Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09G - Polishing compositions other than french polish; Ski waxes › C09G 1 - Polishing compositions
Patents for C09G 1 - Polishing compositions (7,846)
12/2005
12/29/2005WO2005071030A3 Floor finish with lightening agent
12/29/2005US20050288411 Aqueous compositions with polyvalent metal ions and dispersed polymers
12/29/2005US20050287931 Polishing slurry and polished substrate
12/28/2005EP1610367A2 Cerium oxide abrasiveand method of polishing substrates
12/28/2005EP1609830A1 Aqueous compositions with polyvalent metal ions and dispersed polymers
12/28/2005EP1328596B1 Polish compositions
12/28/2005CN1714432A Slurry composition for secondary polishing of silicon wafer
12/27/2005US6979650 Fabrication method of semiconductor integrated circuit device
12/27/2005US6979252 Low defectivity product slurry for CMP and associated production method
12/22/2005US20050282471 Chemical mechanical polishing slurry useful for tunsten/titanium substrate
12/22/2005US20050282391 Method of polishing a tungsten-containing substrate
12/22/2005US20050282390 Polishing composition for semiconductor wafers
12/22/2005US20050282387 Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
12/22/2005US20050279964 Chemical mechanical polishing slurry for polishing copper layer on a wafer
12/22/2005US20050279733 CMP composition for improved oxide removal rate
12/22/2005US20050279030 Chemical mechanical polishing (CMP); for use on nickel/phosphorus alloys; contains abrasive particles, oxidant, oxidant modifier, and accelerants to sequester removed materials containing phosphonate and ammonium or amine groups
12/21/2005EP1606218A1 Pyrogenic silicon dioxide powder and dispersion thereof
12/21/2005CN1711626A Polishing composition and rinsing composition
12/21/2005CN1711216A High concentration silica slurry
12/20/2005US6976905 Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
12/20/2005US6976904 Chemical mechanical polishing slurry
12/15/2005WO2005118736A1 Electrochemical-mechanical polishing composition and method for using the same
12/15/2005WO2005118732A1 Floor finish with lightening agent
12/15/2005WO2004101702A9 Ceria abrasive for cmp
12/15/2005US20050277718 For treating hard substrates; provide desirable repellency, antisoiling and anti-staining properties to the substrates
12/15/2005US20050277367 Chemical-mechanical polishing (CMP) slurry containing clay and CeO2 abrasive particles and method of planarizing surfaces
12/15/2005US20050274080 Polishing composition
12/15/2005CA2566229A1 Floor finish with lightening agent
12/14/2005EP1590505A4 Composition and method for copper chemical mechanical planarization
12/14/2005EP0852615B1 Chemical mechanical polishing composition and process
12/14/2005CN1708565A Composition for polishing metal, polishing method for metal layer, and production method for wafer
12/13/2005US6974777 CMP compositions for low-k dielectric materials
12/08/2005WO2005071032A3 Floor finish composition, laminates, and methods for treating floors
12/08/2005US20050271570 Cerium-based abrasive and production process thereof
12/08/2005US20050269295 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate
12/07/2005EP1602697A1 Hydrophilizing agent composition and process for formation of hydrophilic protective films
12/07/2005EP1601735A1 Method of polishing a silicon-containing dielectric
12/07/2005EP1601734A1 Self-shining aerosol-type shoe polish composition
12/07/2005CN1705733A Slurry for chemical-mechanical polishing copper damascene structures
12/07/2005CN1705725A Corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces
12/07/2005CN1230486C Cerium oxide slurry, and method of mfg. substrate
12/07/2005CN1230481C Polishing composition of magnetic disk substrate and polishing method using said composition
12/07/2005CN1230480C Polishing composition and polishing method of substrate for memory and hard disk
12/07/2005CN1230479C Surface treatment agent for wood floor material and mfg. method thereof
12/06/2005US6972096 Chemical-mechanical polishing process
12/01/2005US20050266689 Chemical mechanical polishing composition and process
12/01/2005US20050266688 Semiconductor device fabrication method
12/01/2005US20050263490 Method of passivating chemical mechanical polishing compositions for copper film planarization processes
12/01/2005US20050263407 Electrochemical-mechanical polishing composition and method for using the same
12/01/2005US20050262966 Generating an aerosol including a liquid comprising a nickel precursor and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy
11/2005
11/30/2005EP1599555A2 Cmp composition comprising a sulfonic acid and a method for polishing noble metals
11/30/2005CN1702135A Industrialized production of crosslinking type environment protection automobile polishing agent
11/24/2005WO2005110679A1 Composition for polishing
11/24/2005US20050258139 Polishing method to reduce dishing of tungsten on a dielectric
11/24/2005DE102004020230A1 Zusammesetzung für das Chemisch-Mechanische Polieren (CMP) Present constituted for the Chemical-Mechanical Polishing (CMP)
11/24/2005DE102004020213A1 Zusammensetzung für das Chemisch-Mechanische Polieren (CMP) Composition for chemical-mechanical polishing (CMP)
11/23/2005EP1597328A2 Modular barrier removal polishing slurry
11/23/2005EP1098948B1 Chemical mechanical polishing slurry useful for copper/tantalum substrate
11/17/2005WO2005109481A1 Polishing composition and substrate polishing method
11/17/2005WO2005109480A1 Polishing slurry
11/17/2005WO2005108538A2 Rheologically stabilized silicone dispersions
11/17/2005WO2004101221A3 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
11/17/2005US20050255693 Passivative chemical mechanical polishing composition for copper film planarization
11/17/2005US20050255252 Applying protective silicone polydimethylsiloxane coating to glass windows, automobile/truck windshields, and glass mirrors to repel human fibers, dust and silica based dirt
11/17/2005US20050252092 Wherein the number of large polishing particles among the polishing particles is controlled depending on a solid load of the slurry and sizes of the polishing particles; high selectivity in terms of a polishing speed of an oxide layer to that of a nitride layer
11/17/2005CA2565666A1 Rheologically stabilized silicone dispersions
11/16/2005EP1594934A2 Mixed-abrasive polishing composition and method for using the same
11/16/2005EP1117744B1 Composition for abradable and/or scratchable surfaces
11/16/2005CN1696235A Barrier polishing solution
11/15/2005US6964923 Selective polishing with slurries containing polyelectrolytes
11/15/2005US6964600 High selectivity colloidal silica slurry
11/10/2005US20050250668 Aqueous dispersions of silicone fluids for cleaning, preserving, protecting, and otherwise treating a variety of surfaces, including household surfaces, such as floors, counter tops, furniture, walls, and automotive surfaces, like tires, rubber, vinyl, upholstery, fabric, plastic and general elastomers
11/10/2005US20050250329 Compositions for chemical mechanical planarization of tantalum and tantalum nitride
11/10/2005DE102005016554A1 Polierlösung für Barrieren Polishing solution for barriers
11/09/2005EP1485440A4 Free radical-forming activator attached to solid and used to enhance cmp formulations
11/09/2005CN1693406A Polishing composition and polishing method
11/09/2005CN1226370C Wooden floor and furniture curing agent and its prepn.
11/09/2005CN1226115C Glass polishing material without using grinding paste using method
11/03/2005WO2005104205A1 Composition for chemo-mechanical polishing (cmp)
11/03/2005WO2005102932A1 Composition for chemo-mechanical polishing (cmp)
11/03/2005WO2004031455A3 Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures
11/03/2005DE102005012607A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
11/02/2005EP1590505A2 Composition and method for copper chemical mechanical planarization
11/02/2005EP1590421A2 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
11/02/2005EP1590413A1 Selective barrier metal polishing solution
10/2005
10/27/2005WO2005101474A1 Metal polishing liquid and polishing method using it
10/27/2005WO2005100615A1 Balsams for treating leather
10/27/2005WO2005100497A1 Cmp porous pad with component-filled pores
10/27/2005WO2005100496A2 Chemical-mechanical polishing composition and method for using the same
10/27/2005WO2005099388A2 Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive
10/27/2005US20050239382 Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
10/27/2005US20050239381 Silica-free surface abrasion compositions and their uses
10/27/2005US20050239379 Miracle Sand, a process that removes paint runs, orange peel and other flaws from latex paint, lacquer and other coatings with the use of Miracle Sand and a sanding sponge
10/27/2005US20050236601 Barrier polishing solution
10/27/2005DE102004016600A1 Dispersion zum chemisch-mechanischen Polieren von Metalloberflächen enthaltend Metalloxidpartikel und ein kationisches Polymer Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
10/26/2005EP1242557B1 Method of polishing or planarizing a substrate
10/26/2005CN1688665A Apparatus and method for replacing a media content item
10/26/2005CN1687272A Preservative agent for shining leather and stone
10/25/2005CA2163671C Magnetorheological polishing devices and methods
10/20/2005WO2005097930A2 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
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