C09G 1 - Polishing compositions

Patents for C09G 1 - Polishing compositions (7,846)
12/2004
12/02/2004	US20040242804 Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups
12/02/2004	US20040242706 An aqueous phase, an oil phase, and an emulsifier system, has a volatiel organic compound (VOC) below 22 wt. %, based on the weight of the product
12/02/2004	US20040240062 Aluminum oxide produced by flame hydrolysis and doped with divalent metal oxides and aqueous dispersions hereof
12/02/2004	US20040237413 An abraisive aqueous dispersion and an immiscible, aqueous composition containing a heterocyclic compound, such as quinolinic or quinaldinic acid; prevention of dishing and corrosion of the wiring portion of semiconductors
12/01/2004	EP1481020A2 Stable dispersions of nanoparticles in aqueous media
12/01/2004	CN1551304A CMP sizing material, polishing method and method for manufacturing semiconductor device
12/01/2004	CN1550538A Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
12/01/2004	CN1550537A Abrasive slurry having high dispersion stability and manufacturing method for a substrate
12/01/2004	CN1550532A 抛光组合物 The polishing composition
12/01/2004	CN1550531A 抛光组合物 The polishing composition
11/2004
11/30/2004	US6825117 High PH slurry for chemical mechanical polishing of copper
11/30/2004	US6824579 Anionic polyelectrolyte is for selectively polishing silicon dioxide as compared to silicon nitride, or a cationic polyelectrolyte which is for selectively polishing metals as compared to silicon dioxide, silicon nitride and/or silicon
11/25/2004	WO2004101702A1 Ceria abrasive for cmp
11/25/2004	WO2004101695A1 Polishing composition and polishing method
11/25/2004	WO2004101222A2 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
11/25/2004	WO2004101221A2 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
11/25/2004	US20040235396 Chemical/mechanical polishing method for STI
11/25/2004	US20040235301 Method and device for polishing
11/25/2004	US20040231758 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom
11/24/2004	EP1479741A2 Chemical mechanical polishing method for STI
11/24/2004	EP1478708A1 Method and composition for polishing a substrate
11/24/2004	EP1478492A2 Polishing composition
11/24/2004	CN1549852A Synthesis of poly-alpha olefin and use thereof.
11/23/2004	US6822014 Aqueous coating composition and floor polishing composition
11/23/2004	US6821897 Method for copper CMP using polymeric complexing agents
11/23/2004	US6821309 Applying slurry to soft surface layer
11/23/2004	US6821187 Method for chemical-mechanical polishing of a layer which is a substrate and is a metal selected from a platinum group
11/18/2004	WO2004100243A1 Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using same
11/18/2004	WO2004100242A1 Polishing liquid for cmp process and polishing method
11/18/2004	WO2004098830A1 Dispersion for chemical-mechanical polishing
11/18/2004	US20040229552 Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
11/18/2004	US20040229551 Systems for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
11/18/2004	US20040229468 Polishing method
11/18/2004	US20040229461 Chemical mechanical polishing compositions for copper and associated materials and method of using same
11/18/2004	US20040226918 Polymeric particle slurry system and method for improved planarity
11/18/2004	US20040226917 Methods for machining ceramics
11/18/2004	US20040226915 Substrate processing method
11/17/2004	EP1478012A1 Polishing method and polishing fluid
11/17/2004	EP1478011A1 Method and device for polishing
11/17/2004	EP1477538A1 Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
11/17/2004	EP1476519A1 Process for chemical-mechanical polishing of metal substrates
11/17/2004	EP1476518A1 Cmp formulations for the use on nickel-phosphorus alloys
11/17/2004	CN1176163C Improved plasticized aqueous coating compositions
11/16/2004	US6818031 Polishing composition
11/16/2004	CA2263241C Cerium oxide abrasive and method of abrading substrates
11/11/2004	WO2004096941A1 Methods for machining ceramics
11/11/2004	WO2004083328A3 Slurry compositions for use in a chemical-mechanical planarization process having non-spherical abrasive particles
11/11/2004	US20040224426 Method of using an aqueous solution and composition thereof
11/11/2004	US20040223898 Hydroxylation of cerium, lanthanum and neodymium salts, then oxidizing in air to form metal oxides used in chemical mechanical polishing of substrates
11/11/2004	US20040222242 Dispenser assembly for a fragrance or personal care bottle and a method of assembling same
11/11/2004	US20040221516 Abrasive slurry of metal oxide colloid with stability using metal oxides such as cerium oxide on silica
11/11/2004	DE10317066A1 Verfahren zur Herstellung von Metalloxid- und Metalloidoxid-Dispersionen A process for preparing metal oxide and metalloid oxide dispersions
11/09/2004	US6814767 Polishing composition
11/09/2004	US6814766 Polishing composition and polishing method employing it
11/04/2004	WO2004094547A2 Coated metal oxide particles for cmp
11/04/2004	WO2004078410A3 Agent for increasing selection ratio of polishing rates
11/04/2004	US20040216389 Chemical mechanical polishing slurry
11/04/2004	US20040216388 Containing nonspherical morphology primary abrasive particles; high throughput manufacturing of high speed integrated circuits having submicron design features and high conductivity interconnect structures; computers, electronics
11/03/2004	EP1202930B1 Cerium phosphate and/or lanthanum sol, preparation method and use for polishing
11/03/2004	EP0706582B9 Improved compositions and methods for polishing
11/03/2004	CN1543493A Cerium-based abrasive material and method for preparation thereof
11/03/2004	CN1543492A Polishing slurry comprising silica-coated ceria
11/03/2004	CN1543491A Silica-based slurry
11/03/2004	CN1174063C Chemical mechanical polishing slurry useful for copper/tantalum substrates
11/02/2004	US6811583 Polishing composition for a substrate for a magnetic disk and polishing method employing it
11/02/2004	US6811471 Abrasive particles to clean semiconductor wafers during chemical mechanical planarization
11/02/2004	US6811470 Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
10/2004
10/28/2004	WO2004092298A2 Polishing compositions and method of use
10/28/2004	WO2004092290A1 Shoe and leather care product
10/28/2004	US20040214512 CMP composition and process
10/28/2004	US20040214444 Chemical mechanical polishing slurry and process for ruthenium films
10/28/2004	US20040214443 Silane containing polishing composition for CMP
10/28/2004	US20040211337 for polishing the surface of a thin film layer of a semiconductor or electroluminescent device; silica coating prevents tendency of ceria particles tends to easily agglomerate when compared to other abrasive particles
10/27/2004	EP1471124A1 Polishing composition
10/27/2004	CN1541287A High surface quality GaN wafer and method of fabricating same
10/26/2004	US6809145 Anatase titanium oxide and thermoplastic dispersed in organic solvent and water; workability; water spot prevention
10/21/2004	WO2004090937A2 Copper cmp slurry composition
10/21/2004	WO2004089816A1 Process for the production of metal oxide and metalloid oxide dispersions
10/21/2004	US20040209555 Coated metal oxide particles for CMP
10/20/2004	EP1469051A1 Shoe and leather care product
10/20/2004	EP1468057A1 Tungsten polishing solution
10/20/2004	CN1539162A Slurry composition for use in chemical mechanical polishing of metal wiring
10/20/2004	CN1539006A Lanolin substitute, production method thereof and application of same
10/20/2004	CN1539000A Silica and silica-based slurry
10/20/2004	CN1538936A Granules based on pyrogenically produced aluminium oxide, their production process and use
10/20/2004	CN1171963C Compositions for chemical-mechanical polishing
10/19/2004	US6805812 Phosphono compound-containing polishing composition and method of using same
10/14/2004	US20040203324 Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
10/14/2004	US20040203252 CMP slurry for nitride and CMP method using the same
10/14/2004	US20040203245 Ceric-ion slurry for use in chemical-mechanical polishing
10/14/2004	US20040203241 Chemical-mechanical planarization slurries and powders and methods for using same
10/14/2004	US20040203227 Ceric-ion slurry for use in chemical-mechanical polishing
10/14/2004	US20040200384 High softening temperature synthetic alkylsilicone wax
10/14/2004	DE10312970A1 Pyrogenes Siliciumdioxidpulver und Dispersion hiervon Fumed silica powder and dispersion thereof
10/13/2004	EP1466935A1 High softening temperature synthetic alkylsilicone wax
10/13/2004	EP1465957A1 Cmp systems and methods utilizing amine-containing polymers
10/13/2004	EP1198534B1 Polishing liquid composition
10/13/2004	CN1537324A Polising method and device
10/13/2004	CN1536046A Polishing composition
10/13/2004	CN1170909C Chemical mechanical plane of metal wiring

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