Patents for C09G 1 - Polishing compositions (7,846)
09/2000
09/26/2000US6124490 Reacting a diamino-containing polysiloxane with an unsaturated dicarboxylic acid or cyclic anhydride in the presence of a low molecular weight silicone oil or other solvent to form a gel
09/20/2000EP1036836A1 Aqueous dispersion for chemical mechanical polishing
09/20/2000CN1266875A Paste composition of free abrasive and abrading method using same
09/19/2000US6120571 A polishing agent for semiconductor, comprising cerium oxide particles having a weight average particle size of from 0.2 to 0.3 mu.m, a crystallite size from 300 to 500 ang, and specific area of 15 to 30 m2/gram
09/14/2000WO2000053691A1 Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
09/13/2000CN1266078A Leather polishing agent with function of mildew=proofing and colouring
09/12/2000US6117783 The chemical and mechanical polishing solution comprises a hydroxylamine compound and octyphenyl polyethylene
09/12/2000US6117775 Polishing method
09/12/2000US6117220 Polishing composition and rinsing composition
09/06/2000EP1032615A1 Process for preparing metal oxide slurry suitable for semiconductor chemical mechanical polishing
09/06/2000CN1265409A Formulation and production process of multipurpose shoe cream
09/06/2000CN1056167C Aerosol type dirty-cleaning and glazing protective agent containing high molecular component
09/05/2000US6114247 Polishing cloth for use in a CMP process and a surface treatment thereof
08/2000
08/30/2000CN1264636A Mechanical chemical polishing method for aluminium or aluminium alloy conducting layer
08/30/2000CN1055946C Anti-moulding polishing agent for bamboo and wood products
08/29/2000US6110832 Dispensing a high viscosity slurry onto a rotating polishing pad and pressing the wafer onto the slurry coated polishing pad
08/29/2000US6110241 Abrasive grain with improved projectability
08/24/2000WO2000049647A1 Method for cmp of low dielectric constant polymer layers
08/23/2000EP1029907A1 Process for mechanical chemical polishing of a layer of aluminium or aluminium alloy conducting material
08/23/2000CN1263923A 抛光组合物 The polishing composition
08/22/2000US6107530 Use of polyolefin waxes synthesized by means of metallocene catalysts for the preparation of solvent-containing pastes
08/16/2000EP1028150A2 Protective and gloss layer from water-soluble polymers for preserving against fouling
08/16/2000EP1027394A1 Abrasive particles for surface polishing
08/09/2000EP1025175A1 Composition and process for treating hard surfaces
08/08/2000US6100325 Comprising polytetrafluoroethylene or a copolymer of tetrafluoroethylene, a fluorinated liquid, a surfactant; as a coatings or an additive for detergent and polishing compositions
08/08/2000US6099604 Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto
08/02/2000CN1055102C Floor wax powder and its working method
07/2000
07/26/2000EP1021491A1 Polishing agent and use thereof to planish a semiconductor substrate
07/26/2000CN1261393A Improved plasticized aqueous coating compositions
07/19/2000EP1020506A2 Water-laden solid matter of vapor-phase processed inorganic oxide particles and slurry for polishing and manufacturing method of semiconductor devices
07/19/2000EP1020502A1 The use of polymers as furniture polishes
07/19/2000EP1020501A2 Aqueous chemical mechanical polishing dispersion composition, wafer surface polishing process and manufacturing process of a semiconductor device
07/19/2000EP1020500A1 Polishing slurry
07/19/2000EP1020488A2 Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device
07/19/2000EP1019456A1 Polishing agent, method for chemical and mechanical planishing and use of said polishing agent to planish a semiconductor substrate
07/19/2000CN1260372A Use of polymer as polisher for furniture
07/13/2000WO2000040370A1 Chilled temperature polishing method for soft acrylic articles
07/13/2000DE19850622C1 Liquid scouring agent for cleaning hard surfaces comprises fine abrasive material, surfactants, propylene carbonate, bentonite, perfume, preservative and water
07/06/2000WO2000039844A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
07/06/2000WO2000039843A1 Cmp abrasive, liquid additive for cmp abrasive and method for polishing substrate
07/05/2000EP1015521A1 Floor polish vehicle compositions employing sulfate- and sulfonate-containing copolymers
07/04/2000US6083840 Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys
07/04/2000US6083839 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
07/04/2000US6083419 Polishing composition including an inhibitor of tungsten etching
06/2000
06/29/2000WO2000037578A1 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
06/28/2000EP1013731A1 Low gloss polish formulations
06/28/2000EP0664324B2 Coating material composition
06/28/2000CN1257901A Process for preparing conditioning cleaner of leather shoes
06/28/2000CN1257893A Partial ester contg. polyol and montanin cerotic acid and wax preparation of montanin cerotic acid celcium soap
06/28/2000CN1053933C Improved compositions and method for polishing
06/23/2000CA2292312A1 Low gloss polish formulations
06/22/2000WO2000036037A1 Compositions and methods for polishing semiconductor wafers
06/21/2000EP1010728A2 Wax composition containing a partial ester of polyols and montanwax acid and calcium soaps of montan wax acid
06/21/2000DE19858852A1 Wachspräparat enthaltend Partialester von Polyolen und Montanwachssäure und Ca-Seifen der Montanwachssäure Wax preparation containing partial esters of polyols and montan wax acid and Ca soaps of montan wax acid
06/21/2000CN1256992A Compositions and method for reducing hollow of patterned matel in chemical-mechanical polishing
06/15/2000CA2292172A1 Weightless manufacturing on earth
06/14/2000EP1007308A4 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/14/2000EP1007308A1 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/08/2000WO2000032712A1 Abrasive fluid compositions
06/07/2000EP1006166A1 Polishing composition and polishing method employing it
06/02/2000WO2000031794A1 Chemical mechanical polishing of feram capacitors
06/02/2000WO2000031198A1 Polishing by using polymeric compositions
05/2000
05/31/2000EP1004636A2 Formulation and method for restoration and/or recovery of non-wooden surfaces
05/31/2000EP1004635A2 Formulation and method for the restoration and/or recovery of non wooden surfaces
05/31/2000CN1254742A Antiskid floor wax
05/31/2000CN1254741A Moisture-proof white polishing cream
05/30/2000US6069083 Polishing substrate surface having a stop film underlying material to be polished away using slurry of abrasive particles composed of same material as stop film
05/30/2000US6068787 Chemical mechanical polishing; mixture of catalyst and stabilizer
05/24/2000CN1253980A Leather protection agent
05/24/2000CN1253963A Grinding composite and potching composite
05/18/2000DE19852752A1 Lederpflegemittel Leather Care
05/17/2000EP1000995A1 Abrasive composition for the electronics industry
05/17/2000EP1000990A2 Leather preserving agent
05/17/2000CN1253160A New type abrasive composition used in integrated circuit electronic industry
05/17/2000CN1052502C Compositions and methods for polishing and planarizing surfaces
05/16/2000US6063438 Finishing agents and method of using the same
05/16/2000US6063306 Chemical mechanical polishing slurry useful for copper/tantalum substrate
05/16/2000US6062952 Planarization process with abrasive polishing slurry that is selective to a planarized surface
05/11/2000WO2000025939A1 Silicone gel waxes and silicone gel protectants
05/10/2000EP0999254A1 Polymer particles and polishing material containing them
05/09/2000US6060396 Polishing agent used for polishing semiconductor silicon wafers and polishing method using the same
05/09/2000US6060395 Planarization method using a slurry including a dispersant
05/09/2000CA2052572C Silicon emulsion preservative and protective coatings for rubber and po lymer
05/04/2000WO2000024842A1 A chemical mechanical polishing slurry system having an activator solution
05/02/2000CA2004525C Improved transition metal crosslinking of acid-containing polymers
04/2000
04/27/2000WO2000023534A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles
04/27/2000CA2347632A1 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles
04/26/2000CN1251380A Abrasive thick liquid and preparation method thereof
04/19/2000EP0993492A1 Improved plasticized aqueous coating compositions
04/18/2000US6051155 For treatment of wooden and leather surfaces, having a content of micronized transparent titanium dioxide particles with a crystallite size of 5 to 50 nm and wherein the titanium dioxide particles are doped with alumina or zirconia
04/04/2000US6046112 Aqueous slurry comprising zirconia abrasive particles and tetra(methyl or butyl)ammonium hydroxide surfactant for selective polishing of low dielectric constant siloxane based spin-on-glass layers during integrated circuit fabrication
04/04/2000US6046110 Copper-based metal polishing solution and method for manufacturing a semiconductor device
04/04/2000US6046099 Plug or via formation using novel slurries for chemical mechanical polishing
04/04/2000US6045605 Abrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive material
03/2000
03/30/2000WO2000017283A1 Oxidizing polishing slurries for low dielectric constant materials
03/30/2000WO2000017282A1 Process for preparing metal oxide slurry suitable for semiconductor chemical mechanical polishing
03/30/2000WO2000017281A1 Polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type
03/30/2000DE19842709A1 Polierflüssigkeit zum Polieren von Bauelementen, vorzugsweise Wafern, insbesondere zum Chemisch-Mechanischen Polieren derartiger Bauelemente Polishing liquid for polishing devices, preferably wafers, in particular for mechanical chemical polishing of such devices
03/29/2000CN1248994A Composition for oxide CMP
03/29/2000CN1248602A Cream for leather jacket
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