| Patents for C09G 1 - Polishing compositions (7,846) |
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| 04/15/2004 | WO2004031333A1 Cleaning agent and cleaning method for ridding titanium and titanium alloy building materials of discoloration |
| 04/15/2004 | WO2003020839A8 Polishing composition |
| 04/15/2004 | US20040072439 Chemical mechanical polishing composition and process |
| 04/15/2004 | DE202004001118U1 Lacquer polish and preservative composition, useful particularly for car lacquers, comprises at least two components, stored in separate compartments of the same container |
| 04/14/2004 | EP1406981A1 Floor polish composition |
| 04/14/2004 | EP1183315B1 Polish composition and method of use |
| 04/14/2004 | EP0963419B1 Composition for oxide cmp |
| 04/14/2004 | CN1488702A Abrasive liquid composition |
| 04/13/2004 | US6720265 Composition compatible with aluminum planarization and methods therefore |
| 04/13/2004 | US6720264 Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 04/13/2004 | US6720250 Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper |
| 04/13/2004 | US6719920 Mixture of acid salt, abrasive and oxidizer |
| 04/13/2004 | US6719819 Polishing composition |
| 04/08/2004 | WO2004030062A1 Polishing compound composition, method for producing same and polishing method |
| 04/08/2004 | WO2004030041A2 High selectivity and high planarity dielectric polishing |
| 04/08/2004 | US20040068035 Floor finish composition |
| 04/08/2004 | US20040067652 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
| 04/08/2004 | US20040067649 Silica and silica-based slurry |
| 04/08/2004 | US20040065864 Mixture of colloidal silica abrasive and halide compound; shallow channel isolation |
| 04/08/2004 | US20040065023 Abrasive compound for glass hard disk platter |
| 04/08/2004 | US20040065022 Slurry containing mixture of cerium compound and hydroxide; forming shallow channels in semiconductors |
| 04/08/2004 | US20040065021 For semiconductors, magnetic recording media |
| 04/08/2004 | US20040065020 Polishing semiconductors using aqueous solution of polymer; smoothness thin films |
| 04/07/2004 | EP1405886A1 Polishing composition |
| 04/07/2004 | EP1405885A2 Wafer edge polishing composition and polishing method using the same |
| 04/07/2004 | EP1404902A1 High surface quality gan wafer and method of fabricating same |
| 04/07/2004 | EP1299491B1 Polishes and their use |
| 04/07/2004 | CN1487991A Floor cleaner and gloss enhancer |
| 04/07/2004 | CN1487037A Prepn of diatomite abrasive polishing agent |
| 04/06/2004 | US6716755 Composition and method for planarizing surfaces |
| 04/06/2004 | CA2174817C Flooring material |
| 04/01/2004 | WO2003072669A9 Polishing composition |
| 04/01/2004 | US20040060502 Slurry for chemical mechanical polishing comprising bulk solution, plurality of particles and self-assembling adsorption additive of zwitterionic, anionic, nonionic, or cationic surfactant; semiconductors |
| 04/01/2004 | US20040060472 Selective polishing with slurries containing polyelectrolytes |
| 03/31/2004 | EP1403351A1 Polishing composition and polishing method using the same |
| 03/31/2004 | EP1234010B1 Use of cesium hydroxide in a dielectric cmp slurry |
| 03/31/2004 | CN1486505A Ammonium oxalate-containing polishing system and method |
| 03/30/2004 | CA2307224C Composition and process for treating hard surfaces |
| 03/25/2004 | WO2003103894A3 Compositions for chemical mechanical planarization of copper |
| 03/25/2004 | WO2003060027A3 A process and composition for abrading pre-finished surfaces |
| 03/25/2004 | US20040055993 Materials and methods for control of stability and rheological behavior of particulate suspensions |
| 03/24/2004 | EP1399517A2 Chemical mechanical polishing compositions and methods relating thereto |
| 03/24/2004 | CN1483780A Slurry for chemical mechanical polishing |
| 03/24/2004 | CN1142989C Slurries of abrasive inorganic oxide particles and method for adjusting abrasiveness of particles |
| 03/23/2004 | US6709316 Chemical mechanical polishing, copper |
| 03/18/2004 | WO2004023539A1 Polishing agent composition for insulating film for semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit |
| 03/18/2004 | US20040054072 Crosslinked polyurethane; hardness, wear resistance, protective coatings |
| 03/18/2004 | US20040054067 System for covering floors |
| 03/18/2004 | US20040054046 Mixing a liquid room temperature curable modified silicone resin, a fluorosilane compound and a reaction catalyst immediately before use |
| 03/18/2004 | US20040053499 Method and composition for polishing a substrate |
| 03/18/2004 | US20040051077 Shallow channel isolation; mixture of aqueous solutions and abrasive |
| 03/17/2004 | EP1397458A1 A silica and a silica-based slurry |
| 03/17/2004 | EP1397452A1 A silica-based slurry |
| 03/17/2004 | EP0706582B2 Improved compositions and methods for polishing |
| 03/17/2004 | CN1482195A Preparation method of rare-earth polishing powder |
| 03/16/2004 | US6706082 Crystalline ceric oxide sol and process for producing the same |
| 03/16/2004 | US6705926 A trialkylborate, a borinic acid, boronic acid, borinate ester, or boronate ester, benzodioxaborole compound; abrasive water slurry; chemical mechanical polishing |
| 03/11/2004 | WO2004020545A1 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 03/11/2004 | WO2004020543A1 Finishing method and finishing agent |
| 03/11/2004 | US20040048996 Containing ethylene oxide and optionally propylene oxide units; cosmetics; drying automobiles; textile fabric softeners |
| 03/11/2004 | US20040048957 E.g., 3-(2,2,2-Trifluoroethoxymethyl)-3- Methyloxetane; block polyether polymers and graft ethersiloxane copolymers; flow, or wetting, or leveling agents |
| 03/11/2004 | US20040046148 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
| 03/10/2004 | EP1396507A1 Reaction product of aqueous copolymer emulsion and polyvalent metal compound and polishing composition containing same |
| 03/10/2004 | CN1480499A Chemical polishing liquid |
| 03/10/2004 | CN1141353C Working liquids and methods for modifying structured wafers for semiconductor fabrication |
| 03/09/2004 | US6702954 Chemical-mechanical polishing slurry and method |
| 03/04/2004 | WO2003072669A3 Polishing composition |
| 03/04/2004 | WO2002102920A8 A silica and a silica-based slurry |
| 03/04/2004 | US20040043705 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 03/04/2004 | US20040043702 Chemical-mechanical polishing slurry for polishing metal films |
| 03/04/2004 | US20040043613 Cerium-based abrasive, production process thereof |
| 03/04/2004 | US20040040217 Polishing composition |
| 03/03/2004 | CN1140599C Chemical and mechanical leveling polishing liquid for multilayer copper wire in large scale integrated circuit |
| 03/02/2004 | US6699402 Chemical mechanical polishing (cmp) slurry of abrasive polishing particles, a bromide compound, a bromate compound for providing free bromine oxidizing agent and an organic acid for mediating bromate decomposition; capacitors |
| 03/02/2004 | US6699304 Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
| 03/02/2004 | US6699299 Composition and method for polishing in metal CMP |
| 02/26/2004 | WO2003104343A3 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 02/26/2004 | WO2001098379A8 Solvent-containing pastes containing in addition polyolefin wax |
| 02/26/2004 | US20040035317 Polysiloxanes with trialkylsilanol endcaps |
| 02/26/2004 | US20040035153 Method of producing a glass substrate for a mask blank, method of producing a mask blank, method of producing a transfer mask, method of producing a semiconductor device, glass substrate for a mask blank, mask blank, and transfer mask |
| 02/26/2004 | DE10252049A1 Slurry for chemical/mechanical polishing of wafer, contains metal oxide abrasive particles, removal rate accelerator, anionic polymeric passivation agent, anionic passivation agent having one to twelve carbon, and water |
| 02/25/2004 | EP1390134A2 Bis (perfluoroalkanesulfonyl) imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| 02/19/2004 | WO2004015021A1 Cmp abrasive and substrate polishing method |
| 02/19/2004 | WO2004015018A1 Reactive aqueous metal oxide sols as polishing slurries for low dielectric constant materials |
| 02/19/2004 | US20040033764 Chemical/mechanical polishing slurry and chemical mechanical polishing method using the same |
| 02/19/2004 | US20040033757 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 02/19/2004 | US20040033693 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same |
| 02/19/2004 | US20040033690 Method for polishing a substrate surface |
| 02/19/2004 | US20040033366 Bis(perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods therefor |
| 02/19/2004 | US20040031206 >/= 95% of total rare earth oxides (TREO) and has < 3% of fluorine; particle size distribution determined by a laser diffraction method is within a predetermined range |
| 02/18/2004 | EP1389224A2 Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups |
| 02/18/2004 | EP1190006B1 Slurry composition and method of chemical mechanical polishing using same |
| 02/18/2004 | CN1475604A Solution used for platinum chemical mechanical polishing |
| 02/18/2004 | CN1475542A Grinding liquid composition |
| 02/18/2004 | CN1475541A Grinding Liquid composition |
| 02/18/2004 | CN1475540A Chemical/mechanical polishing paste and chemical mechanical polishing method using said paste |
| 02/17/2004 | US6693035 Methods to control film removal rates for improved polishing in metal CMP |
| 02/17/2004 | US6692546 For use in polishing metal films in semiconductor interconnection procedures |
| 02/12/2004 | WO2004013242A2 Polishing slurry system and metal poslishing and removal process |
| 02/12/2004 | US20040029495 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |