Patents for C09G 1 - Polishing compositions (7,846)
02/2004
02/12/2004US20040029492 Composition, method and kit for polishing vehicles
02/12/2004US20040025904 Methods and compositions for removing group VIII metal-containing materials from surfaces
02/12/2004US20040025742 Aqueous solution of abrasive and acids; reducing viscosity
02/12/2004US20040025444 Mixture of oxidizer and abrasive; activation free radicals; for semiconductors, integrated circuits
02/10/2004US6689830 Film forming compositions containing benzoic acid esters of 8-carbon alcohols as additives
02/10/2004US6689692 Composition for oxide CMP
02/10/2004US6689186 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom
02/10/2004US6688969 Method for planarizing a dielectric layer of a flash memory device
02/05/2004WO2004012248A1 Polishing fluid and polishing method
02/05/2004WO2004011567A1 Aqueous resin dispersion for floors, and floor polish using same
02/05/2004US20040023496 CMP slurry compositions for oxide films and methods for forming metal line contact plugs using the same
02/05/2004US20040023492 Method for planarizing metal interconnects
02/05/2004US20040023491 Preparation and use of an abrasive slurry composition
02/05/2004US20040021125 To polish and remove a barrier metal film
02/05/2004US20040020426 Dispensing methods and apparatus for in-line addition of colorants and/or additives to finish products applied to vehicles
02/05/2004US20040020135 For chemical mechanical polishing conducted in a step of forming a buried type copper-based metal interconnection of a semiconductor device
02/05/2004US20040020134 Cmp slurry composition and a method for planarizing semiconductor device using the same
02/05/2004DE10248234B3 Colored leather and shoe polish, useful on solar reflective (artificial) leather, including black material, e.g. car seat cover, football boots or leather clothing, contains colored pigment that transmits or reflects near infrared light
02/05/2004CA2493400A1 Aqueous resin dispersion for floors, and floor polish using same
02/04/2004EP1386949A2 Aqueous dispersion for chemical mechanical polishing and its use for semiconductor device processing
02/04/2004EP1386708A2 Particulate products made by an aerosol method
02/04/2004EP1385915A1 Polishing composition having a surfactant
02/04/2004CN1473186A Cerium-based polishing material slurry and mehtod for manufacturing the same
02/04/2004CN1137232C New type abrasive composition used in integrated circuit electronic industry
02/04/2004CN1137231C Abrasive thick liquid and preparation method thereof
02/04/2004CN1137230C Chemimechanical overall planar polishing solution of copper and tantalum in super-large-seale integrated circuit multilayer copper wiring
02/03/2004US6686330 Low-foaming; good biodegradability; can be used in polymer, antifoaming, biocidal, coating, fertilizer, pharmaceutical, and drilling fluid compositions.
02/03/2004US6685765 Surface coating composition for application to automotive surfaces comprising at least one wax, ultraviolet protectant, composition comprising anionic and cationic surfactants, and water
02/03/2004US6685757 Polishing composition
01/2004
01/29/2004WO2004010487A1 Semiconductor abrasive, process for producing the same and method of polishing
01/29/2004WO2004009726A1 Cerium salt coated abrasive particles for glass polishing
01/29/2004US20040018728 Chemical mechanical polishing solution for platinum
01/28/2004EP1383815A1 Polymer-based floor-coating agent free of metal salts
01/28/2004EP1250390B1 Composition and method for planarizing surfaces
01/28/2004EP1234009B1 Composition and method for planarizing surfaces
01/28/2004CN1136286C Abrasive grain with improved projectability
01/27/2004US6682575 Methanol-containing silica-based CMP compositions
01/22/2004US20040014319 Prevention of precipitation defects on copper interconnects during cpm by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
01/22/2004US20040011991 Use of a gettering agent in a chemical mechanical polishing and rinsing operation and apparatus therefor
01/22/2004US20040010979 Polishes comprising nanostructure abrasives, oxidizers, water and acids selected from sulfurous, persulfuric, phosphoric, phosphonic, phosphinic, pyrophosphoric, tripolyphosphoric or sulfamic acid; reducing scratching of substrates
01/22/2004DE10232974A1 Glasurpolish Glaze Polish
01/21/2004CN1135149C Chilled temp. polishing method for soft acrylic articles
01/20/2004US6679937 Copper powders methods for producing powders and devices fabricated from same
01/20/2004US6679929 Abrasive, aliphatic carboxylic acid, a base, polishing acclerating compound such as citric acid, anticorrosive such as benzotriazole, hydrogen peroxide, and water; for semiconductors containing copper and a tantalum compound
01/20/2004US6679928 Polishing composition having a surfactant
01/20/2004US6679761 Polishing compound for semiconductor containing peptide
01/20/2004CA2218796C Propellant-free lustering and protecting agent for rubber, vinyl, and the like
01/15/2004US20040009671 Chemical mechanical polishing slurry useful for copper substrates
01/15/2004US20040009655 Method for manufacturing metal line contact plugs for semiconductor devices
01/15/2004US20040007690 Manipulating ingredients of polishing composition to control relative polishing rates of ferrule material and optical fiber material to obtain desired connector end face surface finish and geometry; chemical mechanical polishing
01/15/2004US20040007158 Solvent-containing pastes containing in addition polyolefin wax
01/15/2004US20040006924 For chemical mechanical polishing (CMP) of semiconductors
01/14/2004EP1380627A1 Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material
01/14/2004EP1380624A1 Two component protective lustering agent for coated surface
01/14/2004EP0897421B1 Improved surface-coating composition
01/14/2004CN1467280A Waterless carwash, maintenance liquid and method for producing the same
01/14/2004CN1467257A Stone polishing wax and method for producing the same
01/14/2004CN1134523C Polishing composition for producing storage hard disk and polishing method thereof
01/14/2004CN1134522C Polishing compositions
01/14/2004CN1134521C Polishing composition and method for manufacturing storage hard disk
01/13/2004US6677239 Methods and compositions for chemical mechanical polishing
01/13/2004US6676719 Pyrogenic preparation of alkali-doped silica particles for chemical mechanical polishing of semiconductor
01/13/2004US6676718 Polishing composition containing polyethylenimine that forms hydrogen bonding sites with hydrated dielectric layer of silica to form protective film
01/13/2004US6676492 Chemical mechanical polishing
01/07/2004CN1466618A Method for making abrasive composition and products thereof
01/07/2004CN1133705C Edge polishing composition
01/06/2004US6673762 At least a part of the polishing medium is made of fine powder of an rb ceramic and/or crb ceramic.
01/01/2004US20040002292 Polishing apparatus, polishing method and method of manufacturing semiconductor device
12/2003
12/31/2003WO2004000916A2 Stable dispersions of nanoparticles in aqueous media
12/31/2003CN1464886A Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups
12/31/2003CA2469335A1 Stable dispersions of nanoparticles in aqueous media
12/30/2003US6670318 Liquid cleanser
12/30/2003US6669763 Water based protectant containing a reaction product of two ionic surfactants
12/30/2003US6669748 Dispersion liquid of silica particles for polishing, method of producing the same, and polishing agent
12/30/2003US6669536 Method of making optical fluoride laser crystal components
12/25/2003US20030234184 Method and composition for polishing a substrate
12/24/2003WO2003107407A1 Method of polishing organic insulating film of semiconductor integrated circuit
12/24/2003WO2003015981A3 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same
12/24/2003CN1463287A Cerium oxide slurry, and method of mfg. substrate
12/23/2003CA2269029C Cryogenic polishing method for soft acrylic articles
12/18/2003WO2003104351A1 Metal oxide powder for high precision polishing and method of preparation thereof
12/18/2003WO2003104350A1 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
12/18/2003WO2003104344A1 Abrasive particles to clean semiconductor wafers during chemical mechanical planarization
12/18/2003WO2003104343A2 Method for chemical mechanical polishing (cmp) of low-k dielectric materials
12/18/2003WO2003103894A2 Compositions for chemical mechanical planarization of copper
12/18/2003WO2003006205A3 Barrier removal at low polish pressure
12/18/2003DE20313231U1 Aqueous, non-hydrophobicizing and surfactant-containing cleansing and polishing composition for vehicle bodywork also contains a water-insoluble organic solvent and an emulsifier
12/17/2003CN1461766A Composite for grinding
12/17/2003CN1131321C Leather beautifying cream
12/17/2003CN1131288C 抛光组合物 The polishing composition
12/17/2003CN1131125C Composition and slurry used for metal CMP
12/16/2003US6664354 Fluorochemical sulfonamide surfactants
12/16/2003US6664329 Floor finish composition
12/16/2003US6663851 Surface-modified titanium dioxide
12/16/2003US6663683 Aqueous dispersions, process for their production, and their use
12/16/2003US6663467 Process and composition for abrading pre-finished surfaces
12/11/2003WO2003103033A1 Polishing fluid and method of polishing
12/11/2003WO2003101665A1 High selectivity cmp slurry
12/11/2003US20030228763 CMP method utilizing amphiphilic nonionic surfactants
12/11/2003US20030228762 CMP compositions for low-k dielectric materials
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