Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
08/2005
08/31/2005CN1216953C Polishing composition for metal CMP and method of polishing susbstroote
08/30/2005US6936543 CMP method utilizing amphiphilic nonionic surfactants
08/30/2005US6936542 Polishing slurries for copper and associated materials
08/30/2005US6936541 Method for planarizing metal interconnects
08/30/2005US6935928 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
08/30/2005US6935540 Dispenser assembly for a fragrance or personal care bottle and a method of assembling same
08/25/2005WO2005076801A2 Polishing composition
08/25/2005WO2004039905A8 Composition for polishing metal, polishing method for metal layer, and production method for wafer
08/24/2005EP1566421A2 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate.
08/24/2005EP1566420A1 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
08/24/2005EP1274807B1 Polishing agent and method for producing planar layers
08/24/2005CN1659688A Polishing fluid and method of polishing
08/24/2005CN1659252A Metal oxide powder for high precision polishing and method of preparation thereof
08/24/2005CN1659249A Method for chemical mechanical polishing (cmp) of low-k dielectric materials
08/24/2005CN1216410C Abrasives for chemical mechanical polishing
08/24/2005CN1216116C Paste composition of free abrasive and abrading method using same
08/24/2005CN1216112C Polishing composition and polishing method for its use
08/23/2005US6932860 Wax emulsion
08/18/2005WO2005075590A1 Finishing compositions with reduced volatile organic compounds
08/18/2005US20050181609 Polishing fluid and polishing method
08/18/2005US20050178742 Compositions and methods for rapidly removing overfilled substrates
08/18/2005CA2553347A1 Finishing compositions with reduced volatile organic compounds
08/17/2005EP1564797A1 Polishing composition and rinsing composition
08/17/2005EP1563026A1 Aerosol biliquid foam
08/17/2005EP1563025A1 Wipes impregnated with biliquid foam treating liquids
08/17/2005EP1141154B1 Polishing composition and method
08/16/2005US6930080 Wipes impregnated with biliquid foam treating liquids
08/16/2005US6930054 Slurry composition for use in chemical mechanical polishing of metal wiring
08/11/2005US20050176253 Method of manufacturing semiconductor device
08/11/2005US20050176250 Polishig fluid for metallic films and method for producing semiconductor substrate using the same
08/11/2005US20050173670 Slurry for polishing copper film and method for polishing copper film using the same
08/11/2005US20050173669 Polishing fluid and method of polishing
08/11/2005US20050172564 Polishing compound
08/10/2005EP1562228A2 Chemical mechanical polishing process for low dishing of metal lines in semiconductor wafer fabrication
08/10/2005EP1560890A1 Apparatus and method for replacing a media content item
08/10/2005EP1560771A2 Dispenser assembly for a fragrance or personal care bottle and a method of assembling same
08/10/2005CN1652297A Method of manufacturing semiconductor device
08/10/2005CN1651535A Grinding oil used for storage hard disk magnetic head superfine grinding
08/10/2005CN1651420A Dehydro methyl abietate furazan derivative, its synthesis method and use
08/04/2005WO2005071032A2 Floor finish composition, laminates, and methods for treating floors
08/04/2005WO2005071031A1 Polishing system comprising a highly branched polymer
08/04/2005WO2005071030A2 Floor finish with lightening agent
08/04/2005WO2005070563A1 Jobsite-renewable multilayer floor finish with enhanced hardening rate
08/04/2005US20050166797 Wet look; comprising a film former and white pigment; to avoid yellowing, to avoid hiding the underlying flooring and to permit multiple layers to be applied over time
08/04/2005US20050166464 substantially free of non-volatile silicone materials and includes a mixture of abrasive particles and an emulsion which includes water, a volatile siloxane, and a lubricant
08/04/2005CA2551574A1 Floor finish composition, laminates, and methods for treating floors
08/03/2005EP1559762A2 Chemical mechanical polishing slurry useful for copper substrates
08/03/2005EP1559693A2 Precious metal composition and luster composition for direct and indirect screen printing
08/03/2005EP1558689A1 Biliquid foam furniture polish
08/03/2005EP1558688A1 Composition for polishing metal, polishing method for metal layer, and production method for wafer
08/03/2005EP1272579B1 Method for polishing a memory or rigid disk with an amino acid-containing composition
08/03/2005CN1650403A Polishing fluid and polishing method
08/03/2005CN1648191A Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
08/03/2005CN1213118C Polishing slurry for disk base sheet of memory hard disk
08/02/2005US6924227 Slurry for chemical mechanical polishing and method of manufacturing semiconductor device
07/2005
07/28/2005WO2005068572A2 Chemical-mechanical polishing of metals in an oxidized form
07/28/2005WO2005068360A2 Nanocarbon fullerenes (ncf), method for producing ncf and use of the latter in the form of nanocompounds
07/28/2005US20050164510 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
07/28/2005DE10392703T5 Metalloxidpulver für Hochpräzisionspolieren und ein Verfahren zur Herstellung desselben Metal oxide powders for high-precision polishing, and a method of manufacturing the same
07/27/2005CN1646651A Methanol-containing silica-based CMP compositions
07/27/2005CN1646650A Free radical-forming activator attached to solid and used to enhance CMP formulations
07/27/2005CN1646649A Method and composition for polishing a substrate
07/27/2005CN1644644A Compositions and methods for low downforce pressure polishing of copper
07/27/2005CN1644640A Compositions and methods for controlled polishing of copper
07/21/2005WO2005066325A2 Cleaner compositions containing free radical quenchers
07/21/2005US20050159088 Method for polishing hard surfaces
07/21/2005US20050159085 Method of chemically mechanically polishing substrates
07/21/2005US20050159003 Chemical mechanical polishing compositions and methods relating thereto
07/21/2005US20050155515 Cleaning and polishing wax composition
07/21/2005US20050155296 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
07/20/2005EP1554357A1 Polishing slurry and polished substrate
07/20/2005CN1640974A 抛光组合物和抛光方法 Polishing composition and polishing method
07/20/2005CN1211448C Compositions for and methods for reducing/eliminating scratches and defects in silicon dioxide CMP process
07/19/2005US6918938 For reducing surface defects of magnetic disks
07/19/2005US6918820 Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
07/14/2005WO2005042828A3 Stabilized body care products, household products, textiles and fabrics
07/14/2005US20050154109 Floor finish with lightening agent
07/14/2005US20050154108 Floor finish with lightening agent
07/14/2005US20050154107 inclusion of an appropriate amount of a lightness-inducing pigment in a transparent or translucent jobsite-renewable floor finish can impart to the floor a cleaner and more desirable perceived appearance
07/14/2005US20050154084 Floor finish with lightening agent
07/14/2005US20050153560 Performing first and second polishing steps, polishing mixtures used in first and second steps include ceria abrasives of different grain concentrations; polishing rate being changed between steps; dishing is prevented
07/14/2005US20050153144 Contain polyaminoamide; storage stability
07/14/2005US20050153141 Carbonate initiate hardening of the coatings and decrease the coating tack-free time; improved floor finishes
07/14/2005US20050153140 Jobsite-renewable multilayer floor finish with enhanced hardening rate
07/14/2005US20050150598 Polymer with a degree of branching of at least 50% and a polishing pad and/or an abrasive, for use in chemical-mechanical polishing
07/14/2005US20050150173 Methanol-silica interaction adds colloidal stability to the chemical mechanical polishing (CMP) formulation; acidic pH
07/14/2005DE102004017335A1 Edelmetallpräparate und Lüsterpräparate für den direkten und indireketen Siebdruck Precious metal products and luster preparations for direct screen printing and indireketen
07/13/2005CN1639847A Polishing composition and method for forming wiring structure using the same
07/13/2005CN1639288A CMP formulations for the use on nickel-phosphorus alloys
07/13/2005CN1637110A High selectivity colloidal silica slurry
07/13/2005CN1637102A Slurry compositions and CMP methods using the same
07/13/2005CN1637101A 抛光组合物和抛光方法 Polishing composition and polishing method
07/13/2005CN1637100A Compositions and methods for chemical mechanical polishing silica and silicon nitride
07/13/2005CN1637096A Noble metal preparations and lustring preparations for direct and indirect screen printing
07/12/2005US6916742 Modular barrier removal polishing slurry
07/07/2005US20050148491 Copolymer of (meth)acrylic ester containing perfluorinated alkylaminosulfonyl group and (meth)acrylated polyoxyethylene or ethylene oxide-propylene oxide copolymer; pavement markings; optical coating on glass beads; lower cost than perfluoroctyl analogs, less tendency to bioaccumulate
07/07/2005US20050148483 Combination cleaning and waxing composition and method
07/07/2005US20050148481 Cleaning agent and cleaning method for ridding titanium and titanium alloy building materials of discoloration
07/07/2005US20050148291 Silicon dioxide, alkaline compound and water; fine finishing glass substrates; easy removal after use; recording media
07/07/2005US20050148290 Chemical-mechanical polishing of metals in an oxidized form
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