Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
08/2003
08/06/2003CN1434491A Chemical mechanical polishing method for semiconductor substrate and water-dispersion solution for chemical mechanical polishing
08/05/2003US6602439 Controlled particle size
08/05/2003US6602436 Chemical mechanical planarization of metal substrates
08/05/2003US6602111 Abrasive
07/2003
07/31/2003WO2003062338A1 Cmp systems and methods utilizing amine-containing polymers
07/31/2003WO2003062337A1 Tungsten polishing solution
07/31/2003US20030143851 Abrasives for chemical mechanical polishing
07/31/2003US20030143848 Chemical mechanical polishing slurry and method for using same
07/30/2003CN1433049A Processing liquid compounding and supplying method and device
07/29/2003US6599837 Chemical mechanical polishing composition and method of polishing metal layers using same
07/24/2003WO2003060980A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
07/24/2003WO2003060962A2 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
07/24/2003WO2003060028A1 Methods for planarization of metal-containing surfaces using halogens and halide salts
07/24/2003WO2003060027A2 A process and composition for abrading pre-finished surfaces
07/24/2003US20030139550 Acrylated resin; optical coating on glass beads
07/24/2003US20030139549 Acrylated resin; optical coating on glass beads
07/24/2003US20030139116 CMP systems and methods utilizing amine-containing polymers
07/24/2003US20030139069 Planarization of silicon carbide hardmask material
07/24/2003US20030139050 Tungsten polishing solution
07/24/2003US20030139047 Metal polishing slurry having a static etch inhibitor and method of formulation
07/24/2003US20030136763 Processing solution preparation and supply method and apparatus
07/24/2003US20030136057 Using metal oxide particles
07/24/2003US20030136055 Abrasive composition containing organic particles for chemical mechanical planarization
07/24/2003US20030135986 Simultaneous planarization of pole piece and coil materials for write head applications
07/24/2003CA2472122A1 A process and composition for abrading pre-finished surfaces
07/23/2003EP1328596A1 Polish compositions
07/23/2003CN1115366C Quick polishing shoe cream formula and its prepn. tech
07/22/2003US6596638 Polishing method
07/22/2003US6595834 Method of making <200nm light transmitting optical fluoride crystals for transmitting less than 200nm light
07/17/2003US20030134575 Chemical mechanical polishing system for substrate comprising liquid carrier, polishing pad and/or abrasive, per-type oxidizer, and phosphono group-containing additive
07/17/2003US20030134512 High ph slurry for chemical mechanical polishing of copper
07/17/2003US20030131754 Silicone; optionally a drying retardant and/or an anti-static agent component; liquefied gas as a solvent as well as a propellant gas.
07/17/2003US20030131535 Of barrier/adhesion layers as occur in the manufacture of integrated circuits; using an aqueous oxidizer such as hydroxylamine nitrate and nitric acid or aluminum nitrate
07/16/2003EP1327258A1 Chemical-mechanical polishing slurry and method
07/16/2003EP1060221B1 Optical polishing formulation
07/16/2003CN1429873A Chemical mechanical polishing slurry for metal and method for preparing metal wire contact plug of semiconductor device by the slurry
07/16/2003CN1114668C Process for preparing multifunction integral cleaning-polishing agent for car and its using method
07/15/2003US6593239 Chemical mechanical polishing method useful for copper substrates
07/15/2003US6592776 Imidazole, benzotriazole, benzimidiazole or benzothiazole film-forming agent and such as uriedopropyltrimethoxysilane; reducing defects
07/10/2003WO2003055958A1 Abrasive composition containing organic particles for chemical mechanical planarization
07/10/2003US20030129838 Abrasives for chemical mechanical polishing
07/10/2003US20030129420 Polishing exterior surfaces; disposable products; non-woven, melt blown polypropylene
07/10/2003US20030127041 Lapping, mechanical polishing, and reducing internal stress of a gallium, aluminum and indium nitride wafer by thermal annealing or chemical etching; crystallographic plane surfaces
07/09/2003CN1428827A Polishing method for base copper-layer
07/09/2003CN1428388A Composition for chemical mechanical polishing of metal and metal/electric medium structure
07/09/2003CN1113946C Brightening wax
07/09/2003CN1113945C Method for preparing metallic oxides sludge for chemical mechanical polishing for semiconductor
07/08/2003US6589100 Rare earth salt/oxidizer-based CMP method
07/03/2003WO2003054944A1 Novel use of alkaline earth metal salts
07/03/2003WO2003054096A1 Cerium oxide coated silica particles and method for production thereof
07/03/2003US20030124959 Method for copper CMP using polymeric complexing agents
07/03/2003US20030124862 Method of polishing copper layer of substrate
07/03/2003US20030124861 Method for manufacturing metal line contact plug semiconductor device
07/03/2003US20030124855 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
07/03/2003US20030124852 Composition and method for planarizing surfaces
07/03/2003US20030124850 Polishing slurry for use in CMPof SiC series compound, polishing method, and method of manufacturing semiconductor device
07/03/2003US20030121891 Ruthenium and ruthenium dioxide removal method and material
07/03/2003US20030121214 Polishing composition for a substrate for a magnetic disk and polishing method employing it
07/03/2003DE10205280C1 Aqueous dispersion used for chemical-mechanical polishing of oxide surface, preferably silica, contains pyrogenic silica powder doped with alumina from aerosol with specified particle size
07/03/2003DE10204471C1 Aqueous dispersion of cerium oxide-coated doped silica powder, used for chemical-mechanical polishing of semiconductor substrate or coating or in shallow trench insulation, is obtained by mixing doped silica core with cerium salt solution
07/02/2003EP1323798A1 Composition for chemical mechanical polishing of metal and metal-dielectrics structures
07/02/2003EP1218466B1 Compositions for and methods of reducing/eliminating scratches and defects in silicon dioxide cmp process
07/02/2003CN1427055A 抛光组合物 The polishing composition
07/02/2003CN1427025A Grinding liquid composition
07/01/2003US6585787 Accurate polished surface; improved grindability
07/01/2003US6585786 Slurry for chemical mechanical polishing
07/01/2003US6585568 Chemical mechanical polishing slurry
06/2003
06/26/2003US20030119655 Granules based on pyrogenically produced aluminum oxide, process for the production thereof and use thereof
06/26/2003US20030119324 Method for manufacturing metal line contact plug of semiconductor device
06/26/2003US20030119321 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
06/26/2003US20030119316 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
06/26/2003US20030119304 Methods for planarization of metal-containing surfaces using halogens and halide salts
06/26/2003US20030118518 Suspension for the treatment of natural hard tissue and method of treatment
06/26/2003US20030116446 Mixture containing ammonium hydrogen phosphates
06/26/2003US20030116445 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
06/26/2003US20030115806 A mixture contains colloidal silica, one bicarbonate selected from ammonium bicarbonate, lithium bicarbonate, potassium bicarbonate, sodium bicarbonate and water; surface treatment of semiconductor
06/25/2003CN1425729A Propylenyl pimaric acid diglycidic ester and its epoxy resin and their preparation
06/24/2003US6582761 Condensation and coupling of organometallic and/or organosilicon compound
06/24/2003US6582623 CMP composition containing silane modified abrasive particles
06/19/2003WO2003050864A2 Method for copper cmp using polymeric complexing agents
06/19/2003WO2003050859A1 Planarization of silicon carbide hardmask material
06/19/2003WO2003050164A1 Aqueous suspensions containing polymerized fatty acid-based polyamides
06/19/2003US20030114083 Gel-free colloidal abrasive polishing compositions and associated methods
06/19/2003US20030111417 Providing preformed colloidal silica particles having a surface area, adding an alkali metal silicate and a cation exchange resin to produce a quantity of feed silica at feed rate which is less than nucleation rate
06/19/2003US20030110711 Polishing composition
06/19/2003US20030110710 Acidic abrasives; for magnetic disks, semiconductors
06/18/2003CN1424178A Three-dimensional vibrating enhanced polisher and testing devices without guide rail support
06/17/2003US6579929 Surface treated with a hydrophobating agent, such as a silane or an alcohol; esterification; nonagglomerated reinforcing filler
06/17/2003US6579923 Use of a silicone surfactant in polishing compositions
06/17/2003US6579153 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process
06/11/2003CN1422922A Polishing composition of magnetic disk substrate and polishing method using said composition
06/05/2003US20030104699 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
06/05/2003US20030102457 Mixture of acid salt, abrasive and oxidizer
06/05/2003DE20215292U1 Cleaner-conditioner for wood and plastics surfaces, especially floor, including parquet or laminate, contains additive developing permanent antimicrobial action in liquid polymer dispersion, preferably of acrylate or polyurethane
06/04/2003CN1422314A System for the preferential removal of silicon oxide
06/04/2003CN1422313A Method for polishing a memory or rigid disk with an amino acid-containing composition
06/04/2003CN1421502A Fibrous grinding-wheel grinding liquid and its use
06/03/2003US6572449 Dewatered CMP polishing compositions and methods for using same
05/2003
05/30/2003WO2003044113A1 A polishing article containing polytetrafluoroethylene
05/30/2003WO2003043780A2 Method for polishing a substrate surface
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