| Patents for C09G 1 - Polishing compositions (7,846) |
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| 10/15/2002 | US6464741 CMP polishing slurry dewatering and reconstitution |
| 10/15/2002 | US6464740 Abrasive bimodal metal oxides; dimensional stability; chemical mechanical polishing |
| 10/10/2002 | WO2002065529A3 Chemical-mechanical planarization using ozone |
| 10/10/2002 | US20020147258 Smoothness; antisoilants; aqueous solution for floors |
| 10/10/2002 | US20020146907 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 10/10/2002 | US20020145127 Chemical mechanical polishing slurry useful for copper substrates |
| 10/09/2002 | EP1246879A1 A ta barrier slurry containing an organic additive |
| 10/09/2002 | EP1246856A1 Fluorochemical sulfonamide surfactants |
| 10/08/2002 | US6462009 Hydrophobizing microemulsions which improve the protection, drying rate and shine of surfaces |
| 10/08/2002 | US6461958 Polishing memory disk substrates with reclaim slurry |
| 10/08/2002 | US6461230 Chemical-mechanical polishing method |
| 10/08/2002 | US6461227 Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition |
| 10/03/2002 | WO2002076902A1 Composition for texturing process |
| 10/03/2002 | WO2001004226A3 Cmp composition containing silane modified abrasive particles |
| 10/03/2002 | US20020142600 Abrasive composition for the integrated circuits electronics industry |
| 10/03/2002 | US20020139055 Polishing composition and polishing method employing it |
| 10/02/2002 | CN1371867A Crytalline ceric oxide sol and making method thereof |
| 10/01/2002 | US6458290 Isolation and/or removal of ionic contaminants from planarization fluid compositions using macrocyclic polyethers |
| 10/01/2002 | US6458289 CMP slurry for polishing semiconductor wafers and related methods |
| 10/01/2002 | US6458017 Planarizing method |
| 10/01/2002 | US6458016 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
| 09/26/2002 | US20020134027 Pyrogenic preparation of alkali-doped silica particles for chemical mechanical polishing of semiconductor |
| 09/25/2002 | EP1243611A1 Composited particles and aqueous dispersions for chemical mechanical polishing |
| 09/25/2002 | EP1242557A1 Method of polishing or planarizing a substrate |
| 09/25/2002 | EP1242546A1 Film forming compositions containing octyl benzoate |
| 09/25/2002 | EP1140426B1 Chilled temperature polishing method for soft acrylic articles |
| 09/25/2002 | CN1371529A Polishing compound for chemimechanical polishing and polishing method |
| 09/25/2002 | CN1371528A Polishing compound for chemimachanical polishing and method for polishing substrate |
| 09/24/2002 | US6454957 Ruthenium and ruthenium dioxide removal method and material |
| 09/24/2002 | US6454821 Polishing composition and method |
| 09/24/2002 | US6454820 Comprising silica particles, water, and an iron and/or aluminum salt of a polyaminocarboxylic acid such as edta for improving surface smoothness of substrates such as magnetic disk substrates |
| 09/24/2002 | US6454819 Polymer particles having a siloxane bond-coupling section and a metal compound section on said polymer particles; metalloxane bond-containing section, alumina, ceria, or zirconia particle; strength, heat resistance |
| 09/19/2002 | WO2002072726A1 Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 09/19/2002 | WO2002061008A3 Alkali metal-containing polishing system and method |
| 09/19/2002 | WO2002055259A3 Tantalum removal during chemical mechanical processing |
| 09/19/2002 | US20020132563 Polishing of semiconductor substrates |
| 09/19/2002 | US20020132560 Polishing method for selective chemical mechanical polishing of semiconductor substrates |
| 09/19/2002 | US20020129560 Acidic polishing slurry for the chemical-mechanical polishing of SiO2 isolation layers |
| 09/19/2002 | US20020129559 Ratio of volume-cumulative (95%) average particle size (d95) to volume-cumulative (50%) average particle size (d50) (d95/d50) of 1.2-3 |
| 09/18/2002 | CN1370209A Polishing system with stopping compound and method of its use |
| 09/18/2002 | CN1370208A Chemical mechanical polishing systems and methods for their use |
| 09/18/2002 | CN1370207A Polishing system and method of its use |
| 09/18/2002 | CN1369534A Abrasive compsns. and abrasive process using such compsns. |
| 09/18/2002 | CN1369530A Polishing compsns. and polishing method using same |
| 09/17/2002 | US6451697 Method for abrasive-free metal CMP in passivation domain |
| 09/17/2002 | US6451214 Etching, shaping, or patterning layers or films with ceric ammonium nitrate in fabrication of semiconductor systems |
| 09/12/2002 | WO2002070618A2 Use of a silicone surfactant in polishing compositions |
| 09/12/2002 | US20020128327 Polishing composition and magnetic recording disk substrate polished with the polishing composition |
| 09/12/2002 | US20020127954 Process for the chemical-mechanical polishing of isolation layers produced using the STI technology, at elevated temperatures |
| 09/12/2002 | US20020125461 Ammonium oxalate-containing polishing system and method |
| 09/12/2002 | US20020125460 Compositions for chemical mechanical planarization of tungsten |
| 09/12/2002 | US20020124475 CMP polishing slurry dewatering and reconstitution |
| 09/12/2002 | US20020124474 Silica particles, an oxidizing agent, a corrosion inhibitor, and a cleaning agent |
| 09/11/2002 | EP1238417A1 Semiconductor processing silica soot abrasive slurry method for integrated circuit microelectronics |
| 09/11/2002 | CN1368998A Abrasive grain with improved projectability |
| 09/11/2002 | CN1368524A Double-component paint composition and preparation method |
| 09/10/2002 | US6447695 Aqueous dispersion composition for chemical mechanical polishing for use in manufacture of semiconductor devices |
| 09/10/2002 | US6447694 Composition for chemical mechanical polishing |
| 09/10/2002 | US6447693 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
| 09/10/2002 | US6447563 Chemical mechanical polishing slurry system having an activator solution |
| 09/10/2002 | US6447373 Chemical mechanical polishing slurries for metal |
| 09/10/2002 | US6447371 Chemical mechanical polishing slurry useful for copper/tantalum substrates |
| 09/06/2002 | WO2002068546A1 Coating composition |
| 09/05/2002 | US20020123224 Chemical mechanical polishing slurry |
| 09/05/2002 | US20020121156 Silicon-aluminum mixed oxide powder containing 0.1 to 99.9 wt. % Al2O3 and Si-O- Al-bonds; used for the chemical- mechanical polishing of semiconductor substrates. |
| 09/05/2002 | DE10107772A1 Vehicle care emulsion allowing good drying and/or hot wax application in car washes contains a cationic surfactant, solvent, silicone wax, emulsifiers, oils and water |
| 09/04/2002 | EP1235639A1 Compositions including ether-capped poly(oxyalkylated) alcohol wetting agents |
| 09/04/2002 | EP0852615A4 Chemical mechanical polishing composition and process |
| 09/04/2002 | CN1367809A CMP composition containing silane modified abrasive particles |
| 09/03/2002 | US6444732 Mixture containing organometallic pigment and 1,4,2-oxathiazine compound |
| 09/03/2002 | US6444139 Chemical mechanical polishing |
| 09/03/2002 | US6444132 Free abrasive slurry compositions |
| 09/03/2002 | US6443812 Chemical mechanical polishing (cmp) with pad made of such as polyvinylpyrrolidone having affinity for surface groups on a semiconductor wafer; nonscratching, smoothness, noncoating |
| 09/03/2002 | US6443811 High concentration of quaternary amine or amine salt cationic surfactant and minimum amount of abrasive particles in neutral to alkaline ph solution; chemisorbs to surface protecting from scratches and contamination |
| 08/29/2002 | WO2002067309A1 Polishing compound and method for polishing substrate |
| 08/29/2002 | WO2002044300A3 Cerium-based abrasive and production process thereof |
| 08/28/2002 | EP1235261A1 Polishing compound for semiconductor containing peptide |
| 08/28/2002 | EP1234801A2 Crystalline ceric oxide sol and process for producing the same |
| 08/28/2002 | EP1234800A1 Aqueous dispersion, process for its production and use thereof |
| 08/28/2002 | EP1234010A2 Use of cesium hydroxide in a dielectric cmp slurry |
| 08/28/2002 | EP1234009A1 Composition and method for planarizing surfaces |
| 08/28/2002 | CN1366548A Composition for use in polishing magnetic disk substrate and method for preparing same |
| 08/27/2002 | US6440857 Planarizing a wafer surface of aluminum and a ti/tin barrier layer; undesired surface nonplanarity after the cmp process, such as metal dishing and corrosion of dielectric layers with complicated pattern geometry, can be avoided |
| 08/27/2002 | US6440187 Preparation of a polishing composition comprising the alumina powder, water and a polishing accelerator. |
| 08/27/2002 | US6440186 Polishing composition and polishing method employing it |
| 08/27/2002 | US6439972 Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method |
| 08/22/2002 | WO2002065529A2 Chemical-mechanical planarization using ozone |
| 08/22/2002 | WO2002064717A1 Detergent composition with antifouling property for hard surface |
| 08/21/2002 | CN1089354C Wax-free furniture polish with silicone component |
| 08/20/2002 | US6436834 Abrasion accelerator enhances the removal rate of a dielectric layer by chelation in either an acidic or a basic medium; methyl glycinate, glycinamide, aminoguanidine, semicarbazide, guanidine, urea, formamidine, acetamidine, formamide, |
| 08/20/2002 | US6436811 Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry |
| 08/20/2002 | US6435947 CMP polishing pad including a solid catalyst |
| 08/20/2002 | US6435944 Chemical mechanical polishing (cmp); peroxycarboxylic acid or urea peroxyacid which dissociates into oxidizer and complexing agent; abrasive slurry; minimizing overetching; prevents dishing |
| 08/15/2002 | WO2002063669A2 Method and apparatus for two-step barrier layer polishing |
| 08/15/2002 | WO2001041973A9 Chemical-mechanical polishing method |
| 08/15/2002 | US20020111027 Polishing compositions for noble metals |
| 08/15/2002 | US20020111026 Polishing uisng ozone and abrasives |
| 08/15/2002 | US20020111024 Chemical mechanical polishing compositions |
| 08/14/2002 | EP1230312A1 Polish composition and method of use |
| 08/14/2002 | EP1090083B1 Chemical mechanical polishing slurry useful for copper/tantalum substrates |