| Patents for C09G 1 - Polishing compositions (7,846) |
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| 03/28/2002 | US20020035950 Prepared by adding an aerosol which contains an aqueous solution of a metal and/or non-metal to the gas mixture during flame hydrolysis of vaporizable compounds of metals and/or non-metals; homogenous distribution of dopant |
| 03/28/2002 | US20020035807 Slurry for chemical mechanical polishing of a semiconductor device and preparation method thereof |
| 03/27/2002 | EP1190006A1 Slurry composition and method of chemical mechanical polishing using same |
| 03/27/2002 | EP1190005A1 Magnetic polishing fluids |
| 03/26/2002 | US6362108 Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant |
| 03/26/2002 | US6362106 Chemical mechanical polishing method useful for copper substrates |
| 03/26/2002 | US6362104 Chemical mechanical polishing of a metal e.g titanium, aluminum, by using an oxidizer, photoactive solid catalyst, comprising a mixture of titanium dioxide and titanium trioxide, water and a pad. |
| 03/26/2002 | US6361402 Method for planarizing photoresist |
| 03/26/2002 | US6360562 Methods for producing glass powders |
| 03/26/2002 | CA2044993C Protective furniture polish composition |
| 03/21/2002 | WO2002022725A1 Non-wax superior gloss polishing compound |
| 03/21/2002 | WO2001098201A3 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| 03/21/2002 | US20020034925 Process for fabricating a semiconductor device |
| 03/21/2002 | US20020034875 For manufacturing semiconductor device |
| 03/21/2002 | US20020033382 Chemical mechanical polishing method useful for copper substrates |
| 03/21/2002 | US20020032989 Prewashing; slurrying in water |
| 03/21/2002 | US20020032987 Chemical mechanical polishing slurry and method for using same |
| 03/20/2002 | EP1188714A1 Oxide powder and method for preparing the same, and product using the same |
| 03/20/2002 | CN1341142A Hard Surface treating agent, stain-proofing agent and method for surface treatment |
| 03/20/2002 | CN1340583A Polishing composition and polishing method for its use |
| 03/19/2002 | US6358853 Abrasives |
| 03/14/2002 | WO2002020682A2 Method of initiating copper cmp process |
| 03/14/2002 | WO2002020214A2 Method for polishing a memory or rigid disk with a polishing composition containing an oxidized halide and an acid |
| 03/14/2002 | US20020031985 Chemical mechanical polishing composition and process |
| 03/14/2002 | US20020029527 For cleanin and polishing fuel tanks of large trucks |
| 03/13/2002 | EP0975705B1 Buffer solutions for suspensions used in chemical-mechanical polishing |
| 03/12/2002 | US6355727 Continuous bulk polymerization and esterification process |
| 03/12/2002 | US6355565 Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers |
| 03/12/2002 | US6355075 Polishing composition |
| 03/12/2002 | US6354913 Abrasive and method for polishing semiconductor substrate |
| 03/07/2002 | US20020028636 Polishing composition |
| 03/07/2002 | US20020028632 Polishing composition and manufacturing and polishing methods |
| 03/07/2002 | US20020028580 Substrate polishing method |
| 03/06/2002 | EP1184435A1 Floor polishing compound |
| 03/06/2002 | EP1183315A1 Polish composition and method of use |
| 03/05/2002 | US6352582 Composition and process for treating hard surfaces |
| 02/28/2002 | WO2002016526A1 Method for making abrasive compositions and products thereof |
| 02/28/2002 | WO2001074958A3 Polishing agent and method for producing planar layers |
| 02/28/2002 | US20020025762 Biocides for polishing slurries |
| 02/28/2002 | US20020025605 Suppression recesses; controlled polishing |
| 02/28/2002 | US20020023389 Contains polishing colloidal particles whose primary particles have a diameter of from five to thirty nanometers, wherein the degree of association of the primary particles is five or less; use manufacturing a semiconductor device |
| 02/27/2002 | EP1182242A1 Polishing composition and polishing method employing it |
| 02/27/2002 | CN1337983A Working liquids and methods for modifying structured wafers for semiconductor fabrication |
| 02/26/2002 | US6350693 Method of CMP of polysilicon |
| 02/26/2002 | US6350393 Use of CsOH in a dielectric CMP slurry |
| 02/26/2002 | US6350176 High quality optically polished aluminum mirror and process for producing |
| 02/26/2002 | CA2237584C Surface treatment solution and method of application |
| 02/21/2002 | WO2002014014A2 Chemical mechanical planarization of metal substrates |
| 02/21/2002 | WO2001078116A3 System for the preferential removal of silicon oxide |
| 02/21/2002 | US20020022372 Method for reducing micro-particle adsorption effects |
| 02/21/2002 | US20020022370 Chemical mechanical polishing; low static etching rate at high temperatures; for manufacturing semiconductor devices with reduced dishing and overpolish insensitivity |
| 02/21/2002 | US20020022369 Comprises deionized water, metallic oxide, and cyclic amines for the chemical mechanical polishing of thin films used in integrated circuit manufacturing |
| 02/21/2002 | US20020020833 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives |
| 02/21/2002 | US20020020690 Dewatered CMP polishing compostions and methods for using same |
| 02/19/2002 | US6348547 Oxidized metallocene-polyolefin waxes |
| 02/19/2002 | US6348076 Oxidizing agent, copper corrosion inhibitor, abrasive particles, surface active agent, and polyelectrolyte for polishing or planarizing chip interconnect/wiring material such as al, w and especially cu. |
| 02/19/2002 | US6347978 Composition and method for polishing rigid disks |
| 02/14/2002 | WO2001064354A3 Method for repairing and lustering defects on hydrophilic coat surface |
| 02/14/2002 | US20020019202 Control of removal rates in CMP |
| 02/14/2002 | US20020019128 Slurry for chemical mechanical polishing of metal layer, method of preparing the slurry, and metallization method using the slurry |
| 02/14/2002 | US20020017630 Mixture of oxidizer and film forming agent |
| 02/14/2002 | US20020017064 LSI device polishing composition and method for reproducing LSI device |
| 02/14/2002 | US20020017063 Polycrystalline diamond powder and at least one additive of: oxidizing agents, complex-forming agents, surfactants and organic bases; planarizing precious metals for use as electrode and barrier material in intergrated circuits |
| 02/13/2002 | EP1179578A2 Polishing composition and method |
| 02/12/2002 | US6346741 Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same |
| 02/07/2002 | WO2002010257A1 Polyammonium-polysiloxane compounds, methods for the production and use thereof |
| 02/07/2002 | WO2002010256A1 Mono- or poly-quaternary polysiloxanes |
| 02/07/2002 | WO2001078128A3 Abrasive-free metal cmp in passivation domain |
| 02/07/2002 | WO2001077241A3 Composition for metal cmp with low dishing and overpolish insensitivity |
| 02/07/2002 | US20020016275 Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
| 02/07/2002 | US20020016073 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 02/06/2002 | EP1177068A1 Improved chemical mechanical polishing slurries for metal |
| 02/06/2002 | EP0944657B1 Amphiphilic graft polymers based on graft bases containing n-vinylcarboxylic acid units, process for their preparation and their use |
| 02/06/2002 | CN1334961A Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same |
| 02/06/2002 | CN1334849A Oxidizing polishing slurries for low dielectric constant materials |
| 01/31/2002 | US20020011031 Inorganic abrasive and organic particles with anionic group, wherein the removal rate for silicon oxide film is at least 5 times the removal rate for silicon nitride film; used for a shallow trench isolation in semiconductor manufacturing |
| 01/30/2002 | CN1333317A Slurry material for polishing |
| 01/24/2002 | WO2002006418A1 Polishing fluid composition |
| 01/24/2002 | US20020009955 Oxidizing polishing slurries for low dielectric constant materials |
| 01/23/2002 | EP1174483A1 Polishing composition, manufacturing thereof and polishing method |
| 01/23/2002 | EP1015521B1 Floor polish vehicle compositions employing sulfate- and sulfonate-containing copolymers |
| 01/22/2002 | US6340374 Water, fumed silica and spherical silica |
| 01/17/2002 | WO2002004573A2 Ready-to-use stable chemical-mechanical polishing slurries |
| 01/17/2002 | US20020005504 Ta barrier slurry containing an organic additive |
| 01/17/2002 | US20020005017 Aqueous dispersion for chemical mechanical polishing |
| 01/16/2002 | EP1171906A1 Method for cmp of low dielectric constant polymer layers |
| 01/16/2002 | CN1331733A Slurries of abrasive inorganic oxide particles and method for adjusting abrasiveness of particles |
| 01/15/2002 | US6338809 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 01/15/2002 | US6338744 Dispersion of silica particles in water, particle size of 50 to 300 nm and a refractive index of 1.41 to 1.44. synthesized in a liquid phase and produced without passing through a drying step; high scratch resistance |
| 01/15/2002 | US6338743 High ph of 9.5-13, used for si and metal surfaces of semiconductor wafers, silica in aqueous solution of a strong base selected from tetramethylammonium hydroxide, koh or naoh. |
| 01/10/2002 | WO2002002712A1 Polishing composition and magnetic recording disk substrate polished with the polishing composition |
| 01/10/2002 | WO2002002708A1 Polishes and their use |
| 01/10/2002 | WO2002002707A1 Silane containing polishing composition for cmp |
| 01/10/2002 | WO2002002706A1 Polishing composition for metal cmp |
| 01/10/2002 | US20020004360 Polishing slurry |
| 01/10/2002 | US20020004317 Ceria based slurry for chemical-mechanical polishing |
| 01/10/2002 | US20020003225 Slurry includes abrasive particles have a small particle size, narrow size distribution and a spherical morphology, and the particles are substantially unagglomerated, selected from silica, alumina, zirconia, ceria etc. and mixture |
| 01/10/2002 | US20020002798 CMP polishing slurry dewatering and reconstitution |
| 01/10/2002 | US20020002797 Abrasive composition for polishing magnetic recording disk substrates |
| 01/08/2002 | US6336945 Abrading a raw substrate, lapping, polishing; aliphatic organic and sulfate oxyalkylene alkyl ether sulfate; wear resistance |