| Patents for C09G 1 - Polishing compositions (7,846) |
|---|
| 05/25/2005 | EP1532222A1 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
| 05/25/2005 | DE202005004076U1 Polishing composition, especially for motor vehicle paintwork, contains UV-crosslinkable wax, polyethylene wax, paraffin, polysiloxane, silicone wax, hydrocarbon, terpene, abrasive and polytetrafluoroethylene |
| 05/25/2005 | CN1620488A Cmp systems and methods utilizing amine-containing polymers |
| 05/25/2005 | CN1618909A Novel slurry for chemical mechanical polishing of metals |
| 05/25/2005 | CN1618821A Latex used for phospho lipid modified floor polishing agent |
| 05/25/2005 | CN1203529C Polishing compound for chemimachanical polishing and method for polishing substrate |
| 05/24/2005 | US6896825 Oxidizing agent for a metal and a dissolving agent, first and second film forming agents |
| 05/24/2005 | US6896710 Abrasives for CMP applications |
| 05/24/2005 | US6896591 Mixed-abrasive polishing composition and method for using the same |
| 05/24/2005 | US6896590 CMP slurry and method for manufacturing a semiconductor device |
| 05/19/2005 | US20050106874 Method of manufacturing a semiconductor device |
| 05/19/2005 | US20050104048 Compositions and methods for polishing copper |
| 05/19/2005 | US20050103743 Slurry and use thereof for polishing |
| 05/18/2005 | CN1616575A 抛光组合物 The polishing composition |
| 05/18/2005 | CN1616574A High-rate barrier polishing composition |
| 05/18/2005 | CN1616573A Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 05/18/2005 | CN1616572A Nano polishing liquid for sulfuric compound phase changing material chemical mechanical polishing and its use |
| 05/18/2005 | CN1616571A Barrier polishing fluid |
| 05/18/2005 | CN1616503A Emulsoid for water base floor polishing agent |
| 05/18/2005 | CN1202197C Cerium based abrasive material and method for evaluating cerium based abrasive material |
| 05/17/2005 | US6893477 Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry |
| 05/17/2005 | US6893476 Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal |
| 05/12/2005 | WO2005042828A2 Stabilized body care products, household products, textiles and fabrics |
| 05/12/2005 | WO2005042658A1 Abrasive-free che.mical mechanical polishing composition and polishing process containing same |
| 05/12/2005 | US20050100666 Aerosol method and apparatus, coated particulate products, and electronic devices made therefrom |
| 05/12/2005 | US20050098764 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity |
| 05/12/2005 | US20050098758 applying slurries comprising carrier fluids, particles, etchants and surfactants, to the surfaces of glass, ceramic, metal or alloy substrates use in data storage, then rubbing with pads |
| 05/12/2005 | US20050097988 Generating an aerosol including a nickel metal precursor and moving the droplets through a heating zone to form nickel particles; while in the aerosol stream forming a coating on the particles, the coating comprising a material is different than the nickel-containing material; flat panel displays |
| 05/12/2005 | US20050097825 For polishing semiconductor wafers comprising tantalum barrier material in presence of dielectric and interconnect metal; comprises triazole and/or tetrazole compounds as promoters |
| 05/12/2005 | DE10342826B3 Dispersion von pyrogen hergestelltem Ceroxid Dispersion of fumed ceria |
| 05/11/2005 | EP1530232A2 Process solutions containing surfactants used as post-chemical mechanical planarization treatment |
| 05/11/2005 | CN1613941A Polishing composition |
| 05/11/2005 | CN1613607A Polishing kit for magnetic disk |
| 05/11/2005 | CN1200984C Slurry material for polishing |
| 05/10/2005 | US6890643 Floor polishing composition |
| 05/05/2005 | US20050095860 Abrasive liquid for metal and method for polishing |
| 05/05/2005 | US20050092962 Abrasives for copper CMP and methods for making |
| 05/04/2005 | CN1200066C Polishing composition |
| 05/03/2005 | US6887566 Ceria composition and process for preparing same |
| 05/03/2005 | US6887289 Hydroxylation of cerium, lanthanum and neodymium salts, then oxidizing in air to form metal oxides used in chemical mechanical polishing of substrates |
| 05/03/2005 | US6887137 Chemical mechanical polishing slurry and chemical mechanical polishing method using the same |
| 04/28/2005 | US20050090109 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
| 04/28/2005 | US20050090106 Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/28/2005 | US20050090104 Slurry compositions for chemical mechanical polishing of copper and barrier films |
| 04/27/2005 | EP1526163A1 Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/27/2005 | EP1525280A1 Aqueous resin dispersion for floors, and floor polish using same |
| 04/27/2005 | CN1610963A Polishing fluid and polishing method |
| 04/27/2005 | CN1610730A Alkali metal-containing polishing system and method |
| 04/27/2005 | CN1610578A Viscosity modification of petroleum distillates |
| 04/27/2005 | CN1610072A Method of second step polishing in copper CMP with a polishing fluid containing no oxidizing agent |
| 04/27/2005 | CN1609156A Composition for polishing semiconductor layers |
| 04/27/2005 | CN1609155A Polishing composition for semiconductor wafers |
| 04/26/2005 | US6884338 Etching by using a bis(perfluoroalkanesulfonyl) imide acids or a tris(perfluoroalkanesulfonyl) methide, having acidity properties, providing smooth surface |
| 04/26/2005 | US6884144 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 04/21/2005 | WO2005035688A1 Abrasive for chemical mechanical polishing and method for producing the same |
| 04/21/2005 | WO2005035678A1 Chemical-mechanical polishing (cmp) slurry and method of planarizing surfaces |
| 04/21/2005 | WO2005035677A1 Chemical-mechanical polishing (cmp) slurry and method of planarizing computer memory disk surfaces |
| 04/21/2005 | US20050085168 Cerium oxide abrasive and method of polishing substrates |
| 04/21/2005 | US20050085166 Process for chemical-mechanical polishing of metal substrates |
| 04/21/2005 | US20050081998 Chemical-mechanical planarization slurries and powders and methods for using same |
| 04/21/2005 | US20050081885 Contacting the substrate with a process solution of surfactants; reducing the number of defects in the manufacture of semiconductor devices; reducting dynamic surface tension while minimizing foaming |
| 04/20/2005 | CN1608116A Methods for planarization of metal-containing surfaces using halogens and halides salts |
| 04/20/2005 | CN1607067A Planarization system and method using a carbonate containing fluid |
| 04/20/2005 | CN1197930C Polishing fluid composition |
| 04/19/2005 | US6881757 Aerosol biliquid foam |
| 04/19/2005 | US6881674 Abrasives for chemical mechanical polishing |
| 04/14/2005 | WO2005034226A1 Metal polishing composition |
| 04/14/2005 | WO2005033234A2 Novel slurry for chemical mechanical polishing of metals |
| 04/14/2005 | US20050079804 Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions |
| 04/14/2005 | US20050079803 Chemical-mechanical planarization composition having PVNO and associated method for use |
| 04/14/2005 | US20050079718 Chemical-mechanical planarization composition with nitrogen containing polymer and method for use |
| 04/14/2005 | US20050079709 Planarization system and method using a carbonate containing fluid |
| 04/14/2005 | US20050079349 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase particles for use in manufacturing electrically-conductive metallic films for electronic products |
| 04/14/2005 | US20050076582 water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and cost of dry milling; use in dentifrices |
| 04/14/2005 | US20050076581 Particulate or particle-bound chelating agents |
| 04/14/2005 | US20050076580 Acidic aqueous slurry comprising silica abrasive particles, oxidizer (hydrogen peroxide), quaternary ammonium hydroxide, phosphoric acid, and water; semiconductors; integrated circuits; photolithography; chemical mechanical polishing |
| 04/14/2005 | US20050076579 Bicine/tricine containing composition and method for chemical-mechanical planarization |
| 04/14/2005 | US20050076578 Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole |
| 04/13/2005 | EP1522565A2 Polishing composition and use thereof |
| 04/13/2005 | CN1196760C Method for polishing or planarizing substrate |
| 04/13/2005 | CN1196759C Process for preparation of metal oxide slurry adaptable to chemical-mechanical polishing of semiconductor |
| 04/07/2005 | WO2005031836A1 Polishing composition and polishing method |
| 04/07/2005 | WO2005031226A1 Method and apparatus for combining food particles and ice cream |
| 04/07/2005 | US20050075052 Method and system for planarizing integrated circuit material |
| 04/07/2005 | US20050074975 Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces |
| 04/07/2005 | US20050074967 Polishing method |
| 04/07/2005 | US20050074610 Hydrocarbon feedstock is mixed with water; heated in presence of a catalyst to form a methane-enriched pre-reformate product |
| 04/07/2005 | US20050072524 System for the preferential removal of silicon oxide |
| 04/07/2005 | US20050072054 Safe for nickel phosphide, glass and/or ceramic materials; polishing efficiency, uniformity, removal rate; minimizing defects; includes purified sodium containing clays |
| 04/07/2005 | CA2526160A1 Method and apparatus for combining food particles and ice cream |
| 04/06/2005 | EP1520894A1 Barrier polishing fluid |
| 04/06/2005 | EP1520893A1 High-rate barrier polishing composition |
| 04/06/2005 | EP1520892A2 Polishing composition |
| 04/06/2005 | CN1603377A Composition for decontaminating and glazing automobile housing and method for preparing same |
| 04/06/2005 | CN1603063A Method for preparing anode copper ball and apparatus thereof |
| 04/06/2005 | CN1195896C Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
| 04/05/2005 | US6875834 Two-component coating composition and method of preparation |
| 04/05/2005 | US6875372 Fine particle size; monodispersion; crystal structure |
| 03/31/2005 | WO2005029563A1 Polishing composition for silicon wafer and polishing method |
| 03/31/2005 | US20050070211 Barrier polishing fluid |