Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
12/2003
12/11/2003US20030228738 Abrasive particles to clean semiconductor wafers during chemical mechanical planarization
12/11/2003US20030228248 Aggregation of particles; mixing with diluent, roasting, water washing
12/11/2003US20030226998 Metal oxide coated carbon black for CMP
12/10/2003EP1369906A1 Polishing compound and method for polishing substrate
12/10/2003CN1130385C Oxidised metallocene-polyolefin eaxes
12/09/2003US6660680 Heating aerosols at low temperature; well-controlled microstructure and morphology
12/09/2003US6660639 Method of fabricating a copper damascene structure
12/09/2003US6660638 CMP process leaving no residual oxide layer or slurry particles
12/09/2003US6660185 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
12/04/2003WO2003031333A3 Divalent metal oxide doped aluminium oxide, produced by flame hydrolysis and aqueous dispersions thereof
12/04/2003US20030224702 Unexpanded perlite ore polishing composition and methods
12/03/2003EP1366143A1 Floor cleaner and gloss enhancer
12/03/2003CN1459481A Manufacturing method of wall surface polishing antifouling wax
12/03/2003CN1459480A Polishing liquid used in copper chemical mechanical polishing technology
12/03/2003CN1129960C Method for polishing surface of copper based material mechanically and chemically
12/03/2003CN1129657C Polishing composition and use thereof
12/03/2003CN1129656C Polishing composition
12/02/2003US6656241 Silica-based slurry
12/02/2003US6656022 Abrasive grains having remained after polishing are easily removed
12/02/2003US6656021 Process for fabricating a semiconductor device
11/2003
11/27/2003WO2003098680A1 Chemical mechanical planarization of low dielectric constant materials
11/27/2003US20030219982 CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
11/27/2003US20030217518 Abrasive, a method of polishing with the abrasive, and a method of washing a polished object
11/26/2003EP1364976A1 Ethylene polymer wax, process for its preparation and applications thereof
11/26/2003CN1458213A Liquid shoe polish for making leather possess flexibility and natural lustre
11/26/2003CN1458176A Vinyl ternary copolymer wax and its preparation and use
11/25/2003US6653267 Compound having a heterocycle (preferably quinaldic acid, benzotriazole or benzimidazole), surfactant and an oxidizing agent
11/25/2003US6653242 Solution to metal re-deposition during substrate planarization
11/25/2003US6652632 Comprises mineral oil, silicone, and bittering agent; for dispensing as a spray or mist by means of nonpressurized spray apparatus by the addition thereto of shear-thinning thixotropic thickeners
11/25/2003US6652611 Method for making abrasive compositions and products thereof
11/20/2003US20030216049 Method and composition for the removal of residual materials during substrate planarization
11/20/2003US20030216045 Hydrogen bubble reduction on the cathode using double-cell designs
11/20/2003US20030216042 CMP slurry for oxide film and method of forming semiconductor device using the same
11/20/2003US20030215639 Aqueous dispersion containing cerium oxide-coated silicon powder, process for the production thereof and use thereof
11/19/2003EP1362365A2 Chemical-mechanical planarization using ozone
11/19/2003CN1457506A Polishing compound and method for polishing substrate
11/19/2003CN1456624A Fail rare earth polishing powder reproducing method
11/18/2003US6648933 Powder composition and method for polishing stone
11/13/2003WO2003094216A1 Polishing fluid and polishing method
11/13/2003WO2003092945A1 Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device
11/13/2003WO2003060980A3 Methods for planarization of group viii metal-containing surfaces using oxidizing gases
11/13/2003US20030211815 Compositions and methods for dielectric CMP
11/13/2003US20030211747 Shallow trench isolation polishing using mixed abrasive slurries
11/13/2003US20030211745 Slurry and method for chemical mechanical polishing of copper
11/13/2003US20030209522 CMP composition containing silane-modified abrasive particles
11/12/2003EP1360255A2 Use of a silicone surfactant in polishing compositions
11/12/2003EP1007308B1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/11/2003US6646348 Silane containing polishing composition for CMP
11/11/2003US6645398 Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same
11/11/2003US6645265 Polishing formulations for SiO2-based substrates
11/11/2003US6645051 Water, ethylene oxide-propylene oxide copolymer, acid and abrasive; uniform smoothing of edges and flat surface of magnetic disks
11/06/2003WO2003091351A2 Polishing composition and methods
11/06/2003WO2002070618A8 Use of a silicone surfactant in polishing compositions
11/06/2003US20030207781 Polish compositions for gloss enhancement, and method
11/06/2003CA2484448A1 Polishing composition and methods
11/05/2003EP1358289A2 Alkali metal-containing polishing system and method
11/05/2003CN1453328A Aqueous dispersion body for chemical mechanical grinding
11/04/2003US6641632 Contains abrasive particles such as ceria, alumina etc and solid lubricant particles that enhance the topological selectivity of the polishing
11/04/2003US6641631 Controlling pH of an aqueous polishing composition having abrasive particles of a metal oxide that provides ions upon dissolution; equilibrium concentration of said ions at said pH, which avoids drift of said pH
11/04/2003US6641630 CMP compositions containing iodine and an iodine vapor-trapping agent
10/2003
10/30/2003WO2003043780B1 Method for polishing a substrate surface
10/30/2003WO2003035243A3 Viscosity modification of petroleum distillates
10/30/2003US20030203705 Chemical-mechanical polishing slurry with improved defectivity
10/30/2003US20030203635 Polishing composition for metal CMP
10/30/2003US20030203634 Polishing agent and polishing method
10/30/2003US20030203624 Manufacturing method of semiconductor device
10/30/2003US20030203337 Unexpanded perlite ore polishing composition and methods
10/30/2003US20030200702 Bimodal slurry system
10/29/2003EP1357161A2 Aqueous dispersion for chemical mechanical polishing
10/29/2003EP1356502A1 Ammonium oxalate-containing polishing system and method
10/29/2003CN1126152C Composition for chemical and mechanical grinding in manufacture of semiconductor
10/29/2003CN1125862C Chemicomechenically grinding Composition for semiconductor processing
10/29/2003CN1125861C Composition for chemical and mechanical grinding for processing semiconductor
10/28/2003US6638854 Semiconductor device and method for manufacturing the same
10/28/2003US6638328 Chemical mechanical polishing process including a dispersion comprising a plurality of first particles and a plurality of at least one type of second particles said first particles having a mean particle diameter larger by at least a factor
10/28/2003US6638327 Method for repairing and lustering defects on hydrophilic coat surface
10/28/2003US6638326 Compositions for chemical mechanical planarization of tantalum and tantalum nitride
10/23/2003WO2002094957A3 Chemical mechanical polishing compositions and methods relating thereto
10/23/2003US20030196386 For use in micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices
10/22/2003EP1354017A2 Ready-to-use stable chemical-mechanical polishing slurries
10/22/2003EP1354012A2 A cmp polishing pad including a solid catalyst
10/22/2003EP1210395B1 Compositions for insulator and metal cmp and methods relating thereto
10/21/2003US6635348 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
10/21/2003US6635186 Chemical mechanical polishing composition and process
10/16/2003WO2003060962A3 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
10/16/2003WO2003009349A3 Methods and compositions for chemical mechanical polishing substrates covered with at least two dielectric materials
10/16/2003US20030194952 Method for planarizing a dielectric layer of a flash memory device
10/16/2003US20030194879 Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods
10/16/2003US20030194868 Copper polish slurry for reduced interlayer dielectric erosion and method of using same
10/15/2003EP1352418A2 Polishing of semiconductor substrates
10/15/2003EP1352109A1 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
10/14/2003US6632377 Chemical-mechanical planarization of metallurgy
10/14/2003US6632259 Mixtures of copolymers, abrasives, oxidizers, corrosion inhibitors and complexing agents, used for selectively etching copper layers from semiconductor substrates
10/09/2003WO2003040252A3 Chemical mechanical polishing compositions
10/09/2003WO2002061824A9 Slurry and method for chemical mechanical polishing of copper
10/09/2003US20030189186 Chemical-mechanical polishing composition for metal layers
10/08/2003EP1350827A1 Abrasive, abrasive slurry, and method for manufacturing abrasive
10/08/2003EP1349700A2 Method of making optical fluoride laser crystal components
10/08/2003CN1447401A Mfg. method of semiconductor device
10/07/2003US6630433 Oxidizing reactant selected from ammonium persulfate, hydrogen peroxide, nitric acid, co-reactant selected from phosphoric acid, sulfuric acid, nitric acid, oxalic acid, acetic acid, organic acids, additives
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