| Patents for C09G 1 - Polishing compositions (7,846) |
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| 06/20/2002 | WO2002048279A1 Abrasive, abrasive slurry, and method for manufacturing abrasive |
| 06/20/2002 | US20020076932 Method of polishing or planarizing a substrate |
| 06/20/2002 | CA2365593A1 Polishing slurry for the chemical-mechanical polishing of silica films |
| 06/19/2002 | CN1354214A 金属擦亮剂 Metal polishes |
| 06/19/2002 | CN1354213A Furniture nursing agent and its preparation method |
| 06/18/2002 | US6407000 Microelectronics |
| 06/13/2002 | US20020069593 For use in semiconductor device fabrication |
| 06/12/2002 | EP1212789A1 Polishing mixture and process for reducing incorporation of copper into silicon wafers |
| 06/11/2002 | US6403546 Glycol solvent; plasticizer is tributoxyethyl phosphate; nonionic surfactant; an amine |
| 06/11/2002 | US6402978 Magnetic polishing fluids for polishing metal substrates |
| 06/06/2002 | WO2002044300A2 Cerium-based abrasive and production process thereof |
| 06/06/2002 | WO2002044293A2 Method and composition for the removal of residual materials during substrate planarization |
| 06/06/2002 | WO2002044292A1 A nanometer polishing composition and the method for preparing it |
| 06/06/2002 | US20020068454 Transition metal ions; chelating agents; surfactants; oxidizers; corrosion inhibitors; and water. |
| 06/06/2002 | US20020068452 Polishing agent and polishing method |
| 06/06/2002 | US20020066234 Acidic slurry of an oxidizer, deionized water, a corrosion inhibitor and a surfactant |
| 06/06/2002 | DE10060343A1 Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen Polishing slurry for chemical mechanical polishing of metal and dielectric structures |
| 06/05/2002 | EP1211719A1 Polishing slurry for the chemical mechanical polishing of metal and dielectric structures |
| 06/05/2002 | EP1211717A1 Polishing compound for chemimechanical polishing and method for polishing substrate |
| 06/05/2002 | EP1210395A1 Compositions for insulator and metal cmp and methods relating thereto |
| 06/05/2002 | CN1352673A Compositions for and methods for reducing/eliminating scratches and defects in silicon dioxide CMP process |
| 06/04/2002 | US6399081 Organic silicone resin powder |
| 06/04/2002 | US6398827 Stable aqueous spherical moniliform colloidal silica bonded with metal oxide; monoplanar; iron oxide or inorganic salt accelerator; alumina disks; silica surfaces; semiconductorwafers |
| 06/04/2002 | CA2364053A1 Polishing slurry for the chemical-mechanical polishing of metal and dielectric structures |
| 05/30/2002 | WO2002020682A3 Method of initiating copper cmp process |
| 05/30/2002 | WO2002020214A3 Method for polishing a memory or rigid disk with a polishing composition containing an oxidized halide and an acid |
| 05/30/2002 | US20020065355 For providing protection, antifouling property, gloss and the like on a floor surfaces |
| 05/30/2002 | US20020065025 Chemical mechanical polishing method for copper |
| 05/30/2002 | US20020064955 Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same |
| 05/30/2002 | US20020062600 Polishing composition |
| 05/29/2002 | EP1209731A1 Polishing composition and polishing method employing it |
| 05/29/2002 | EP0935512B1 Cryogenic polishing method for soft acrylic articles |
| 05/28/2002 | US6395194 Slurry of abrasive, bromide, bromate, organic acid, and bromine-chloride complex |
| 05/23/2002 | US20020061635 For use in polishing semiconductor device |
| 05/23/2002 | US20020059755 Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same |
| 05/21/2002 | US6391948 Triazine compounds and use thereof |
| 05/21/2002 | US6391189 Wax blend for aqueous applications |
| 05/16/2002 | US20020058601 Low-foaming; good biodegradability; can be used in polymer, antifoaming, biocidal, coating, fertilizer, pharmaceutical, and drilling fluid compositions. |
| 05/16/2002 | US20020058426 Controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range |
| 05/16/2002 | US20020056829 Ruthenium and ruthenium dioxide removal method and material |
| 05/16/2002 | US20020056701 Etching, shaping, or patterning layer or films with ceric ammonium nitrate in fabrication of semiconductor systems |
| 05/16/2002 | US20020056697 Ruthenium and ruthenium dioxide removal method and material |
| 05/15/2002 | EP1205965A1 Abrasive compound for cmp, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive compound |
| 05/15/2002 | EP1204712A1 Abrasive grain with improved projectability |
| 05/14/2002 | US6387166 Reverse aggregation; heat sensitive |
| 05/14/2002 | US6387139 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry |
| 05/14/2002 | US6386950 Process for mechanical chemical polishing of layer of aluminium or aluminium alloy conducting material |
| 05/09/2002 | US20020055324 Process for polishing silicon wafers |
| 05/09/2002 | US20020053656 Cerium as oxidizer, ammonium cerium nitrate, and abrasive for slurry which is environmentally green, and contains slight cyanide not requiring waste treatment |
| 05/08/2002 | EP1203801A2 Aqueous dispersion, process for its production and use |
| 05/08/2002 | EP1202930A1 Cerium phosphate and/or lanthanum sol, preparation method and use for polishing |
| 05/08/2002 | DE10054345A1 Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung An aqueous dispersion, a process for their preparation and use |
| 05/08/2002 | CN1084368C Chemical polishing agent and its application method |
| 05/08/2002 | CN1084367C Leather shoe beautifying cream |
| 05/07/2002 | US6383240 Containing amphipathic compound; polishing semiconductors |
| 05/07/2002 | US6383239 Composite material of various hardness |
| 05/07/2002 | US6383060 Method of polishing silicon wafer |
| 05/07/2002 | CA2241079C Wax-free furniture polish with silicone components |
| 05/02/2002 | WO2002014014A3 Chemical mechanical planarization of metal substrates |
| 05/02/2002 | WO2001099170A3 Ceria slurry and process for the chemical-mechanical polishing of silicon dioxide |
| 05/02/2002 | EP1201725A1 Abrasive compound for glass hard disk platter |
| 05/02/2002 | EP1200532A1 Cmp composition containing silane modified abrasive particles |
| 04/30/2002 | US6379406 Water polish mixture, abrasive particles of metal oxide for ions |
| 04/30/2002 | US6379225 Planarization process with abrasive polishing slurry that is selective to a planarized surface |
| 04/25/2002 | WO2002033736A1 Chemical-mechanical polishing slurry and method |
| 04/25/2002 | WO2002033023A1 Slurry for chemical-mechanical polishing copper damascene structures |
| 04/25/2002 | WO2002033015A1 Polish compositions |
| 04/25/2002 | WO2002033014A1 Method of polishing a memory or rigid disk with an ammonia and/or halide-containing composition |
| 04/25/2002 | DE10048477A1 Verfahren zum chemisch-mechanischen Polieren von Schichten aus Metallen der Platingruppe A method for chemical mechanical polishing of layers of metals of the platinum group |
| 04/24/2002 | EP1198534A1 Polishing liquid composition |
| 04/24/2002 | CN1083618C New Chemical mechanical polishing process for layers of isolating material based on silicon derivatives or silicon |
| 04/24/2002 | CN1083397C Silanized silicic acid, its preparation process and use |
| 04/23/2002 | US6375693 Chemical-mechanical planarization of barriers or liners for copper metallurgy |
| 04/23/2002 | US6375552 Slurries for chemical mechanical polishing |
| 04/23/2002 | US6375545 Chemical mechanical method of polishing wafer surfaces |
| 04/23/2002 | US6375541 Polishing fluid polishing method semiconductor device and semiconductor device fabrication method |
| 04/18/2002 | WO2002031072A1 Cmp slurry composition and a method for planarizing semiconductor device using the same |
| 04/18/2002 | US20020043027 Preventing formation of pits in copper wiring in chemical mechanical polishing of substrates for semiconductors, photomasks and memory hard disks |
| 04/18/2002 | US20020043026 Chemical mechanical polishing; composition includes oxidizing agent, an inhibitor of a polyalkyleneimine, and a pH buffer |
| 04/18/2002 | DE10046933A1 Process for the chemical-mechanical polishing of silicon wafers comprises rotating a silicon surface to be cleaned on a polishing plate covered with a polishing cloth with continuous |
| 04/17/2002 | CN1083154C Grinding method, and method for manufacturing semiconductor device and device for making semiconductor |
| 04/16/2002 | US6372648 Providing oxide particles in a basic slurry, particles including surface regions bonded to functional groups, slurry free of any binding polymer; using slurry of step to chemo-mechanically polish a substrate |
| 04/11/2002 | US20020042208 Aqueous mixture containing phase transfer agents |
| 04/11/2002 | US20020042199 Removal metal layer overcoating semiconductor; mixture containing oxidation inhibitor; reduce removal of metal in rcesses |
| 04/10/2002 | EP0703847B1 Magnetorheological polishing devices and methods |
| 04/10/2002 | CN1343752A Brightener compsn. |
| 04/10/2002 | CN1343751A Brightener compsn. |
| 04/10/2002 | CN1343750A Brightener compsn. |
| 04/04/2002 | WO2002026906A1 Method for chemical-mechanical polishing of layers made from metals from the platinum group |
| 04/04/2002 | US20020039875 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor |
| 04/04/2002 | US20020039839 Polishing compositions for noble metals |
| 04/03/2002 | EP1193745A1 Polishing composite for use in lsi manufacture and method of manufacturing lsi |
| 04/03/2002 | EP1025175B1 Composition and process for treating hard surfaces |
| 04/02/2002 | US6365522 Slurries of abrasive inorganic oxide particles and method for adjusting the abrasiveness of the particles |
| 04/02/2002 | US6364920 CMP formulations |
| 04/02/2002 | US6364919 Constant pressure in dispersion chambers prevents macro particles would lead to scratching |
| 04/02/2002 | US6364744 CMP system and slurry for polishing semiconductor wafers and related method |
| 03/28/2002 | WO2002024413A2 Polishing by cmp for optimized planarization |
| 03/28/2002 | WO2001081490A3 Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
| 03/28/2002 | US20020037642 Process for forming a metal interconnect |