C09G 1 - Polishing compositions

Patents for C09G 1 - Polishing compositions (7,846)
01/2002
01/03/2002	WO2001041973A3 Chemical-mechanical polishing method
01/02/2002	EP1167482A2 Aqueous dispersion for chemical mechanical polishing used for polishing of copper
01/02/2002	EP1167481A1 Polish compositions for gloss enhancement, and method
01/02/2002	CN1329118A Polishing composition and polishing method
01/01/2002	US6334880 Abrasive media comprising non-spherical silica particles having nodular morphology and maximum liner dimensions between about 20 to 1000 nanometers
12/2001
12/27/2001	WO2001099170A2 Ceria slurry and process for the chemical-mechanical polishing of silicon dioxide
12/27/2001	WO2001098379A1 Solvent-containing pastes containing in addition polyolefin wax
12/27/2001	WO2001098201A2 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
12/27/2001	US20010056146 A metal crosslinked polymeric film former, nonabrasive flatting agent and a liquid vehicle solvent; matte finishes; surface coverings for floors, wallpaper, counter tops and automobiles; flatting agent suspended without hard sediment
12/25/2001	US6332831 Polishing composition and method for producing a memory hard disk
12/20/2001	US20010052589 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
12/20/2001	US20010052587 Chemical mechanical polishing slurry and method for polishing metal/oxide layers
12/19/2001	EP1163311A1 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
12/19/2001	EP1021491B1 Polishing agent and use thereof to planish a semiconductor substrate
12/13/2001	WO2001052618A3 Stabilized silica and methods of making and using the same
12/13/2001	WO2000000560A3 Chemical mechanical polishing slurry and method for using same
12/13/2001	US20010051746 Carboxylic acids having either hydroxyl or mercapto groups, monocarboxylic acids, dicarboxylic acids and salts thereof, an abrasive and water; reducing edge rounding (roll-off) of hard discs to increase recording capacity; polishing
12/13/2001	US20010051433 Chemical mechanical polishing using cesium hydroxide
12/13/2001	US20010049913 Mixture of abravive grains and oxidizer
12/13/2001	US20010049912 Prevention scratches
12/13/2001	US20010049910 Mixture containing oxidizer, complexing agent and abrasive
12/12/2001	CN1325933A Rolling reducing agent
12/11/2001	US6328944 Doped, pyrogenically prepared oxides
12/11/2001	US6328774 Useful for final polishing of the surface of a magnetic disk substrate in the preparation of substrate for magnetic disk
12/11/2001	US6328633 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
12/06/2001	DE10124741A1 Slurry used for the chemical-mechanical polishing of semiconductor components comprises water, grinding grains and a polymer additive having hydrophilic as well as hydrophobic groups
12/05/2001	EP1160300A2 Aqueous dispersion for chemical mechanical polishing
12/05/2001	CN1325540A Abrasive liquid for metal and method for polishing
12/05/2001	CN1324906A Polishing liquid for structurizing treatment of metal and metal oxide and method thereof
12/04/2001	US6326305 Controlling candida, cryptococcus, aspergillus infections
12/04/2001	US6326299 Method for manufacturing a semiconductor device
12/04/2001	US6325705 Chemical-mechanical polishing slurry that reduces wafer defects and polishing system
11/2001
11/29/2001	US20010046773 Composition for polishing metal on semiconductor wafer and method of using same
11/29/2001	US20010045063 Abrasive particles for surface polishing
11/29/2001	DE10024874A1 Polierflüssigkeit und Verfahren zur Strukturierung von Metallen und Metalloxiden Polishing liquid and method for patterning of metals and metal oxides
11/28/2001	EP1158033A1 Hard surface treating agent, stain-proofing agent and method for surface treatment
11/28/2001	CN1324286A Chilled temp. polishing method for soft acrylic articles
11/28/2001	CN1323864A 抛光组合物 The polishing composition
11/28/2001	CN1075541C 抛光组合物 The polishing composition
11/27/2001	US6322600 Planarization compositions and methods for removing interlayer dielectric films
11/22/2001	US20010044264 Polishing composition
11/22/2001	US20010044260 CMP polishing slurry dewatering and reconstitution
11/22/2001	US20010044209 Method for modification of polishing pattern dependence in chemical mechanical polishing
11/22/2001	US20010042853 Oxygen-containing, such as metal oxides, silicates, borates or titanates, small particle size, narrow particle size distribution; displays
11/21/2001	EP1156091A1 Polishing liquid and process of structuring metals and metal oxides
11/21/2001	EP1155092A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles
11/21/2001	CN1322788A Cleaning, waxing and lustering agent for automobile
11/20/2001	US6319977 Non-metal crosslinked addition polymer, from an anhydride copolymer and a diamine; amine-strippable, detergent resistant
11/20/2001	US6319096 Fumed metal oxide liquid carrier for generating uniformed, layered surfaces with minimal defects
11/20/2001	US6319095 Colloidal suspension of abrasive particles containing magnesium as CMP slurry
11/15/2001	WO2001085868A1 Polishing composition
11/15/2001	US20010041507 Chemical mechanical polishing slurry useful for copper/tantalum substrates
11/15/2001	US20010039766 Aqueous dispersion for chemical mechanical polishing
11/15/2001	DE10022649A1 Polishing liquid used for removing and/or structuring metal oxides, especially iridium oxide during chemical-mechanical polishing contains water, abrasive particles, and an additive selected from the group of phase-transfer catalysts
11/14/2001	EP0953024B1 Use of wax
11/14/2001	CN1322185A Aluminium oxide particles
11/13/2001	US6316650 Lubricants and release agents for metal and plastic processing; microfine powders
11/13/2001	US6316366 Method of polishing using multi-oxidizer slurry
11/13/2001	US6316365 Chemical-mechanical polishing method
11/13/2001	US6316100 Nickel powders, methods for producing powders and devices fabricated from same
11/13/2001	US6315803 Polishing composition and polishing process
11/08/2001	WO2001083638A1 Polishing slurries for copper and associated materials
11/08/2001	US20010039322 Of inorganic polymer obtained by polycondensation of metal alkoxides or acyl oxides, or polysilicates of given particle size; for chemical mechanical polishing; heat resistance, strength
11/08/2001	DE10063431C1 Aqueous, polymeric floor coating composition, contains polyurethane with a polyol component containing partly dehydrated castor oil and film-forming emulsion polymer with amino or acid and crosslinking groups
11/07/2001	EP1152046A1 Polishing composition and polishing method employing it
11/06/2001	US6313039 Chemical mechanical polishing composition and process
11/06/2001	US6312487 Polishing compound and an edge polishing method thereby
11/06/2001	US6312486 Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto
11/01/2001	WO2001081490A2 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
11/01/2001	US20010036804 CMP polishing pad including a solid catalyst
11/01/2001	US20010036799 Method of polishing silicon wafer
11/01/2001	US20010036796 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
11/01/2001	US20010036795 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
11/01/2001	US20010034979 Metal oxide and water mixture
11/01/2001	CA2406958A1 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces
10/2001
10/31/2001	EP1150341A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
10/31/2001	CN1074035C Chemical mechanical polishing slurry for metal layers
10/30/2001	US6309560 Chemical mechanical polishing slurry useful for copper substrates
10/30/2001	US6309434 Polishing composition and method for producing a memory hard disks
10/25/2001	WO2001080296A1 Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same
10/25/2001	WO2001079377A1 Composition for use in polishing magnetic disk substrate and method for preparing the same
10/25/2001	WO2001079331A1 Hydrophobizing microemulsions
10/25/2001	US20010034191 Polishing method and polisher used in the method
10/24/2001	EP1148538A1 Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate
10/18/2001	WO2001078128A2 Abrasive-free metal cmp in passivation domain
10/18/2001	WO2001078116A2 System for the preferential removal of silicon oxide
10/18/2001	WO2001077241A2 Composition for metal cmp with low dishing and overpolish insensitivity
10/18/2001	US20010031610 Polishing pad with a transparent portion
10/18/2001	US20010031558 Elimination of pad glazing for al cmp
10/18/2001	US20010029705 Water, silicon oxide, a metal coordination compound, and an oxidizing agent; precision
10/17/2001	EP1144527A2 Chemical mechanical polishing slurry and method for using same
10/16/2001	US6303506 Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process
10/16/2001	US6303049 Chemical mechanical abrasive composition for use in semiconductor processing
10/16/2001	US6302765 Process for mechanical chemical polishing of a layer in a copper-based material
10/11/2001	WO2001074959A2 Method for polishing a memory or rigid disk with an amino acid-containing composition
10/11/2001	WO2001074958A2 Polishing agent and method for producing planar layers
10/11/2001	US20010027798 Ozone as oxidizing agent
10/11/2001	DE10063870A1 Poliermittel und Verfahren zur Herstellung planarer Schichten Polishing compositions and methods for producing planar layers
10/10/2001	EP1141154A1 Polishing composition and method
10/10/2001	EP1140426A1 Chilled temperature polishing method for soft acrylic articles

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