Patents for C09G 1 - Polishing compositions (7,846)
07/2005
07/07/2005US20050148187 Chemical mechanical polishing systems and methods for their use
07/07/2005US20050148186 Slurry composition with high planarity and CMP process of dielectric film using the same
07/07/2005US20050148185 Polishing cloth and method of manufacturing semiconductor device
07/07/2005US20050148182 Compositions for planarization of metal-containing surfaces using halogens and halide salts
07/07/2005US20050147752 Small particle size, narrow size distribution and a spherical morphology; spray pyrolysis
07/07/2005US20050145507 Amines, amides, carboxylate, dicarboxylate or tri-carboxylate groups containing chelating agents, a substituted or unsubstituted benzotriazole or a polymeric corrosion resistance agent, sodium hydroxide or ammonium hydroxide as pH adjuster, a solvent
07/07/2005DE10357683A1 UV-Absorber enthaltende Autopflegemittel Comprising UV absorbers car care products
07/06/2005EP1349700A4 Method of making optical fluoride laser crystal components
07/06/2005CN1636270A Methods for planarization of group VIII metal-containing surfaces using oxidizing gases
07/06/2005CN1635940A 抛光组合物 The polishing composition
07/06/2005CN1209431C Method for polishing a memory or rigid disk with an amino acid-containing composition
07/06/2005CN1209430C Chemical mechanical polishing systems and methods for their use
07/06/2005CN1209429C CMP composition containing silane modified abrasive particles
07/06/2005CN1209392C Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups
07/05/2005US6914001 A CMP oxide slurry includes an aqueous solution containing abrasive particles and two or more different passivation agents. Preferably, the aqueous solution is made up of deionized water, and the abrasive particles are a metal oxide
07/05/2005US6913634 Abrasives for copper CMP and methods for making
07/05/2005CA2152467C Neutral hard surface cleaning composition
06/2005
06/30/2005WO2005058543A1 Method of electrochemical chemical mechanical planarization process
06/30/2005US20050139803 polishes comprising alumina, colloidal silica, anoxidizing agents, water succinic acid and citric or malic acid, used for polishing magnetic disc heads
06/30/2005US20050139120 Auto care compositions with UV absorbers
06/30/2005US20050139119 Polishing composition
06/29/2005EP1548095A1 Cleaning agent and cleaning method for ridding titanium and titanium alloy building materials of discoloration
06/29/2005EP1548076A1 Compositions and methods for low downforce pressure polishing of copper
06/29/2005EP1548075A2 Compositons and methods for barrier removal
06/29/2005CN1633698A Chemical-mechanical polishing slurry and method
06/29/2005CN1633486A Process for chemical-mechanical polishing of metal substrates
06/29/2005CN1632023A Sulphurs phase-change material chemically machinery polished non-abrasive polishing liquid and its use
06/29/2005CN1632022A Aqueous buffing oil with shell/core structure
06/28/2005US6911393 Slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication
06/28/2005US6910952 Polishing composition
06/23/2005WO2005056709A2 Silica-free surface abrasion compositions and their uses
06/23/2005WO2005056662A2 Cleaning and polishing wax composition
06/23/2005US20050137335 Two-component coating composition and method of preparation
06/23/2005US20050136807 Polishing composition for magnetic disk
06/23/2005US20050136805 Polishing solution and method of polishing nonferrous metal materials
06/23/2005US20050136803 Mixture of silicon dioxide, an acid, and water for polishing glass, magnetic disc
06/23/2005US20050136673 CMP slurry
06/23/2005US20050136671 Compositions and methods for low downforce pressure polishing of copper
06/23/2005US20050136670 Compositions and methods for controlled polishing of copper
06/23/2005US20050136669 Slurry for color photoresist planarization
06/23/2005US20050132660 Polishing composition
06/23/2005US20050132659 Aluminum oxide particles
06/23/2005CA2549392A1 Silica-free surface abrasion compositions and their uses
06/22/2005EP1544901A1 Polishing compound composition, method for producing same and polishing method
06/22/2005EP1543084A2 Process for reducing dishing and erosion during chemical mechanical planarization
06/22/2005CN1630697A Anionic abrasive particles treated with positively charged polyelectrolytes for cmp
06/22/2005CN1630696A Hydrophilizing wax composition
06/22/2005CN1630045A Compositions and methods for barrier removal
06/22/2005CN1629238A Compositions and methods for polishing copper
06/21/2005US6909193 Abrasive of precipitated silica, an oxidizer of ammonium persulfate, a corrosion inhibitor of barium and a buffer system; ph of 8-11.5
06/16/2005WO2005053904A1 Method of abrading a workpiece
06/16/2005US20050130428 Slurry compositions and CMP methods using the same
06/16/2005US20050127318 Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
06/16/2005US20050126080 Semiconductor polishing compound, process for its production and polishing method
06/15/2005EP1542266A1 Semiconductor abrasive, process for producing the same and method of polishing
06/15/2005EP1541653A1 High selectivity colloidal silica slurry
06/15/2005EP1541652A1 Automotive cleaning and protectant compositions containing UV light absorbers
06/15/2005CN1626600A Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/15/2005CN1626599A 抛光组合物和抛光方法 Polishing composition and polishing method
06/15/2005CN1626567A Polishing compound for chemimachanical polishing and method for polishing substrate
06/15/2005CN1206281C Iwitterionic siloxane polymers and ionically cross-linked polymers formed therefrom
06/14/2005US6906109 Providing preformed colloidal silica particles having a surface area, adding an alkali metal silicate and a cation exchange resin to produce a quantity of feed silica at feed rate which is less than nucleation rate
06/14/2005US6905632 Powder of pyrogenically produced silicon dioxide doped with 0.01 and 3 wt. % aluminium oxide having an average particle diameter of not more than 0.1 mu m.
06/10/2005CA2485405A1 Auto care compositions with uv absorber
06/09/2005US20050121969 Lubricant for wafer polishing using a fixed abrasive pad
06/08/2005CN1624098A Anhydrous cleaning agent
06/07/2005US6903019 CMP process leaving no residual oxide layer or slurry particles
06/07/2005US6902591 Aqueous solution of abrasive and acids; reducing viscosity
06/07/2005US6902590 Chemical mechanical polishing compositions and methods relating thereto
06/02/2005WO2005049749A1 Scratch removal composition and method
06/02/2005US20050118824 Multi-step chemical mechanical polishing of a gate area in a FinFET
06/02/2005US20050118821 Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/02/2005US20050118820 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
06/02/2005US20050118819 Post-CMP treating liquid and method for manufacturing semiconductor device
06/02/2005US20050116369 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/01/2005EP1536461A1 Polishing agent composition for insulating film for semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit
06/01/2005EP1535979A2 Compositions and methods for chemical mechanical polishing silica and silicon nitride
06/01/2005EP1535978A1 Polishing cloth and method of manufacturing semiconductor device
06/01/2005EP1534795A2 Method for chemical mechanical polishing (cmp) of low-k dielectric materials
06/01/2005CN1622985A 钨抛光溶液 Tungsten polishing solution
06/01/2005CN1622290A Polishing cloth and method of manufacturing semiconductor device
06/01/2005CN1621470A Glazing liquid for dry cleaning for automobile and its producing method
06/01/2005CN1621469A Chemically mechanical polishing solution
06/01/2005CN1204602C Abrasive liquid for metal and method for polishing
06/01/2005CN1204237C Fibrous grinding-wheel grinding liquid and its use
06/01/2005CN1204218C Polishing composition for producing memory hard disk and polishing method
05/2005
05/31/2005US6899821 Mixture of oxidizer and film forming agent
05/31/2005US6899804 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
05/31/2005US6899596 Chemical mechanical polishing of dual orientation polycrystalline materials
05/26/2005WO2005047410A1 Polishing composition and polishing method
05/26/2005WO2005047409A1 Polishing composition and polishing method
05/26/2005US20050113005 Method of abrading a workpiece
05/26/2005US20050113000 High selectivity colloidal silica slurry
05/26/2005US20050112895 Method of chemical-mechanical polishing
05/26/2005US20050112894 CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method
05/26/2005US20050112892 Chemical mechanical abrasive slurry and method of using the same
05/26/2005US20050109980 Polishing composition for CMP having abrasive particles
05/26/2005US20050108949 A specific surfactant, a silicon oxide, a carboxylic acid or alpha-amino acid, a corrosion inhibitor, an oxidant, and water; decreased dishing
05/26/2005US20050108947 An acidic aqueous solution of a quaternary C1 to C6 (cyclo)alkylammonium hydroxide, phthalic acid and monopotassium phthalate, polyacrylic acid, and an abraisive; improved selectivity in shallow trench isolation processes
05/25/2005EP1533352A1 Compositions and methods for polishing copper
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