| Patents for C09G 1 - Polishing compositions (7,846) |
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| 06/27/2001 | CN1301288A Chemical mechanical polishing slurry useful for copper substrates |
| 06/26/2001 | US6251150 Provide the desired level of planarization and selectivity for both metal and oxide surfaces without causing undesirable scratching of the surface. |
| 06/21/2001 | WO2001044402A1 Method of polishing or planarizing a substrate |
| 06/21/2001 | WO2001044396A1 Polishing compositions for noble metals |
| 06/21/2001 | WO2001044395A1 Polishing compositions for semiconductor substrates |
| 06/21/2001 | WO2001044394A1 Glass cleaning composition |
| 06/21/2001 | WO2001044209A1 Triazine compounds and use as water repellent |
| 06/21/2001 | US20010003885 A powder for polishing stone and in particular granite comprising 10 to40% by weight of stannic oxide particles having specific particle size, and 60 to 90% by weight of stainless steel powder having specific density and size |
| 06/19/2001 | US6248836 Amphiphilic graft polymers based on graft bases containing n—vinylcarboxylic acid units, process for their preparation and their use |
| 06/19/2001 | US6248395 Abrading substrate with slurry including diamond and cerium dioxide particles, said diamond mechanically abrading said substrate but not causing chemical-mechanical polishing, said cerium dioxide causing chemical-mechanical polishing |
| 06/19/2001 | US6248144 Process for producing polishing composition |
| 06/19/2001 | US6248143 Composition for polishing glass and polishing method |
| 06/14/2001 | WO2001041973A2 Chemical-mechanical polishing method |
| 06/14/2001 | WO2001041909A1 Compositions including ether-capped poly(oxyalkylated) alcohol wetting agents |
| 06/14/2001 | US20010003672 For low resistance silicon wafers, comprising water, an abrasive and as additive one or more of: an alkali metal hydroxide, carbonate, or hydrogen carbonate, a quaternary ammonium salt, a peroxide, and a peroxoacid compound |
| 06/14/2001 | CA2389013A1 Compositions including ether-capped poly(oxyalkylated) alcohol wetting agents |
| 06/13/2001 | EP1106666A1 Powder composition and method for polishing stone |
| 06/13/2001 | EP1106663A1 Slurry for chemical mechanical polishing silicon dioxide |
| 06/13/2001 | CN1298910A Oil for leather |
| 06/06/2001 | EP1104778A2 Method of production of composited particle for chemical mechanical polishing |
| 06/05/2001 | US6242351 Multistage process of semiconductor wafers and water slurry |
| 06/05/2001 | US6241586 CMP polishing slurry dewatering and reconstitution |
| 06/05/2001 | CA2036294C Soft contact lens processing aid |
| 05/31/2001 | WO2001039260A1 Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics |
| 05/31/2001 | US20010002357 Chemical-mechanical polishing slurry that reduces wafer defects |
| 05/30/2001 | EP1102821A1 Composition and method for polishing in metal cmp |
| 05/30/2001 | CN1297012A Formulation and preparing process of universal conditioning and brightening liquid of leather or leather clothing |
| 05/29/2001 | US6239097 Cleaning formulation |
| 05/29/2001 | US6239032 Polishing method |
| 05/29/2001 | US6238592 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| 05/29/2001 | US6238272 Polishing compound and a polishing method for silicon wafer |
| 05/25/2001 | WO2001036555A1 Composition and method for planarizing surfaces |
| 05/25/2001 | WO2001036554A1 Composition and method for planarizing surfaces |
| 05/23/2001 | CN1296049A Compositions for chemical-mechanical polishing |
| 05/22/2001 | US6235824 Alkylated fluorochemical oligomer comprising a fluorochemical oligomeric portion, an aliphatic moiety, and a linking group; base component of the polish composition may be a wax, a silicone oil, or a mixture |
| 05/22/2001 | US6235071 Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over position |
| 05/16/2001 | EP1098948A1 Chemical mechanical polishing slurry useful for copper/tantalum substrate |
| 05/16/2001 | EP0985059A4 Composition and method for polishing a composite comprising titanium |
| 05/10/2001 | WO2001033620A1 Polishing compound for semiconductor containing peptide |
| 05/10/2001 | WO2001032799A1 Particle dispersions |
| 05/10/2001 | WO2001032794A1 A ta barrier slurry containing an organic additive |
| 05/10/2001 | WO2001032793A2 Use of cesium hydroxide in a dielectric cmp slurry |
| 05/10/2001 | US20010001082 Two-step process comprising chemical mechanical polishing using first polishing slurry selective to polysilicon, second step comprises chemical-mechanical polishing using polishing slurry which polishes both polysilicon and silicon oxide |
| 05/10/2001 | US20010000912 Silicon oxide particles |
| 05/09/2001 | EP1097177A1 Continuous bulk polymerization and esterification process and compositions including the polymeric product |
| 05/09/2001 | EP0931118A4 Composition and method for polishing a composite comprising titanium |
| 05/09/2001 | CN1294168A chemical mechanical plane of metal wiring |
| 05/08/2001 | US6228913 Process of improving the leveling of a floor polish composition |
| 05/08/2001 | US6228771 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication |
| 05/03/2001 | WO2001030928A1 Chemical mechanical polishing compositions and systems |
| 05/03/2001 | WO2001030886A2 Zwitterionic siloxane polymers and ionically cross-linked polymers formed therefrom |
| 05/03/2001 | WO2001030873A1 Fluorochemical sulfonamide surfactants |
| 05/02/2001 | EP1096556A1 Chemical-mechanical planarisation of copper |
| 05/02/2001 | EP1095992A2 CMP slurry for planarizing metals |
| 05/02/2001 | EP0706582B1 Improved compositions and methods for polishing |
| 05/02/2001 | CN1065263C Film coating compositions and preparation method and usage thereof |
| 05/01/2001 | US6224464 Polishing method and polisher used in the method |
| 04/26/2001 | WO2001029145A1 Improved cmp products |
| 04/26/2001 | WO2001029140A1 Film forming composition containing octyl benzoate |
| 04/26/2001 | DE19950049A1 Production of spherical wax particles, used to stabilize e.g. varnishes, comprises heating and mixing waxes, emulsifiers, optional aids and water, subjecting to shearing and turbulence and cooling |
| 04/26/2001 | CA2383504A1 Improved cmp products |
| 04/24/2001 | US6221433 Siloxane automotive protectant compositions |
| 04/24/2001 | US6221119 Slurry composition for polishing a glass ceramic substrate |
| 04/24/2001 | US6221118 Cerium oxide abrasive and method of polishing substrates |
| 04/18/2001 | CN1291630A Polishing composition used for manufacturing storage hard disk and polishing method |
| 04/17/2001 | US6217416 Abrasive, oxidizer, acetic acid, and film forming agent; integrated circuits; semiconductors; wafers; thin films |
| 04/12/2001 | WO2001025366A1 Cmp products |
| 04/11/2001 | EP1090083A1 Chemical mechanical polishing slurry useful for copper/tantalum substrates |
| 04/11/2001 | EP1090082A1 Cmp slurry containing a solid catalyst |
| 04/05/2001 | WO2001023487A1 Polish composition and method of use |
| 04/05/2001 | WO2001023486A1 Compositions for and methods of reducing/eliminating scratches and defects in silicon dioxide cmp process |
| 04/05/2001 | WO2001023485A1 Polishing composition and method |
| 04/04/2001 | EP1088869A1 Aqueous dispersion for chemical mechanical polishing |
| 04/04/2001 | CN1290289A Optical polishing formulation |
| 04/04/2001 | CN1289811A Polishing compositions |
| 04/04/2001 | CN1289810A Polishing composition and method for manufacturing rigid memory disks |
| 04/04/2001 | CN1064065C Multifunctional leather clothing oiling cream and its preparation |
| 04/03/2001 | US6210604 For x-ray image intensifiers |
| 03/29/2001 | WO2001021724A1 Slurry solution for polishing copper or tungsten |
| 03/28/2001 | EP1086484A1 Slurry for chemical-mechanical polishing metal surfaces |
| 03/28/2001 | CN1288928A Composite ground in chemical machine for semiconductor processing |
| 03/28/2001 | CN1288920A 抛光组合物 The polishing composition |
| 03/28/2001 | CN1063771C Brightener liquid and making method thereof |
| 03/27/2001 | US6206956 Siloxane automotive protectant compositions |
| 03/27/2001 | CA2212901C Polish composition |
| 03/22/2001 | WO2001019935A1 Slurry for forming insoluble silicate during chemical-mechanical polishing |
| 03/21/2001 | EP1085067A1 Polishing composition and polishing process |
| 03/21/2001 | EP1085054A2 Blend of waxes for aqueous uses |
| 03/21/2001 | CN1288025A Wax mixture used for water-bearing application |
| 03/14/2001 | EP1082405A1 Silicon oxide particles |
| 03/14/2001 | CN1287178A Leather beautifying cream |
| 03/14/2001 | CN1063205C Nanometer silicon dioxide polishing agent and its producing process |
| 03/13/2001 | US6201058 Polymers with reverse changes, temperature sensitive |
| 03/08/2001 | WO2001017006A1 Polishing compound for chemimechanical polishing and polishing method |
| 03/07/2001 | EP1081200A1 Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices |
| 03/07/2001 | EP0840664B1 Compositions for polishing silicon wafers and methods |
| 03/06/2001 | US6197218 Phosphor spherical particles of yttrium-gadolinium borate, zinc silicate, barium magnesium aluminate and barium aluminate in a liquid vehicle to be applied to a substrate; flat panel displays, e.g. plasma type; fluorescent lighting elements |
| 03/01/2001 | WO2001014496A1 Compositions for insulator and metal cmp and methods relating thereto |
| 02/28/2001 | EP1078957A1 Surface modified titanium dioxide |
| 02/28/2001 | CN1285384A Process for preparation of metal oxide slurry adaptable to chemical-mechanical polishing of semiconductor |