparation and its use
08/06/2003EP1086484A4 Slurry for chemical-mechanical polishing metal surfaces
08/06/2003EP1044163B1 Alumina powder, process for producing the same and polishing composition
08/06/2003CN1434846A Polishing composition
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