| Patents for C09G 1 - Polishing compositions (7,846) |
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| 10/10/2001 | CN1316477A Polishing composition for producing memory hard disk and polishing method |
| 10/10/2001 | CN1072699C 抛光剂 Polishes |
| 10/09/2001 | US6300249 Polishing compound and a method for polishing |
| 10/09/2001 | US6299795 Polishing slurry |
| 10/09/2001 | US6299659 Polishing material composition for polishing lsi devices comprising water and cerium oxide which has been surface treated with coupling agent to improve affinity for pads |
| 10/04/2001 | WO2001032793A8 Use of cesium hydroxide in a dielectric cmp slurry |
| 10/04/2001 | EP1139406A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 10/04/2001 | EP1138734A2 Aqueous dispersion for chemical mechanical polishing of metal films |
| 10/04/2001 | EP1138733A2 Aqueous dispersion for chemical mechanical polishing of insulating films |
| 10/04/2001 | EP0985007A4 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
| 10/03/2001 | CN1315991A Composition for polishing substrate for magnetic disk and method for producing substrate for magnetic disk |
| 10/03/2001 | CN1315989A Chemical mechanical polishing slurry and method for using same |
| 10/02/2001 | CA2033639C Metal-free emulsion polymers for high performance aqueous coatings |
| 09/27/2001 | US20010024933 Composition and method for polishing in metal CMP |
| 09/26/2001 | EP1137056A1 Abrasive liquid for metal and method for polishing |
| 09/26/2001 | EP1136534A1 Hybrid polishing slurry |
| 09/26/2001 | CN1314444A Mixed polishing paste |
| 09/25/2001 | US6294472 Dual slurry particle sizes for reducing microscratching of wafers |
| 09/25/2001 | US6294106 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 09/25/2001 | US6294105 Chemical mechanical polishing slurry and method for polishing metal/oxide layers |
| 09/25/2001 | US6293848 Composition and method for planarizing surfaces |
| 09/19/2001 | EP1133792A1 Chemical mechanical polishing of feram capacitors |
| 09/18/2001 | US6290736 In chemical mechanical polishing (cmp) in planarization of noble metals, and the formation of noble metal damascene electrode structures |
| 09/18/2001 | US6290735 Abrasive particles for surface polishing |
| 09/18/2001 | US6290580 Polishing method for silicon wafers which uses a polishing compound which reduces stains |
| 09/13/2001 | WO2001030886A3 Zwitterionic siloxane polymers and ionically cross-linked polymers formed therefrom |
| 09/13/2001 | US20010020348 Particle with a functional group capable of trapping a metal ion, an oxidizing agent and water for chemical mechanical polishing of a copper-based metal |
| 09/12/2001 | CN1312845A Chemical mechanical polishing slurry useful for copper/tantalum substrate |
| 09/12/2001 | CN1312843A Chemical mechanical polishing slurry useful for copper/tantalum substrates |
| 09/12/2001 | CN1312824A Contiuous bulk polymerization and esterification process and compositions including the polymeric product |
| 09/12/2001 | CN1312345A Polishing composition for producing storage hard disc and polishing method thereof |
| 09/11/2001 | US6287633 Finishing agents and method of using the same |
| 09/07/2001 | WO2001064354A2 Method for repairing and lustering defects on hydrophilic coat surface |
| 09/07/2001 | CA2401657A1 Method for repairing and lustering defects on hydrophilic coat surface |
| 09/05/2001 | EP1130630A1 Abrasive composition for polishing lsi device |
| 09/05/2001 | EP1129035A1 Aluminum oxide particles |
| 09/05/2001 | CN1311279A Method for producing wax polish of slabstone |
| 09/04/2001 | US6284151 Ferric nitrate-alumina based slurry containing ferric nonahydrate, water and nitric acid; corrosion resistance |
| 09/04/2001 | US6284091 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control |
| 08/30/2001 | WO2001062440A1 Polishing pad with a transparent portion |
| 08/30/2001 | US20010018270 Comprising silica abrasive and polycarboxylic acid to polish substrate of tantulum-containing metal film formed on dielectric film; accuracy |
| 08/30/2001 | US20010017007 Polishing composition |
| 08/28/2001 | US6280924 Planarization method using fluid composition including chelating agents |
| 08/28/2001 | US6280652 Polishing edge surface of silicon wafers or oxide film-coated semiconductor wafers with formulation comprising water, silicon dioxide selected form colloidal silica, fumed silica, and precipitated silica |
| 08/28/2001 | US6280490 Polishing composition and method for producing a memory hard disk |
| 08/28/2001 | US6280489 Polishing compositions |
| 08/23/2001 | WO2001060940A1 Biocides for polishing slurries |
| 08/22/2001 | EP1125999A1 Polishing composition |
| 08/22/2001 | EP1124912A1 A chemical mechanical polishing slurry system having an activator solution |
| 08/21/2001 | US6277169 Method for making silver-containing particles |
| 08/16/2001 | US20010014539 Planarization method using fluid composition including chelating agents |
| 08/16/2001 | US20010013507 Method for CMP of low dielectric constant polymer layers |
| 08/16/2001 | US20010013506 Chemical mechanical polishing; microelectronics; semiconductors; eliminating short circuiting |
| 08/16/2001 | EP1123956A1 Aqueous dispersion for chemical mechanical polishing |
| 08/15/2001 | CN1308107A Leather dry cleaning finishing cream |
| 08/15/2001 | CN1069678C Vehicle washing and polishing agent |
| 08/14/2001 | US6274063 Metal polishing composition |
| 08/09/2001 | WO2001057919A1 Polishing composite for use in lsi manufacture and method of manufacturing lsi |
| 08/09/2001 | WO2001057150A1 Polishing composition |
| 08/09/2001 | US20010011515 Mixture of an urea and phenolic compound |
| 08/08/2001 | CN1307079A 抛光组合物 The polishing composition |
| 08/07/2001 | US6271139 Smoothness of emission display grid using fine silica colloids |
| 08/07/2001 | US6270395 Oxidizing polishing slurries for low dielectric constant materials |
| 08/07/2001 | US6270393 Abrading a semiconductor integrated circuit using a slurry comprising an aluminum grain, an inorganic salt, a water-soluble chelating agent, and an abrasive oil; no microscratches; thin film magnetic head |
| 08/07/2001 | CA2203726C Silanized silica |
| 08/02/2001 | WO2001055028A1 Oxide powder and method for preparing the same, and product using the same |
| 08/02/2001 | WO2001032793A3 Use of cesium hydroxide in a dielectric cmp slurry |
| 08/01/2001 | CN1306560A CMP slurry contg. solid catalyst |
| 07/31/2001 | US6267909 Useful for thinning, polishing and planarizing integrated circuitry deposited on semiconductor wafers which have metal conducting film deposits on surfaces |
| 07/26/2001 | WO2001052618A2 Stabilized silica and methods of making and using the same |
| 07/26/2001 | CA2396953A1 Stabilized silica and methods of making and using the same |
| 07/25/2001 | EP1118647A1 Polishing slurry |
| 07/25/2001 | EP1117744A1 Composition for abradable and/or scratchable surfaces |
| 07/25/2001 | CN1305411A Silicon oxide particles |
| 07/25/2001 | CN1304968A Nm-class polishing liquid and its preparing process |
| 07/24/2001 | CA2198813C Waxless composition for cleaning and polishing acrylic and glass surfaces |
| 07/19/2001 | US20010008828 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
| 07/18/2001 | EP1116762A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
| 07/18/2001 | EP1115804A1 Polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type |
| 07/18/2001 | EP1115803A1 Oxidizing polishing slurries for low dielectric constant materials |
| 07/17/2001 | US6261476 Hybrid polishing slurry |
| 07/12/2001 | WO2001049450A1 Chemical mechanical polishing process for manufacturing dopant-striation-free silicon wafers |
| 07/10/2001 | US6258882 Wax-resin surface polishes |
| 07/10/2001 | US6258721 Diamond slurry for chemical-mechanical planarization of semiconductor wafers |
| 07/10/2001 | US6258140 Polishing composition |
| 07/10/2001 | US6258137 CMP products |
| 07/10/2001 | US6258136 Fixed abrasives for optical polishing |
| 07/05/2001 | WO2001048807A1 Abrasives for chemical mechanical polishing |
| 07/05/2001 | WO2001048114A1 Composition for polishing magnetic disk substrate and polishing method, and magnetic disk substrate polished thereby |
| 07/05/2001 | WO2001048109A1 Hard surface treating agent, stain-proofing agent and method for surface treatment |
| 07/05/2001 | US20010006225 A slurry used for chemical mechanical polishing of a substrate having a copper-containing film at the surface, which contains and abrasive, an oxidizer, and adhesive-inhibitor preventing adhesion of polishing product to |
| 07/05/2001 | US20010006224 A slurry for chemical mechanical polishing of a substrate containing tantalum or tantalum nitride comprising a silica polishing grain and an inorganic salt to prevent dishing and erosion |
| 07/05/2001 | US20010006031 Chemical meachanical polishing slurry for polishing copper metal or alloy film formed on tantalum or tantalum nitride film comprising an oxidizer, an organic acid and an alkanolamine |
| 07/05/2001 | DE10002450A1 Polish for post-treatment of lacquered surfaces in the automobile industry comprises preferably 5-10 wt.% polish and a 1-1:3, preferably 1:2 mixture of thinner and spray dissolver |
| 07/05/2001 | CA2363819A1 Hard surface treating agent, stain-proofing agent and method for surface treatment |
| 07/04/2001 | CN1301992A Leveling method |
| 07/04/2001 | CN1068031C Preparation of stain-eliminating polishing powder |
| 06/28/2001 | US20010005009 A slurry for chemical mechanical polishing a copper-containing metal film, comprising theta -alumina mainly comprising secondary particles made of aggregated primary particles as polishing grains, an oxidizer and an organic acid |
| 06/28/2001 | DE19942962A1 Wachsmischung für wäßrige Anwendungen Wax composition for aqueous applications |
| 06/27/2001 | EP1111023A2 Neutral slurry of colloidal silica |