Patents for C09G 1 - Polishing compositions (7,846) |
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02/12/2004 | US20040029492 Composition, method and kit for polishing vehicles |
02/12/2004 | US20040025904 Methods and compositions for removing group VIII metal-containing materials from surfaces |
02/12/2004 | US20040025742 Aqueous solution of abrasive and acids; reducing viscosity |
02/12/2004 | US20040025444 Mixture of oxidizer and abrasive; activation free radicals; for semiconductors, integrated circuits |
02/10/2004 | US6689830 Film forming compositions containing benzoic acid esters of 8-carbon alcohols as additives |
02/10/2004 | US6689692 Composition for oxide CMP |
02/10/2004 | US6689186 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
02/10/2004 | US6688969 Method for planarizing a dielectric layer of a flash memory device |
02/05/2004 | WO2004012248A1 Polishing fluid and polishing method |
02/05/2004 | WO2004011567A1 Aqueous resin dispersion for floors, and floor polish using same |
02/05/2004 | US20040023496 CMP slurry compositions for oxide films and methods for forming metal line contact plugs using the same |
02/05/2004 | US20040023492 Method for planarizing metal interconnects |
02/05/2004 | US20040023491 Preparation and use of an abrasive slurry composition |
02/05/2004 | US20040021125 To polish and remove a barrier metal film |
02/05/2004 | US20040020426 Dispensing methods and apparatus for in-line addition of colorants and/or additives to finish products applied to vehicles |
02/05/2004 | US20040020135 For chemical mechanical polishing conducted in a step of forming a buried type copper-based metal interconnection of a semiconductor device |
02/05/2004 | US20040020134 Cmp slurry composition and a method for planarizing semiconductor device using the same |
02/05/2004 | DE10248234B3 Colored leather and shoe polish, useful on solar reflective (artificial) leather, including black material, e.g. car seat cover, football boots or leather clothing, contains colored pigment that transmits or reflects near infrared light |
02/05/2004 | CA2493400A1 Aqueous resin dispersion for floors, and floor polish using same |
02/04/2004 | EP1386949A2 Aqueous dispersion for chemical mechanical polishing and its use for semiconductor device processing |
02/04/2004 | EP1386708A2 Particulate products made by an aerosol method |
02/04/2004 | EP1385915A1 Polishing composition having a surfactant |
02/04/2004 | CN1473186A Cerium-based polishing material slurry and mehtod for manufacturing the same |
02/04/2004 | CN1137232C New type abrasive composition used in integrated circuit electronic industry |
02/04/2004 | CN1137231C Abrasive thick liquid and preparation method thereof |
02/04/2004 | CN1137230C Chemimechanical overall planar polishing solution of copper and tantalum in super-large-seale integrated circuit multilayer copper wiring |
02/03/2004 | US6686330 Low-foaming; good biodegradability; can be used in polymer, antifoaming, biocidal, coating, fertilizer, pharmaceutical, and drilling fluid compositions. |
02/03/2004 | US6685765 Surface coating composition for application to automotive surfaces comprising at least one wax, ultraviolet protectant, composition comprising anionic and cationic surfactants, and water |
02/03/2004 | US6685757 Polishing composition |
01/29/2004 | WO2004010487A1 Semiconductor abrasive, process for producing the same and method of polishing |
01/29/2004 | WO2004009726A1 Cerium salt coated abrasive particles for glass polishing |
01/29/2004 | US20040018728 Chemical mechanical polishing solution for platinum |
01/28/2004 | EP1383815A1 Polymer-based floor-coating agent free of metal salts |
01/28/2004 | EP1250390B1 Composition and method for planarizing surfaces |
01/28/2004 | EP1234009B1 Composition and method for planarizing surfaces |
01/28/2004 | CN1136286C Abrasive grain with improved projectability |
01/27/2004 | US6682575 Methanol-containing silica-based CMP compositions |
01/22/2004 | US20040014319 Prevention of precipitation defects on copper interconnects during cpm by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
01/22/2004 | US20040011991 Use of a gettering agent in a chemical mechanical polishing and rinsing operation and apparatus therefor |
01/22/2004 | US20040010979 Polishes comprising nanostructure abrasives, oxidizers, water and acids selected from sulfurous, persulfuric, phosphoric, phosphonic, phosphinic, pyrophosphoric, tripolyphosphoric or sulfamic acid; reducing scratching of substrates |
01/22/2004 | DE10232974A1 Glasurpolish Glaze Polish |
01/21/2004 | CN1135149C Chilled temp. polishing method for soft acrylic articles |
01/20/2004 | US6679937 Copper powders methods for producing powders and devices fabricated from same |
01/20/2004 | US6679929 Abrasive, aliphatic carboxylic acid, a base, polishing acclerating compound such as citric acid, anticorrosive such as benzotriazole, hydrogen peroxide, and water; for semiconductors containing copper and a tantalum compound |
01/20/2004 | US6679928 Polishing composition having a surfactant |
01/20/2004 | US6679761 Polishing compound for semiconductor containing peptide |
01/20/2004 | CA2218796C Propellant-free lustering and protecting agent for rubber, vinyl, and the like |
01/15/2004 | US20040009671 Chemical mechanical polishing slurry useful for copper substrates |
01/15/2004 | US20040009655 Method for manufacturing metal line contact plugs for semiconductor devices |
01/15/2004 | US20040007690 Manipulating ingredients of polishing composition to control relative polishing rates of ferrule material and optical fiber material to obtain desired connector end face surface finish and geometry; chemical mechanical polishing |
01/15/2004 | US20040007158 Solvent-containing pastes containing in addition polyolefin wax |
01/15/2004 | US20040006924 For chemical mechanical polishing (CMP) of semiconductors |
01/14/2004 | EP1380627A1 Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
01/14/2004 | EP1380624A1 Two component protective lustering agent for coated surface |
01/14/2004 | EP0897421B1 Improved surface-coating composition |
01/14/2004 | CN1467280A Waterless carwash, maintenance liquid and method for producing the same |
01/14/2004 | CN1467257A Stone polishing wax and method for producing the same |
01/14/2004 | CN1134523C Polishing composition for producing storage hard disk and polishing method thereof |
01/14/2004 | CN1134522C Polishing compositions |
01/14/2004 | CN1134521C Polishing composition and method for manufacturing storage hard disk |
01/13/2004 | US6677239 Methods and compositions for chemical mechanical polishing |
01/13/2004 | US6676719 Pyrogenic preparation of alkali-doped silica particles for chemical mechanical polishing of semiconductor |
01/13/2004 | US6676718 Polishing composition containing polyethylenimine that forms hydrogen bonding sites with hydrated dielectric layer of silica to form protective film |
01/13/2004 | US6676492 Chemical mechanical polishing |
01/07/2004 | CN1466618A Method for making abrasive composition and products thereof |
01/07/2004 | CN1133705C Edge polishing composition |
01/06/2004 | US6673762 At least a part of the polishing medium is made of fine powder of an rb ceramic and/or crb ceramic. |
01/01/2004 | US20040002292 Polishing apparatus, polishing method and method of manufacturing semiconductor device |
12/31/2003 | WO2004000916A2 Stable dispersions of nanoparticles in aqueous media |
12/31/2003 | CN1464886A Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups |
12/31/2003 | CA2469335A1 Stable dispersions of nanoparticles in aqueous media |
12/30/2003 | US6670318 Liquid cleanser |
12/30/2003 | US6669763 Water based protectant containing a reaction product of two ionic surfactants |
12/30/2003 | US6669748 Dispersion liquid of silica particles for polishing, method of producing the same, and polishing agent |
12/30/2003 | US6669536 Method of making optical fluoride laser crystal components |
12/25/2003 | US20030234184 Method and composition for polishing a substrate |
12/24/2003 | WO2003107407A1 Method of polishing organic insulating film of semiconductor integrated circuit |
12/24/2003 | WO2003015981A3 Improved chemical mechanical polishing compositions for metal and associated materials and method of using same |
12/24/2003 | CN1463287A Cerium oxide slurry, and method of mfg. substrate |
12/23/2003 | CA2269029C Cryogenic polishing method for soft acrylic articles |
12/18/2003 | WO2003104351A1 Metal oxide powder for high precision polishing and method of preparation thereof |
12/18/2003 | WO2003104350A1 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method |
12/18/2003 | WO2003104344A1 Abrasive particles to clean semiconductor wafers during chemical mechanical planarization |
12/18/2003 | WO2003104343A2 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
12/18/2003 | WO2003103894A2 Compositions for chemical mechanical planarization of copper |
12/18/2003 | WO2003006205A3 Barrier removal at low polish pressure |
12/18/2003 | DE20313231U1 Aqueous, non-hydrophobicizing and surfactant-containing cleansing and polishing composition for vehicle bodywork also contains a water-insoluble organic solvent and an emulsifier |
12/17/2003 | CN1461766A Composite for grinding |
12/17/2003 | CN1131321C Leather beautifying cream |
12/17/2003 | CN1131288C 抛光组合物 The polishing composition |
12/17/2003 | CN1131125C Composition and slurry used for metal CMP |
12/16/2003 | US6664354 Fluorochemical sulfonamide surfactants |
12/16/2003 | US6664329 Floor finish composition |
12/16/2003 | US6663851 Surface-modified titanium dioxide |
12/16/2003 | US6663683 Aqueous dispersions, process for their production, and their use |
12/16/2003 | US6663467 Process and composition for abrading pre-finished surfaces |
12/11/2003 | WO2003103033A1 Polishing fluid and method of polishing |
12/11/2003 | WO2003101665A1 High selectivity cmp slurry |
12/11/2003 | US20030228763 CMP method utilizing amphiphilic nonionic surfactants |
12/11/2003 | US20030228762 CMP compositions for low-k dielectric materials |