| Patents for C09G 1 - Polishing compositions (7,846) |
|---|
| 08/12/2004 | WO2004067660A1 Selective barrier metal polishing solution |
| 08/12/2004 | WO2004067659A1 Self-shining aerosol-type shoe polish composition |
| 08/12/2004 | US20040157535 Mixed-abrasive polishing composition and method for using the same |
| 08/12/2004 | US20040157458 Methods for planarization of metal-containing surfaces using halogens and halides salts |
| 08/12/2004 | US20040157454 Chemical-mechanical polishing slurry and method |
| 08/12/2004 | US20040154931 Polishing liquid, polishing method and polishing apparatus |
| 08/12/2004 | US20040154231 Mixture of abrasive, deionizing water, pH controller and polyethylenimine; removal silica, silicon nitride; process control |
| 08/12/2004 | US20040154230 Polishing formulations for SiO2-based substrates |
| 08/12/2004 | US20040154229 Cerium oxide overcoated with silicon compound and aluminum compound |
| 08/11/2004 | EP1445796A1 POLISHING COMPOUND, METHOD FOR PRODUCTION THEREOF AND POLISHING METHOD |
| 08/11/2004 | EP1444308A1 CERIUM−BASED POLISH AND CERIUM−BASED POLISH SLURRY |
| 08/11/2004 | CN1519293A Grinding liquid compsns |
| 08/11/2004 | CN1519286A Slurry for mechanical polishing (CMP) of metals and use thereof |
| 08/11/2004 | CN1161826C Polishing compound for chemimechanical polishing and polishing method |
| 08/10/2004 | US6774041 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device |
| 08/10/2004 | US6773476 Silicon dioxide or aluminum oxide abrasive; polyether; citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine or histidine accelerant; benzotriazole, benzimidazole, triazole, imidazole or tolyltriazole stabilizer; h2o2 and water |
| 08/05/2004 | WO2004065505A1 Water based protectant containing a reaction product of two ionic surfactants |
| 08/05/2004 | US20040152325 Chemical mechanical polishing method, and washing/rinsing method associated therewith |
| 08/05/2004 | US20040152316 Method of manufacturing semiconductor device |
| 08/05/2004 | US20040152309 Method of polishing a silicon-containing dielectric |
| 08/05/2004 | US20040152308 heating a rare earth carboxylates with alkoxyalcoholst to form solutions, then adding a silicon alkoxide and activators, mixing with water to form gels and thermal decomposition under slightly reductive atmosphere, to form rare earth element-activated rare earth silicate phosphors |
| 08/05/2004 | US20040148867 Metal abrasive composition and polishing method |
| 08/04/2004 | EP1442104A1 Synthesis of poly-alpha olefin and use thereof |
| 08/04/2004 | CN1517389A Grinding liquid composition |
| 08/04/2004 | CN1160430C Composition and method for planarizing surfaces |
| 08/03/2004 | US6770218 Reducing scratches; using alumina fine particles with high alpha conversion ratio |
| 07/29/2004 | WO2004063301A1 Composition and method used for chemical mechanical planarization of metals |
| 07/29/2004 | US20040147206 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
| 07/29/2004 | US20040147123 Chemical mechanical polishing slurry for ruthenium titanium nitride and polishing process using the same |
| 07/29/2004 | US20040147118 Selective barrier metal polishing solution |
| 07/29/2004 | US20040144755 Aqueous dispersion for chemical mechanical polishing |
| 07/29/2004 | US20040144038 Composition and associated method for oxide chemical mechanical planarization |
| 07/28/2004 | EP1441016A1 Hydrophilizing wax composition |
| 07/28/2004 | EP1439903A2 Viscosity modification of petroleum distillates |
| 07/28/2004 | CN1516246A 抛光方法 Polishing method |
| 07/28/2004 | CN1515641A Surface treatment composition and its use |
| 07/28/2004 | CN1515640A Use of polishing composition and method for polishing storage hard disc |
| 07/27/2004 | US6767476 Polishing composition for metal CMP |
| 07/27/2004 | US6767393 Self-shining aerosol-type shoe polish composition |
| 07/27/2004 | US6767377 High activity material for chemical mechanical polishing; reproducibly adjustable particle size |
| 07/22/2004 | WO2004061925A1 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition |
| 07/22/2004 | WO2004061028A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 07/22/2004 | WO2004061027A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 07/22/2004 | WO2004044075A3 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
| 07/22/2004 | WO2004000916A3 Stable dispersions of nanoparticles in aqueous media |
| 07/22/2004 | US20040139820 a powder batch and method of making copper metal particles that are substantially spherical, have a weight average particle size of less than about 5 mu m and a narrow particle size distribution and high crystallinity |
| 07/22/2004 | DE10304894B4 Poliermittel und Polierverfahren mit diesem Poliermittel Abrasives and polishing process with this polish |
| 07/21/2004 | EP1438363A1 Furniture polish composition |
| 07/21/2004 | CN1514862A CMP polishing pad including solid catalyst |
| 07/21/2004 | CN1513934A Grinding liquid composition |
| 07/21/2004 | CN1513931A 抛光液组合物 A polishing solution composition |
| 07/21/2004 | CN1158694C Material for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same |
| 07/21/2004 | CN1158373C Chemical mechanical polishing slurry useful for copper/tantalum substrate |
| 07/15/2004 | WO2003104344A8 Abrasive particles to clean semiconductor wafers during chemical mechanical planarization |
| 07/15/2004 | WO2003091351A3 Polishing composition and methods |
| 07/15/2004 | WO2003073448A3 Control of semiconductor fabrication process using scanning electron microscopy and a focused ion beam device |
| 07/15/2004 | US20040137646 Method for forming capacitor of ferroelectric random access memory |
| 07/15/2004 | US20040134873 Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| 07/15/2004 | US20040134376 Polishing composition |
| 07/15/2004 | US20040134230 Dental glass powders |
| 07/14/2004 | CN1157450C Chemical mechanical polishing slurry useful for copper substrates |
| 07/08/2004 | US20040132385 Polishing composition |
| 07/08/2004 | US20040132306 Method using multi-component colloidal abrasives for CMP processing of semiconductor and optical materials |
| 07/08/2004 | US20040132305 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing |
| 07/08/2004 | US20040129176 High concentration silica slurry |
| 07/07/2004 | EP1309649B1 Polyammonium-polysiloxane compounds, methods for the production and use thereof |
| 07/07/2004 | CN1510091A Producing method for stone mirror effect polishing paste |
| 07/06/2004 | US6758872 Dispersion of abrasive grains comprisng compounds of cerium, copper, and/or ammonium |
| 07/06/2004 | CA2152469C Neutral self-shine emulsion for the care of floors (i) |
| 07/01/2004 | WO2004055864A2 Composition and method for copper chemical mechanical planarization |
| 07/01/2004 | WO2004030041A3 High selectivity and high planarity dielectric polishing |
| 07/01/2004 | US20040127147 Polishing composition |
| 07/01/2004 | US20040127146 Slurries comprising mixtures of silica sol, hydrogen peroxide, 1-hydroxyethylidene-1,1-diphosphonic acid and water, used for planarization of nickel phosphide plated substrates; high density magnetic recording media; disk drives |
| 07/01/2004 | US20040127047 Polishing composition and polishing method using the same |
| 07/01/2004 | US20040127046 Polishing composition and polishing method using the same |
| 07/01/2004 | US20040127045 Chemical mechanical planarization of wafers or films using fixed polishing pads and a nanoparticle composition |
| 07/01/2004 | US20040123528 Mixture of surfactant, abrasive and water |
| 07/01/2004 | US20040123527 Polishing composition |
| 06/30/2004 | EP1432773A1 Rare earth salt oxidizer based cmp method |
| 06/30/2004 | EP1432645A2 Divalent metal oxide doped aluminium oxide, produced by flame hydrolysis and aqueous dispersions thereof |
| 06/30/2004 | CN1509322A Chemical mechanical polishing compositions and method relating thereto |
| 06/30/2004 | CN1509204A Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof |
| 06/30/2004 | CN1155469C Particles collector comprising silicon oxide and polishing agent containing silicon oxide particle dispersion |
| 06/29/2004 | US6756308 Polishing uisng ozone and abrasives |
| 06/29/2004 | US6755721 Chemical mechanical polishing of nickel phosphorous alloys |
| 06/24/2004 | WO2004053968A1 Slurry composition for secondary polishing of silicon wafer |
| 06/24/2004 | WO2004053456A2 Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials |
| 06/24/2004 | WO2004053008A2 Passivative chemical mechanical polishing composition for copper film planarization |
| 06/24/2004 | DE202004003777U1 Polishing paste for use in gastronomy or the food or pharmaceutical industries comprises three of the following : aluminum oxide powder, silicon dioxide, glycerol; and paraffin |
| 06/24/2004 | DE10256783A1 Workpiece polishing mixture, useful e.g. in drag finishing machine for polishing machine parts for pharmaceutical industry, e.g. stamp for making tablets, contains glycerol as adhesive |
| 06/24/2004 | DE10256699A1 Wachsformulierungen und deren Verwendung zur Pflege und Konservierung von Oberflächen Wax formulations and the use thereof for the care and preservation of surfaces |
| 06/22/2004 | US6752844 Ceric-ion slurry for use in chemical-mechanical polishing |
| 06/17/2004 | US20040116313 Slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication |
| 06/17/2004 | US20040115944 Providing a wafer having a trench, a STI layer formed in the trench, the HfO2-containing gate dielectric covering the wafer and the STI layer, a gate electrode, performing a nitrogen ion bombardment to convert the exposed HfO2-containing gate dielectric to an Hf3N4 layer; utilizing phophoric acid |
| 06/17/2004 | US20040112867 Hard magentic disks; abrasion using diamond particles in aqueous solution |
| 06/17/2004 | US20040112759 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| 06/17/2004 | US20040112753 Using a perfluoro(sulfone or imidosulfone)compound |
| 06/17/2004 | US20040111977 The abrasive has excellent properties to maintain its dispersed state |
| 06/16/2004 | EP1428862A1 CERIUM−BASED ABRASIVE MATERIAL SLURRY AND METHOD FOR PRODUCING CERIUM−BASED ABRASIVE MATERIAL SLURRY |
| 06/16/2004 | EP1177068A4 Improved chemical mechanical polishing slurries for metal |