Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
10/2005
10/20/2005WO2005097917A1 Fluorochemical free aqueous coating compositions and methods of use thereof
10/20/2005US20050233680 Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces
10/20/2005US20050233578 Method and composition for polishing a substrate
10/20/2005US20050233157 Device and system for coating a surface
10/19/2005EP1586614A1 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
10/19/2005CN2734754Y Easily-burnished leather nursing membrane sheet
10/19/2005CN1683465A Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
10/19/2005CN1683462A Nano shoe polish
10/18/2005US6955586 chemical mechanical polishing (CMP); improved flexibility/processing window; for semiconductors
10/13/2005WO2005095675A1 Water-based metal treatment composition
10/13/2005US20050227491 Methods of forming integrated circuit devices having polished tungsten metal layers therein
10/13/2005US20050227451 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
10/13/2005DE102005006614A1 Zusammensetzungen und Verfahren für das chemisch-mechanische Polieren von Siliciumdioxid und Siliciumnitrid Compositions and methods for chemical mechanical polishing of silicon dioxide and silicon nitride
10/13/2005CA2559989A1 Water-based metal treatment composition
10/12/2005EP1485439A4 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
10/12/2005CN1682354A Polishing compound composition, method for producing same and polishing method
10/12/2005CN1680511A Abrasive liquid for metal and method for polishing
10/12/2005CN1680510A Ceria slurry for polishing semiconductor thin layer
10/12/2005CN1680509A Polishing composition
10/11/2005US6953500 Carnauba wax for protecting surfaces via providing ionically neutral ingredients adhering to the surface while repelling dirt
10/11/2005US6953389 for planarizing metal layers on integrated circuit substrates using chemical-mechanical polishing techniques
10/06/2005WO2005093805A1 Composition for polishing semiconductor
10/06/2005WO2005093804A1 Composition for polishing semiconductor
10/06/2005WO2005093803A1 Composition for polishing semiconductor
10/06/2005WO2005093802A1 Composition for polishing semiconductor
10/06/2005US20050222322 Aqueous resin dispersion for floors, and floor polish using same
10/06/2005US20050221726 Abrasive with an average particle size of 1 to 30 nm and water and having a packing ratio of from 79 to 90% by weight; suitable for precision parts including such as magnetic recording media, photomask substrates, optical disks, lenses, mirrors, and prisms, and semiconductor substrates
10/06/2005US20050218117 Chemically assisted surface finishing process
10/06/2005US20050218010 Chelating agents, corrosion inhibitors, a suppresor, a solvent, a passivating polymer, and inorganic acid based electrolyte; minimal damage to the substrate during planarization; microelectronics
10/06/2005DE102005012608A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
10/05/2005CN1679145A Polishing agent composition for insulating film for semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit
10/05/2005CN1678708A Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
10/05/2005CN1676566A Abrasives and compositions for chemical mechanical planarization of tungsten and titanium
10/05/2005CN1676563A Compositions and methods for chemical mechanical planarization of tungsten and titanium
10/04/2005US6951695 Lapping, mechanical polishing, and reducing internal stress of a gallium, aluminum and indium nitride wafer by thermal annealing or chemical etching; crystallographic plane surfaces
09/2005
09/29/2005WO2005090511A1 Polishing composition and polishing method
09/29/2005WO2004033574A8 Cmp method utilizing amphiphilic non-ionic surfactants
09/29/2005US20050215678 Fluorochemical free aqueous coating compositions and methods of use thereof
09/29/2005US20050215183 Chemical-mechanical planarization composition having PVNO and associated method for use
09/29/2005US20050215177 CMC porous pad with component-filled pores
09/29/2005US20050215060 Polishing composition and polishing method
09/29/2005US20050214191 Improving metal removal while suppressing dielectric layer removal; dispersing concentrated fumed silica into acidified water and diluting
09/29/2005US20050211953 Polishing slurries and methods for chemical mechanical polishing
09/29/2005US20050211952 Compositions and methods for chemical mechanical planarization of tungsten and titanium
09/29/2005US20050211951 Compositions and methods for polishing copper
09/29/2005US20050211950 Chemical-mechanical polishing composition and method for using the same
09/28/2005EP1580802A1 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
09/28/2005EP1580248A1 Polishing composition and polishing method
09/28/2005EP1580247A1 Polishing composition and polishing method
09/28/2005EP1580243A1 Polishing composition and polishing method
09/28/2005CN1675331A CMP abrasive and substrate polishing method
09/28/2005CN1675327A Process for reducing dishing and erosion during chemical mechanical planarization
09/28/2005CN1673306A Polishing composition
09/28/2005CN1220742C Use of CsOH in dielectric CMP slurry
09/27/2005CA2380748C Abrasive grain with improved projectability
09/22/2005US20050208883 Polishing composition
09/22/2005US20050208882 Ceria slurry for polishing semiconductor thin layer
09/22/2005US20050208761 Polishing composition and polishing method
09/22/2005US20050205837 Polishing composition and polishing method
09/22/2005US20050205523 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers
09/22/2005US20050205522 Chemical mechanical polishing; carbonyl derivative of benzotriazole forms a protective film on the surface of the metal layer; hydrogen peroxide, buffer, amine; etching agent includes hydrofluoric acid; micro processing step for semiconductor device
09/22/2005US20050204639 Polishing composition and polishing method
09/22/2005US20050204638 Polishing composition and polishing method
09/22/2005US20050204637 Polishing composition and polishing method
09/21/2005EP1577357A1 Polishing composition and polishing method
09/21/2005CN1672246A Semiconductor polishing compound, process for its production and polishing method
09/21/2005CN1671813A Aqueous resin dispersion for floors, and floor polish using same
09/21/2005CN1670117A 抛光组合物及抛光方法 Polishing composition and polishing method
09/21/2005CN1670116A Polishing composition and polishing method
09/21/2005CN1670115A Polishing composition and polishing method
09/21/2005CN1670099A Polishing agent composition for wooden floor and furnitures maintenance
09/20/2005US6946010 water-insoluble abrasive polishing agents suspended in an aqueous medium in combination, which avoids the need and cost of dry milling; use in dentifrices
09/20/2005US6946009 Cerium-based abrasive material and abrasive material slurry, and method for producing cerium based abrasive material
09/20/2005US6945851 CMP formulations
09/20/2005CA2319107C Optical polishing formulation
09/15/2005US20050202670 Polishing compound for insulating film for semiconductor integrated circuit and method for producing semiconductor integrated circuit
09/15/2005US20050199589 Aminoacetic acid, oxidizer, and water
09/15/2005US20050198913 cerium oxide as a core, coated with a coating layer of an inorganic silicon compound except hydroxide and an inorganic aluminum compound except hydroxide; for polishing glass
09/14/2005EP1572821A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
09/14/2005EP1572820A1 Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
09/14/2005EP1337601A4 Slurry for chemical-mechanical polishing copper damascene structures
09/14/2005EP1327258A4 Chemical-mechanical polishing slurry and method
09/14/2005CN1667076A Polishing solution and method of polishing nonferrous metal materials
09/08/2005US20050194565 Polishing compound, its production process and polishing method
09/08/2005US20050194563 Selective for removal of copper in relation to tantalum and dielectric materials whilst minimizing local dishing and erosion effects
09/07/2005EP1570916A1 Long-term general-purpose water repellant
09/07/2005EP1570512A1 Slurry composition for secondary polishing of silicon wafer
09/07/2005EP1570015A2 Passivative chemical mechanical polishing composition for copper film planarization
09/07/2005EP1354017A4 Ready-to-use stable chemical-mechanical polishing slurries
09/07/2005EP1341864A4 Method for making abrasive compositions and products thereof
09/07/2005CN1218004C Hard Surface treating agent, stain-proofing agent and method for surface treatment
09/06/2005US6939211 Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
09/06/2005CA2368266C Oxide powder and manufacturing method therefor and product utilizing th e powder
09/01/2005US20050191823 Polishing composition and polishing method
09/01/2005US20050189517 includes phosphors having a small particle size, narrow particle size distribution, spherical morphology and good crystallinity; utilized in cathode ray tube (CRT) screens for televisions and similar devices
09/01/2005US20050189322 Compositions and methods for chemical mechanical polishing silica and silicon nitride
08/2005
08/31/2005EP1568746A1 Polishing composition and polishing method
08/31/2005EP1567606A1 A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces
08/31/2005CN1660951A 抛光组合物和抛光方法 Polishing composition and polishing method
08/31/2005CN1660923A Compositions and methods for chemical mechanical polishing silica and silicon nitride
1 ... 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 ... 79