Patents for C09G 1 - Polishing compositions (7,846)
02/2001
02/27/2001US6193908 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
02/27/2001US6193791 Polish composition and method of use
02/27/2001US6193790 Polishing composition
02/22/2001WO2001013417A1 Polishing compound for chemimechanical polishing and method for polishing substrate
02/22/2001WO2001012741A1 Polishing system with stopping compound and method of its use
02/22/2001WO2001012740A1 Polishing system and method of its use
02/22/2001WO2001012739A1 Chemical mechanical polishing systems and methods for their use
02/22/2001CA2378793A1 Polishing system with stopping compound and method of its use
02/22/2001CA2378790A1 Polishing system and method of its use
02/22/2001CA2378771A1 Chemical mechanical polishing systems and methods for their use
02/21/2001EP1077241A2 Composition for use in a chemical-mechanical planarization process
02/21/2001EP1077240A1 Aqueous dispersion for chemical mechanical polishing
02/21/2001CN1062289C Anti-wash type glazing agent
02/20/2001US6191039 Method of CMP of polysilicon
02/20/2001US6190572 Polishing composition for leather
02/20/2001US6190443 Polishing composition
02/20/2001US6190237 pH-buffered slurry and use thereof for polishing
02/20/2001US6189546 Polishing process for manufacturing dopant-striation-free polished silicon wafers
02/15/2001WO2001010974A1 Abrasive grain with improved projectability
02/13/2001US6186868 Chilled temperature polishing method for soft acrylic articles
02/07/2001CN1282775A Chemicomechanically grinding composition and method
02/06/2001US6183719 High surface area alumina solid
02/01/2001WO2001007529A1 Aqueous floor polishing composition
02/01/2001CA2389861A1 Aqueous floor polishing composition
01/2001
01/31/2001EP1072665A2 Colloidal silica polishing abrasive
01/31/2001EP1072662A1 Chemical-mechanical abrasive composition and method
01/30/2001US6180029 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
01/30/2001US6178585 Slurries for chemical mechanical polishing
01/25/2001WO2001006553A1 Polishing mixture and process for reducing the incorporation of copper into silicon wafers
01/24/2001EP1071121A1 Process for the formation of a collar oxide in a trench in a semiconductor substrate
01/24/2001CN1281023A Composition for chemical and mechanical grinding on semiconductor
01/23/2001US6177026 CMP slurry containing a solid catalyst
01/18/2001WO2001004231A1 Polishing liquid composition
01/18/2001WO2001004226A2 Cmp composition containing silane modified abrasive particles
01/18/2001DE19927286A1 Schleiflösung und Verfahren zum chemisch-mechanischen Polieren einer Edelmetall-Oberfläche Grinding solution and method for chemical mechanical polishing a noble metal surface
01/18/2001CA2378492A1 Cmp composition containing silane modified abrasive particles
01/17/2001EP1069168A1 Chemical mechanical abrasive composition for use in semiconductor processing
01/17/2001CN1280224A Dyeing spray coating agent for leather proucts and its producing method
01/17/2001CN1280154A Brightening wax
01/11/2001WO2001002134A1 Improved chemical mechanical polishing slurries for metal
01/11/2001WO2000060917A3 Bi-modal abrasive slurries for planarization
01/11/2001DE19929845A1 Surface-modified pyrogenic titanium dioxide, used in cosmetics e.g. sun-protection agents, is treated with ammonium-functional silane
01/09/2001US6171352 Comprising 70-95% by weight aqueous medium, 1-25% by weight abrasive, 0.1-20% by weight abrasion accelerator, wherein abrasion accelerator comprises monocarboxy group- or an amido group-containing compound
01/04/2001WO2001000745A1 Composition for polishing substrate for magnetic disk and method for producing substrate for magnetic disk
01/04/2001WO2001000744A1 Abrasive compound for glass hard disk platter
01/03/2001EP1065251A1 Polishing composition
01/03/2001EP1064338A1 Chemical mechanical polishing slurry useful for copper substrates
01/02/2001US6169064 A liquid concentrate reaction product of at least one acid and at least one amine; useful in many different applications roof coatings, laundry detergents, inks, paints, hard surface cleaners and spray wax compositions
01/02/2001US6169034 Chemically removable Cu CMP slurry abrasive
01/02/2001US6168640 Chemical-mechanical polishing slurry that reduces wafer defects
12/2000
12/29/2000CA2312606A1 Surface-modified titanium dioxide
12/28/2000WO2000079577A1 Abrasive compound for cmp, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive compound
12/26/2000US6165247 Methods for producing platinum powders
12/21/2000WO2000077107A1 Abrasive solution and method for chemically-mechanically polishing a precious metal surface
12/21/2000WO2000076918A1 Cerium phosphate and/or lanthanum sol, preparation method and use for polishing
12/20/2000EP1060221A1 Optical polishing formulation
12/12/2000US6159858 Slurry containing manganese oxide and a fabrication process of a semiconductor device using such a slurry
12/12/2000US6159551 Wax and method of wax application
12/12/2000US6159077 Colloidal silica polishing abrasive
12/12/2000US6159076 A slurry for polishing a surface comprising a liquid phase, an abrasive comprising silica and a ligand of an element contained in the surface which is bonded with ion or atom of the element to form chelate compound
12/07/2000WO2000073396A1 Slurry composition and method of chemical mechanical polishing using same
12/06/2000EP1056816A1 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
12/05/2000US6156108 Emulsion-containing surface polishes
11/2000
11/29/2000EP0868450B1 Room temperature coalescable aqueous fluoropolymer dispersions and method for their manufacture
11/28/2000US6153123 For flat panel display devices such as liquid crystal displays, plasma displays, thick film and thin film electroluminescent displays and field emission displays; narrow particle size distribution, spherical morphology
11/28/2000US6152976 Abrasive composition for disc substrate, and process for polishing disc substrate
11/28/2000CA2012127C One step polishing wiper
11/23/2000DE19923477A1 Surface cleaner-conditioner, useful for treating hard or soft, compact or porous surface or as antifoam, cosmetic conditioner or textile finish, contains aminoorganopolysiloxanes with aggregate state varying with temperature
11/22/2000CN1273993A Process for preparing multifunctional cleaning-polishing agent for car and its application method
11/21/2000US6149830 Composition and method for reducing dishing in patterned metal during CMP process
11/21/2000US6149696 Abrasive blasting with colloidal silica
11/16/2000WO2000068333A1 Polish composition and method of use
11/16/2000WO2000068332A1 Magnetic polishing fluids
11/16/2000DE19916155A1 Suspension zur Behandlung natürlichen Hartgewebes Suspension for the treatment of natural hard tissue
11/16/2000CA2372466A1 Polish composition and method of use
11/14/2000US6146251 Polishing method, method of manufacturing an optical device, and a liquid suspension used for polishing
11/09/2000DE19920967A1 Verfahren zur Hydrophobierung und Zubereitungen zur Durchführung des Verfahrens A method for imparting water repellency and compositions for carrying out the method
11/08/2000EP1050565A2 Method of hydrophobisation and preparations for carrying out said method
11/08/2000CN1272519A Composite for mechanochemical polishing polymer insulating material layer with low dielectric constant
11/07/2000US6143192 Contacting at least a region of a surface of the ruthenium metal structure or a layer of ruthenium oxide layer with a solution comprising ceric ammonium nitrate
11/01/2000CN1272221A Polishing composition including inhibitor of tungsten etching
11/01/2000CN1271754A Multi-purpose antistatic conditioning agent for removing dirt, brightening, polishing and renewing and its preparing process
11/01/2000CN1058042C Cleaning and lustre agent for floor tile
10/2000
10/31/2000US6140408 For high temperature thermoplastic coatings, polishes, room temperature formable paints and coatings, extrudable or injection moldable resins, and adhesives
10/31/2000US6139763 A mechanical chemical polishing agent consists of an abrasive, an oxidizer to oxidize tatalum, an oxalic acid reducing agent to reduce tantalum oxide to tantalum, and water
10/25/2000EP1046690A1 Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant
10/25/2000CN1057786C Process for producing multifunction super thin film brightener
10/24/2000US6136711 Polishing composition including an inhibitor of tungsten etching
10/24/2000US6136218 Used to reduce amount of metal ion contaminants left on wafer after chemical mechanical polishing completed
10/19/2000WO2000060917A2 Bi-modal abrasive slurries for planarization
10/18/2000EP1044671A2 Suspension for treatment of hard tissue and of prosthetic materials
10/18/2000EP1044163A1 Alumina powder, process for producing the same and polishing composition
10/18/2000CN1270194A Chemical polishing agent and its application method
10/17/2000US6132017 Reinforced article of furniture
10/11/2000CN1057317C Anticorrosive rust preventer
10/04/2000EP1041129A1 Polishing slurry and polishing method
10/04/2000CN1268967A Method for preparing metallic oxides sludge for chemical mechanical polishing for semiconductor
10/03/2000US6126853 Comprising a film forming agent, urea hydrogen peroxide, a complexing agent, an abrasive, and an optional surfactant for removing copper alloy, titanium, and titanium nitride containing layers from substrate
10/03/2000US6126518 Chemical mechanical polishing process for layers of semiconductor or isolating materials
10/03/2000US6126514 Polishing slurry and polishing method using the same
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