Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
05/2003
05/30/2003WO2002092211A3 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
05/29/2003US20030100186 CMP slurry and method of manufacturing semiconductor device
05/29/2003US20030098446 Composition for the chemical-mechanical polishing of metal and metal/dielectric structures with high selectivity
05/29/2003US20030098434 Method of fabricating a copper damascene structure
05/28/2003CN1420917A Polishing agent and method for producing planar layers
05/28/2003CN1419955A Process for dispersion of nanodiamond
05/27/2003US6569350 An abrasive, urea hydrogen peroxide, tartaric acid, and a film forming agent; use to remove copper alloy, titanium, and titanium nitride
05/27/2003US6569349 Polyethylene oxide surfactant, ethylenediamine, hydrogen peroxide,benzotriazole, isopropyl alcohol, phosphoric acid
05/27/2003US6569216 Abrasive fluid compositions
05/27/2003US6569215 Composition for polishing magnetic disk substrate
05/27/2003US6568997 Forming a passivating layer copper oxide for reducing the reaction of the copper metal with the polishing mixtures; reducing the problem of dishing of copper circuits of semiconductor devices
05/27/2003US6568996 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor
05/22/2003WO2003042322A1 Abrasive media and aqueous slurries
05/22/2003WO2003042321A1 Cerium-based polish and cerium-based polish slurry
05/22/2003WO2003042310A1 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
05/22/2003US20030094593 Silica and a silica-based slurry
05/21/2003EP1224239B1 Zwitterionic siloxane polymers and ionically cross-linked polymers formed therefrom
05/20/2003US6565767 Polymer particles and polishing material containing them
05/20/2003US6565619 Mixture of colloidal silica, acid and water
05/15/2003WO2003040252A2 Chemical mechanical polishing compositions
05/15/2003WO2002061824A3 Slurry and method for chemical mechanical polishing of copper
05/15/2003WO2002053490A3 Method of making optical fluoride laser crystal components
05/15/2003US20030092360 Method for chemical-mechanical polishing of layers made from metals from the platinum group
05/15/2003US20030092271 Shallow trench isolation polishing using mixed abrasive slurries
05/15/2003US20030092265 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
05/14/2003EP1309649A1 Polyammonium-polysiloxane compounds, methods for the production and use thereof
05/14/2003EP1309648A1 Mono- or poly-quaternary polysiloxanes
05/14/2003CN1417278A Polishing slurry for disk base sheet of memory hard disk
05/13/2003US6562719 Solution which contains an oxidizer, phosphoric acid, organic acid, a chemical to form inhibition layer, and water.
05/13/2003US6562114 Wax and method of wax application
05/13/2003US6562091 Slurry for chemical mechanical polishing of a semiconductor device and preparation method thereof
05/13/2003US6561883 Method of polishing
05/08/2003WO2003038883A1 Polishing fluid and polishing method
05/08/2003US20030087525 Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
05/08/2003US20030084815 Polishing composition and polishing method employing it
05/07/2003EP1307319A2 Chemical mechanical planarization of metal substrates
05/07/2003EP1090082B1 Cmp slurry containing a solid catalyst
05/06/2003US6559056 Aqueous dispersion for chemical mechanical polishing
05/06/2003US6558570 Polishing slurry and method for chemical-mechanical polishing
05/02/2003EP1306415A2 Composition for the chemical mechanical polishing of metal- and metal-dielectric structures with a high selectivity
05/02/2003EP1306076A2 Use of high-purity phenylsilsesquioxane liquids for the preparation of cosmetic and pharmaceutical compositions
05/01/2003WO2003036705A1 Polishing compound, method for production thereof and polishing method
05/01/2003WO2003035783A1 Furniture polish composition
05/01/2003WO2003035782A1 Boron-containing polishing system and method
05/01/2003WO2003035243A2 Viscosity modification of petroleum distillates
05/01/2003WO2002092660A3 Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups
05/01/2003US20030083209 Viscosity modification of petroleum distillates
05/01/2003US20030082998 Alkali metal-containing polishing system and method
05/01/2003US20030079416 Chemical mechanical polishing compositions for metal and associated materials and method of using same
05/01/2003CA2464120A1 Viscosity modification of petroleum distillates
04/2003
04/30/2003CN1415114A Polishing compound for semiconductor containing peptide
04/30/2003CN1414051A Glass polishing material without using grinding paste and its using method
04/30/2003CN1107097C Chemicomechanically grinding composition and method
04/29/2003US6555510 Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor
04/29/2003US6555022 Oxygen-containing, such as metal oxides, silicates, borates or titanates, small particle size, narrow particle size distribution; displays
04/29/2003US6554878 Including a colloidal abrasive; and potassium persulfate or sodium persulfate; optionally ammonium persulfate
04/24/2003US20030077995 Chemical mechanical polishing slurry
04/24/2003US20030077985 Boron-containing polishing system and method
04/24/2003US20030077240 Use of high-purity phenylsilsesquioxane liquids for the preparation of cosmetic and pharmaceutical compositions
04/24/2003US20030075077 Water wax emulsion cleaner and waxer
04/24/2003US20030075073 Furniture polish composition
04/22/2003US6551974 For imparting or maintaining a glossy or shiny finish on a hard surface
04/22/2003US6551935 Useful in chemical-mechanical polishing or chemical mechanical procedures
04/22/2003US6551367 Metal oxide and water mixture
04/22/2003US6551175 Polishing composition
04/17/2003WO2003031527A1 Phospono compound-containing polishing composition and method of using same
04/17/2003WO2003031333A2 Divalent metal oxide doped aluminium oxide, produced by flame hydrolysis and aqueous dispersions thereof
04/17/2003US20030073386 Chemical mechanical polishing compositions for metal and associated materials and method of using same
04/17/2003US20030073385 Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
04/17/2003DE20119694U1 Sealing product, useful for treating motor vehicle bodywork, contains a siloxane and/or silane, produces long-lasting, glossy protective layer
04/16/2003EP1302522A2 Gel-free colloidal abrasive and polishing compositions and methods of using them
04/16/2003EP0993492B1 Improved plasticized aqueous coating compositions
04/16/2003CN1410501A Chemical and mechanical grinding paste material composition
04/15/2003US6548596 Polymer compositions
04/15/2003US6547843 For polishing metal layer formed of copper and a thin film formed of tantalum or tantalum nitride for large scale integration device
04/15/2003US6547842 Polishing material, grinding particle body for abrasion-grinding, method for producing a polishing material, and method for polishing or grinding, and polishing apparatus
04/10/2003US20030068893 Fused alumina and metal oxide abrasive particles bonded together via vitrified bonding material, comprising silica, alumina, and boria
04/09/2003EP1299491A1 Polishes and their use
04/09/2003EP1299490A1 Silane containing polishing composition for cmp
04/09/2003EP1299489A1 Cmp polishing composition for metal
04/09/2003CN1409749A Method for polishing or planarizing substrate
04/08/2003US6544892 In preference to silicon nitride; includes abrasives and amino acids; semiconductors
04/08/2003US6544435 Composition and method of formation and use therefor in chemical-mechanical polishing
04/08/2003US6544307 Polishing composition and manufacturing and polishing methods
04/03/2003WO2003027202A1 Hydrophilizing wax composition
04/03/2003WO2003027201A1 Rare earth salt/oxidizer-based cmp method
04/03/2003US20030065047 Aqueous coating composition and floor polishing composition
04/03/2003US20030064596 Method of polishing a semiconductor wafer surface
04/03/2003US20030061766 Polishing agent and method for producing planar layers
04/02/2003EP1297028A1 Solvent-containing pastes containing in addition polyolefin wax
04/02/2003CN1408124A Chemical-mechanical polishing method
04/02/2003CN1407050A Grinding composition and its grinding method
04/02/2003CN1407045A 抛光组合物 The polishing composition
04/01/2003US6541384 Method of initiating cooper CMP process
04/01/2003US6540935 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
03/2003
03/27/2003WO2003025085A1 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
03/27/2003US20030060145 Multi-step polishing system and process of using same
03/27/2003US20030060135 Rare earth salt/oxidizer-based cmp method
03/25/2003US6537914 Integrated circuit device isolation methods using high selectivity chemical-mechanical polishing
03/25/2003US6537462 Ruthenium and ruthenium dioxide removal method and material
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