| Patents for C09G 1 - Polishing compositions (7,846) |
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| 10/13/2004 | CN1170903C Ta barrier slurry containing organic additive |
| 10/12/2004 | US6803353 Addition of sulfonated zwitterions to conventional slurries increases the copper removal rates and also offers buffering action to the slurry |
| 10/07/2004 | WO2004085311A1 Pyrogenic silicon dioxide powder and dispersion thereof |
| 10/07/2004 | US20040198880 methacrylic acid copolymer with methyl methacrylate and styrene in aqueous dispersion; does not use a metal crosslinking agent; comprising no amine compounds; superior water resistance, durability and coating property |
| 10/07/2004 | US20040198195 Apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 10/07/2004 | US20040198194 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 10/07/2004 | US20040198191 Cerium-based polish and cerium-based polish slurry |
| 10/07/2004 | US20040195548 Forming an aqueous solution containing soluble precursors of a sulfur-containing phosphor; generating an aerosol of droplets from above solution, heating droplets to form a particulate intermediate compound capable of being post-treated to form said sulfur-containing phosphor powder |
| 10/07/2004 | US20040194392 Polishing compound, method for production thereof, and polishing method |
| 10/06/2004 | EP1463784A2 A process and composition for abrading pre-finished surfaces |
| 10/06/2004 | CN1534736A Chemical mechanical polishing method and related washing/flushing method |
| 10/05/2004 | US6800218 Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same |
| 10/05/2004 | US6800105 Abrasive for metal |
| 09/30/2004 | WO2004083328A2 Slurry compositions for use in a chemical-mechanical planarization process having non-spherical abrasive particles |
| 09/30/2004 | US20040192172 Slurry of nonoxidized particles and oxidized particles and separation of particles for semiconductors |
| 09/30/2004 | US20040192049 Polishing composition and method for forming wiring structure using the same |
| 09/30/2004 | US20040187393 Polishing composition |
| 09/29/2004 | EP1463099A1 Solvent for treating polysilazane and method of treating polysilazane with the solvent |
| 09/29/2004 | CN1533595A Polishing method and grinding fluid |
| 09/29/2004 | CN1533420A Additive compositon, slurry composition including the same, and method of polishing an object using the slurry composition |
| 09/29/2004 | CN1532246A Multipurpose automobile cleaning and coating high brightness protective agent |
| 09/29/2004 | CN1532245A 抛光组合物 The polishing composition |
| 09/29/2004 | CN1168794C Composition for oxide CMP |
| 09/28/2004 | US6797626 Method of polishing copper layer of substrate |
| 09/22/2004 | EP1459370A2 Methods for planarization of group viii metal-containing surfaces using oxidizing gases |
| 09/22/2004 | EP1459368A1 Novel use of alkaline earth metal salts |
| 09/22/2004 | EP1458829A1 Methods for planarization of metal-containing surfaces using halogens and halide salts |
| 09/21/2004 | US6794289 Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies |
| 09/21/2004 | US6794285 Slurry for CMP, and method of manufacturing semiconductor device |
| 09/21/2004 | US6793559 Composition and method for polishing rigid disks |
| 09/16/2004 | WO2004078864A1 Hydrophilizing agent composition and process for formation of hydrophilic protective films |
| 09/16/2004 | WO2004078410A2 Agent for increasing selection ratio of polishing rates |
| 09/16/2004 | US20040180612 Boron-containing polishing system and method |
| 09/16/2004 | US20040177786 Scented paint and surface protectant |
| 09/16/2004 | CA2517363A1 Hydrophilizing agent composition and process for formation of hydrophilic protective films |
| 09/15/2004 | EP1456313A1 Cerium oxide coated silica particles and method for production thereof |
| 09/15/2004 | CN1529681A Composition for texturing process |
| 09/15/2004 | CN1167109C Mechanical chemical polishing method for aluminium or aluminium alloy conducting layer |
| 09/15/2004 | CN1166986C Leveling method |
| 09/14/2004 | US6790769 CMP slurry and method of manufacturing semiconductor device |
| 09/14/2004 | US6790678 Method for forming capacitor of ferroelectric random access memory |
| 09/10/2004 | WO2004076575A2 Modular barrier removal polishing slurry |
| 09/10/2004 | WO2004076574A2 Cmp composition comprising a sulfonic acid and a method for polishing noble metals |
| 09/09/2004 | US20040175948 Metal chelation in carbon dioxide |
| 09/09/2004 | US20040175942 Composition and method used for chemical mechanical planarization of metals |
| 09/09/2004 | US20040175941 Chemical mechanical planarization of low dielectric constant materials |
| 09/09/2004 | US20040173574 CMP composition containing organic nitro compounds |
| 09/09/2004 | US20040172886 CMP composition based on cupric oxidizing compounds |
| 09/08/2004 | EP1453885A1 Aqueous suspensions containing polymerized fatty acid-based polyamides |
| 09/08/2004 | CN1527870A Cerium based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material |
| 09/08/2004 | CN1527867A Two component protective lustering agent for coated surface |
| 09/08/2004 | CN1526786A Cerium oxide abrasive material and grinding method of base plate |
| 09/08/2004 | CN1526516A Making process of vibration polishing and grinding block |
| 09/08/2004 | CN1165589C Mixed polishing paste |
| 09/07/2004 | US6787061 Copper polish slurry for reduced interlayer dielectric erosion and method of using same |
| 09/07/2004 | US6786945 Polishing compound and method for polishing substrate |
| 09/07/2004 | US6786944 For use in micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices |
| 09/02/2004 | WO2004073922A2 Abrasives for copper cmp and methods for making |
| 09/02/2004 | WO2004053008A3 Passivative chemical mechanical polishing composition for copper film planarization |
| 09/02/2004 | US20040171265 Modular barrier removal polishing slurry |
| 09/02/2004 | US20040171264 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 09/02/2004 | US20040170658 capable of absorbing up to at least twice its weight of water, obtained by hemi-synthesis from a mixture of unsaturated fatty acids, esters, unsaturated hydrocarbons or unsaturated derivatives and compounds with hydroxyl functions, preferably without a catalyst and in an atmosphere devoid of oxygen. |
| 09/02/2004 | US20040169474 Fine particle sizes; narrow particle size distribution |
| 09/01/2004 | EP1451863A2 Method for copper cmp using polymeric complexing agents |
| 09/01/2004 | EP1124912A4 A chemical mechanical polishing slurry system having an activator solution |
| 09/01/2004 | CN1524918A Chemically machinery polishing serum |
| 09/01/2004 | CN1524917A Cerium oxide abrasive and method of polishing substrates |
| 08/31/2004 | US6783434 Cerium oxide slurry containing cerium oxide particles, a dispersant polymer containing ammonium acrylate as a copolymerized ingredient, a polyammonium-acrylate or a polyamine-acrylate, and water |
| 08/31/2004 | US6783432 Applying composition to polishing media, comprising: a pressure sensitive solution; one or more chemical agents comprising a complexing agent for complexing with a metal or oxidized metal, a corrosion inhibitor; and polishing |
| 08/26/2004 | WO2004072332A1 Polishing fluid, method of polishing, and polishing apparatus |
| 08/26/2004 | WO2004072203A1 Process for producing polishing composition |
| 08/26/2004 | WO2004072199A2 Mixed-abrasive polishing composition and method for using the same |
| 08/26/2004 | WO2004043613A9 Dispenser assembly for a fragrance or personal care bottle and a method of assembling same____________________________________ |
| 08/26/2004 | US20040166781 Composition for texturing process |
| 08/26/2004 | US20040163324 better polishing selectivity to polysilicon than to oxide films |
| 08/25/2004 | EP1448737A1 Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition |
| 08/25/2004 | EP1448736A1 Boron-containing polishing system and method |
| 08/24/2004 | US6780828 Containing modified aplha-olefin polymer additive; vehicle washing |
| 08/24/2004 | US6780350 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
| 08/24/2004 | US6780228 Solvent-free self-cleaning polish for various uses including on furniture and cars made by adding a wax to an oil either pre-heated, or then subsequently heated, with stirring and then adding water, acetic acid source, preferably vinegar |
| 08/24/2004 | US6780212 Surface finishing composition |
| 08/19/2004 | WO2004069947A1 Method of polishing a silicon-containing dielectric |
| 08/19/2004 | WO2004030041B1 High selectivity and high planarity dielectric polishing |
| 08/19/2004 | US20040162012 Polishing composition |
| 08/19/2004 | US20040162011 Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device |
| 08/19/2004 | US20040162006 Abrasives for copper CMP and methods for making |
| 08/19/2004 | US20040161938 Chemical-mechanical planarization using ozone |
| 08/19/2004 | US20040161937 Polishing composition and polishing method using same |
| 08/19/2004 | US20040161932 Slurry for cmp, and method of manufacturing semiconductor device |
| 08/19/2004 | US20040159557 Contains abrasive particles and electrolyte; oxidation of metal film surface; preventing defects; wear resistance |
| 08/19/2004 | DE202004008513U1 Polishing cloth for lacquered surfaces (e.g. of automobiles) has a wax dispersion polish applied in diluted form to an absorbing substrate |
| 08/18/2004 | EP1446263A2 Method for polishing a substrate surface |
| 08/18/2004 | CN1521227A Photoprotectant for wood olein floor and furniture and its preparing process |
| 08/18/2004 | CN1521226A Slurry for cmp, and method of manufacturing semiconductor device |
| 08/18/2004 | CN1162491C 金属擦亮剂 Metal polishes |
| 08/18/2004 | CN1162490C Composition and method for flatting surfaces |
| 08/17/2004 | US6776810 Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
| 08/17/2004 | US6776696 Continuous chemical mechanical polishing process for polishing multiple conductive and non-conductive layers on semiconductor wafers |
| 08/17/2004 | US6776311 Dispenser assembly for a fragrance or personal care bottle and a method of assembling same |
| 08/12/2004 | WO2004068570A1 Cmp polishing compound and polishing method |